SmartPrint Single-Mode Flexible Polymer Optical Interconnect for High Density Integrated Photonics

This paper reports on the demonstration of a single-mode flexible polymer optical interconnect for efficiently and conveniently connecting integrated photonics chips to one another (chip-to-chip) and to optical printed circuit boards (chip-to-board). The interconnect uses a low-loss partially fluori...

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Bibliographic Details
Published in:	Journal of lightwave technology Vol. 40; no. 12; pp. 3839 - 3844
Main Authors:	Jiang, L., Nishant, A., Frish, J., Kleine, T. S., Brusberg, L., Himmelhuber, R., Kim, K.-J., Pyun, J., Pau, S., Norwood, R. A., Koch, T. L.
Format:	Journal Article
Language:	English
Published:	New York IEEE 15-06-2022 The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects:	Alignment Bends Chip scale packaging Circuit boards Fluoropolymers Insertion loss integrated optics Ion exchange Optical fibers Optical films Optical interconnections Optical interconnects optical polymer Optical variables control Optical waveguides Photonics polymer films Polymers Refractive index Refractivity silicon photonics Waveguides
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Summary:	This paper reports on the demonstration of a single-mode flexible polymer optical interconnect for efficiently and conveniently connecting integrated photonics chips to one another (chip-to-chip) and to optical printed circuit boards (chip-to-board). The interconnect uses a low-loss partially fluorinated refractive index contrast (RIC) polymer, referred to as poly(F-SBOC), that provides for direct patterning of the desired refractive index profiles into a slab waveguide consisting of poly(F-SBOC) and a flexible fluoropolymer film (Tefzel). Using a maskless lithography system, interconnects consisting of s-bends and tapers can be printed in situ into the poly(F-SBOC) material with no need for mechanical alignment. We demonstrate the efficacy of this approach by connecting two separate ion-exchange (IOX) glass waveguide chips, achieving fiber-to-fiber total insertion losses below 6dB in some cases, through the use of grayscale tapers that are written directly into the poly(F-SBOC) material.
ISSN:	0733-8724 1558-2213
DOI:	10.1109/JLT.2022.3149872