Search Results - "Foggiato, John"
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Optimizing the formation of nickel silicide
Published in Materials science & engineering. B, Solid-state materials for advanced technology (15-12-2004)“…The formation processes for nickel silicide are assessed to determine limitations of using the silicide for sub-65 nanometer technologies. Various aspects of…”
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Journal Article -
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Role of new materials in enhancing productivity of semiconductor manufacturing equipment
Published in 2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (01-05-2009)“…A variety of new materials and improvements on currently used materials is given to show how the manufacturing productivity of semiconductor equipment is…”
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Conference Proceeding
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3
Millisecond flash annealing: Applications for USJ formation and optimization of device electrical characteristics
Published in Materials science & engineering. B, Solid-state materials for advanced technology (05-12-2005)“…To form ultra shallow junctions (USJs) several fast annealing techniques are available with very high temperatures to activate dopants yet minimize diffusion…”
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Journal Article -
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Etching Mechanisms of Fluoroelastomer Seals and Performance Characteristics
Published in 2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (01-05-2008)“…In this paper, we report on seal performance and degradation mechanisms under a range of plasma processing conditions for several fluoroelastomer materials…”
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Conference Proceeding -
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New Elastomer Materials Provide Enhanced Longevity and Sealing Performance for Semiconductor Manufacturing Equipment
Published in 2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (01-05-2008)“…A review of materials and optimization of seal designs is given emphasizing performance enhancement of manufacturing equipment. Various attributes are…”
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Conference Proceeding -
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Optimization of semiconductor manufacturing equipment seals for enhanced performance
Published in 2007 International Symposium on Semiconductor Manufacturing (01-10-2007)“…A review of materials and optimization of seal designs is given with emphasis on the requirements for semiconductor manufacturing equipment. Various attributes…”
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Conference Proceeding -
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Design of a hot wall-based low temperature annealing system and its process applications
Published in 12th IEEE International Conference on Advanced Thermal Processing of Semiconductors, 2004. RTP 2004 (2004)“…A hot wall-based low temperature annealing system using resistively heated, stacked hot plates was designed and tested for low temperature (100~500degC)…”
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Conference Proceeding