Search Results - "Frye, Asa"

Insights into the Tribological Characteristic of Cu-Based Coatings Under Extreme Contact Conditions by Stoyanov, Pantcho, Harrington, Kelly M., Frye, Asa

“…The purpose of this study was to investigate the influence of solid lubricants on the friction and wear behavior of Cu-based thermal-sprayed coatings. The…”
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Tribological insights of Co- and Ni-based alloys in extreme conditions by Harrington, Kelly M., Miller, Elizabeth C., Frye, Asa, Stoyanov, Pantcho

“…The purpose of this study was to investigate the friction and wear behavior of Co- and Ni-based materials under low and high temperature environmental…”
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Crystallographic texture and whiskers in electrodeposited tin films : Tin whiskers by FRYE, Asa, GALYON, George T, PALMER, Larry

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Crystallographic Texture and Whiskers in Electrodeposited Tin Films by Frye, A., Galyon, G.T., Palmer, L.

“…Electron back scatter diffraction (EBSD) analysis was used to determine texture for electrodeposited tin films, and the results were compared to standard X-ray…”
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Defect-induced electrical/optical properties of SrTiO(3-x) (001) by photo-assisted tunneling spectroscopy by Frye, Asa

“…The (001) surface of monocrystalline strontium titanate is used in a variety of commercial applications as an active substrate or electrode and therefore…”
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Defect-induced electrical/optical properties of SrTiO(3-x) (001) by photo-assisted tunneling spectroscopy by Frye, Asa

“…The (001) surface of monocrystalline strontium titanate is used in a variety of commercial applications as an active substrate or electrode and therefore…”
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Selective co growth on Cu for void-free via fill by Jun-Fei Zheng, Chen, Philip, Baum, Tomas H., Lieten, Ruben R., Hunks, William, Lippy, Steven, Frye, Asa, Weimin Li, O'Neill, James, Xu, Jeff, Zhu, John, Bao, Jerry, Machkaoutsan, Vladimir, Badaroglu, Mustafa, Yeap, Geoffrey, Murdoch, Gayle, Bommels, Jurgen, Tokei, Zsolt

“…We report for the first time a highly selective CVD Co deposition on Cu to fill a 45nm diameter 3:1 aspect ratio via in a Cu dual damascene structure. We have…”
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Implementation of Robust Nickel Alloy Salicide Process for High-Performance 65nm SOI CMOS Manufacturing by Strane, J., Brown, D., Lavoie, C., Suenaga, J., Haran, B., Press, P., Besser, P., Flaitz, P., Gribelyuk, M., Kammler, T., Peidous, I., Huajie Chen, Waidmann, S., Frye, A., DeHaven, P., Domenicucci, A., Murray, C., Knarr, R., Engelmann, H.J., Streck, C., Kahlert, V., Deshpande, S., Leobandung, E., Pellerin, J., Jagannathan, J.

“…Addition of Pt to Ni silicide produces a robust [Ni x Pt (1-x) ]Si, which shows an improved morphological stability, an important reduction in encroachment…”
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