Search Results - "Frémont, Hélène"

Source Separation Using Sensor's Frequency Response: Theory and Practice on Carbon Nanotubes Sensors by Quelennec, Aurore, Duchesne, Éric, Frémont, Hélène, Drouin, Dominique

“…Nowadays, there is an increased demand in integrated sensors for electronic devices. Multi-functional sensors provide the same amount of data using fewer…”
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Moisture absorption and desorption in epoxy mould compounds: Characterization of Fickian and non-Fickian behaviours in complex packages by Tomas, Ariane, Frémont, Hélène, Malbert, Nathalie, Neffati, Mehdy, Lambert, Benoit

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Search for copper diffusion at hybrid bonding interface through chemical and electrical characterizations by Jourdon, Joris, Lhostis, Sandrine, Moreau, Stéphane, Lamontagne, Patrick, Frémont, Hélène

“…Cu/SiO2 diffusion at hybrid bonding interface without diffusion barrier was investigated in order to validate the electrical insulation of interconnects. The…”
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Investigation into Cu diffusion at the Cu/SiO2 hybrid bonding interface of 3D stacked integrated circuits by Ayoub, Bassel, Lhostis, Sandrine, Moreau, Stéphane, Mattei, Jean-Gabriel, Mukhtarov, Anna, Frémont, Hélène

“…Reliability concerns are often risen for the hybrid bonding integration due to a potential misalignment in the bonding step leading that Cu directly faces…”
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Investigating the degradation mechanisms of moisture on the reliability of integrated low-k stack by Mischler, Léo, Cartailler, Vivien, Imbert, Grégory, Duchamp, Geneviève, Frémont, Hélène

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Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging by Roumanille, Pierre, Ben Romdhane, Emna, Pin, Samuel, Nguyen, Patrick, Delétage, Jean-Yves, Guédon-Gracia, Alexandrine, Frémont, Hélène

“…The present work aims at investigating how the BGA solder fatigue life in thermal cycling is affected by prior isothermal aging. The Weibull distributions of…”
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Proceedings of the 28th European Symposium on the reliability of electron devices, failure physics and analysis by Labat, Nathalie, Marc, François, Frémont, Hélène, Bafleur, Marise

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In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration by Ayoub, Bassel, Moreau, Stéphane, Lhostis, Sandrine, Frémont, Hélène, Mermoz, Sébastien, Souchier, Emeline, Deloffre, Emilie, Escoubas, Stéphanie, Cornelius, Thomas W., Thomas, Olivier

“…Hybrid bonding is a very promising 3D packaging technology which allows extremely high interconnect density between electronic chips. In its most advanced…”
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Moisture diffusion in plasma-enhanced chemical vapor deposition dielectrics characterized with three techniques under clean room conditions by Cartailler, Vivien, Imbert, Grégory, Rochat, Névine, Chaton, Catherine, Vo-Thanh, Du, Benoit, Daniel, Duchamp, Geneviève, Frémont, Hélène

“…•Mass, stress and infrared spectroscopy monitoring yield similar diffusion coefficient.•Moisture uptake can be significant even at clean room conditions for…”
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High temperature ageing of microelectronics assemblies with SAC solder joints by Sabbah, Wissam, Bondue, Pierre, Avino-Salvado, Oriol, Buttay, Cyril, Frémont, Hélène, Guédon-Gracia, Alexandrine, Morel, Hervé

“…In some applications, electronic systems are expected to operate at high ambient temperature (e.g. 150°C). In this paper, we investigate the failure mechanism…”
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Virtual prototyping in a Design-for-Reliability approach by Barnat, Samed, Guédon-Gracia, Alexandrine, Frémont, Hélène

“…The main purpose of the paper is to present a methodological approach combining experiments and simulations for virtual prototyping in a Design-for-Reliability…”
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To avoid dropout: let student teach! Second act by Fremont, Helene, Arnal, Florent

“…In an IUT, "Institut Universitaire de Technologie" students are trained to become technicians after 2 years of study. Due to different reasons, the background…”
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Methodology of backside preparation applied on a MRAM to lead a logical investigation with a near-field probe by Dumas, Louise, Villeneuve-Faure, Christina, Marc, François, Fremont, Hélène, Guerin, Christophe, Bascoul, Guillaume

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Evaluation of Hybrid Bonding Interface Quality by Contact Resistivity Measurement by Jourdon, Joris, Lhostis, Sandrine, Moreau, Stephane, Bresson, Nicolas, Salome, Pascal, Fremont, Helene

“…With the rise of hybrid bonding as a solution for fine pitch 3-D integration, new methods are required to evaluate the bonding quality at a wafer level…”
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Heat dissipation measurement in flip-chip package using microfabricated temperature sensors on lid by Guedon, Arsene, Bouguerra, Nizar, Paradis, Etienne, Duchesne, Eric, Allard, Stephanie, Fremont, Helene, Drouin, Dominique

“…Resistance Temperature Detectors (RTD) were intricately microfabricated onto a lid, presenting a pioneering approach to improve Junction-to-Case thermal…”
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RC delay mitigation for sub 700 nm hybrid bonding pitch by Lhostis, Sandrine, Ayoub, Bassel, Fremont, Helene, Moreau, Stephane, Mermoz, Sebastien, Deloffre, Emilie, Souchier, Emeline, Cacho, Maria Gabriela Gusmao, Aybeke, Ece, Lamontagne, Patrick, Rey, Christelle, Tournier, Arnaud

“…Hybrid bonding is one of the most scalable 3D integration methods allowing very high interconnect density. The bonding pitch reduction leads to an increase in…”
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Dynamic void formation in a DD-copper-structure with different metallization geometry by Weide-Zaage, Kirsten, Dalleau, David, Danto, Yves, Fremont, Helene

“…In this study the degradation phenomena in dual-damascene copper (DD-Cu) metallizations will be investigated due to high current densities and substrate…”
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Smart Packaging - Microscopic Temperature and Moisture Sensors Embedded in a Flip-Chip Package by Quelennec, Aurore, Frémont, Hélène, Duchesne, Éric, Ayadi, Yosri, Vandier, Quentin, Drouin, Dominique

“…The interest in very-large-scale integration technology combined with market pressure to reduce materials and process costs introduce new packaging yield and…”
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Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength by Barnat, Samed, Frémont, Hélène, Gracia, Alexandrine, Cadalen, Eric

“…With the onset of ultra-compact packages, systems in package may include stacked dies and mechanical sensors. Thus the thinning of silicon becomes necessary…”
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Smart Packaging: A Micro-Sensor Array Integrated to a Flip-Chip Package to Investigate the Effect of Humidity in Microelectronics Package by Quelennec, Aurore, Frémont, Hélène, Shafique, Umar, Drouin, Dominique, Duchesne, Éric

“…Lifetime reliability of electronics package is important for long term operation of microelectronic devices. Humidity, temperature and resulting strain are…”
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