Search Results - "Fuchs, P.F."

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  1. 1

    Comparison of steady-state and transient thermal conductivity testing methods using different industrial rubber compounds by Kerschbaumer, R.C., Stieger, S., Gschwandl, M., Hutterer, T., Fasching, M., Lechner, B., Meinhart, L., Hildenbrandt, J., Schrittesser, B., Fuchs, P.F., Berger, G.R., Friesenbichler, W.

    Published in Polymer testing (01-12-2019)
    “…Reliable material data, especially of the thermal conductivity as a function of temperature, are crucial for the virtual optimization of the rubber injection…”
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    Journal Article
  2. 2

    Functional mechanical metamaterial with independently tunable stiffness in the three spatial directions by Fleisch, M., Thalhamer, A., Meier, G., Raguž, I., Fuchs, P.F., Pinter, G., Schlögl, S., Berer, M.

    Published in Materials today advances (01-09-2021)
    “…Mechanical metamaterials with variable stiffness recently gained a lot of research interest, as they allow for structures with complex boundary and load…”
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    Journal Article
  3. 3

    Elastic load coupling with tailored elastomer composites by Mansouri, M.R., Fuchs, P.F.

    Published in Composites. Part C, Open access (01-03-2021)
    “…This study identifies a unique performance benefit in flexible composite laminates through evaluation of the load-coupling potentials once an external stimulus…”
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    Journal Article
  4. 4

    Matrix–fiber interfacial debonding in soft composite materials: Cyclically behavior modeling and microstructural evolution by Mansouri, M.R., Fuchs, P.F., Baghani, M., Schuecker, C.

    Published in Composites. Part B, Engineering (15-05-2022)
    “…It is apparent from the literature that the matrix–fiber mechanical interaction, as a result of interfacial adhesive bonds at the interface, significantly…”
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    Journal Article
  5. 5

    Quantifying matrix-fiber mechanical interactions in hyperelastic materials by Mansouri, M.R., Beter, J., Fuchs, P.F., Schrittesser, B., Pinter, G.

    “…•The matrix-fiber mechanical interactions are quantified using a combined experimental, analytical, and simulation study.•A comprehensive set of experimental…”
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    Journal Article
  6. 6

    The contribution of mechanical interactions to the constitutive modeling of fiber-reinforced elastomers by Mansouri, M.R., Fuchs, P.F., Criscione, J.C., Schrittesser, B., Beter, J.

    Published in European journal of mechanics, A, Solids (01-01-2021)
    “…Hyperelastic fiber-reinforced materials are conventionally modeled based on the contributions of their constituent materials. A unified invariant-base…”
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  7. 7

    Determination of the orthotropic material properties of individual layers of printed circuit boards by Fuchs, P.F., Pinter, G., Tonjec, M.

    Published in Microelectronics and reliability (01-11-2012)
    “…To improve the reliability of printed circuit boards (PCBs), occurring failure modes have to be studied and analysed. In order to reduce the expenses of…”
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  8. 8

    Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads by P.F. Fuchs, Z. Major

    Published in Frattura ed integritá strutturale (01-04-2013)
    “…The reliability of printed circuit boards under dynamic loads is a key issue in the handheld electronic products industry. In order to predict the performance…”
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    Journal Article
  9. 9

    Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads by P.F. Fuchs, Z. Major

    Published in Frattura ed integritá strutturale (01-04-2013)
    “…The reliability of printed circuit boards under dynamic loads is a key issue in the handheld electronic products industry. In order to predict the performance…”
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    Journal Article
  10. 10

    PCB drop test lifetime assessment based on simulations and cyclic bend tests by Fuchs, P.F., Pinter, G., Major, Z.

    Published in Microelectronics and reliability (01-05-2013)
    “…The aim of this work was to predict the performance of printed circuit boards (PCBs) in a board level drop test (BLDT). The applied methodology was based on…”
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    Journal Article
  11. 11

    Method development for the cyclic characterization of thin copper layers for PCB applications by Fellner, K., Fuchs, P.F., Pinter, G., Antretter, T., Krivec, T.

    Published in Circuit world (01-01-2014)
    “…Purpose – The overall aim of this research work was the improvement of the failure behavior of printed circuit boards (PCBs). In order to describe the…”
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  12. 12

    Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads by Fuchs, P.F., Major, Z.

    Published in Frattura ed integritá strutturale (01-01-2011)
    “…The reliability of printed circuit boards under dynamic loads is a key issue in the handheld electronic products industry. In order to predict the performance…”
    Get full text
    Journal Article