Search Results - "Frigge, S."

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  1. 1

    Transient thermal behavior in a new RTP chamber by Tillmann, A., Kreiser, U., Munzinger, P., Frigge, S., Buschbaum, S., Schmid, P., Loeffelmacher, D., Merkwitz, M., Theilig, T.

    Published in Journal of electronic materials (01-12-1998)
    “…The transient thermal behavior of 200 and 300 mm wafers in a new rapid thermal processing (RTP) chamber is investigated. The AST3000 is a new RTP tool to meet…”
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    Journal Article
  2. 2

    Physical aspects of particle deposition in RTP by Schmid, P., Frigge, S., Huelsmann, Th, Nadig, B., Nenyei, Z., Reisdorf, R.

    “…Advanced-logic and DRAM technology for the 90 nm node and beyond results in increasingly stringent particle specifications. Particles can be transported to the…”
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    Conference Proceeding
  3. 3

    Influence of RTP flash anneal ramp rates on lithography overlay performance on 300 mm integrated wafers by Storbeck, O., Ganz, D., Stadmuller, M., Frigge, S., Lerch, W., Graef, D., Obermeier, G.

    “…The influence of RTP with high ramp rates on lithography overlay distortion was investigated in this work using sub-quarter-micron technology on 300 mm wafers…”
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    Conference Proceeding