Search Results - "Fleig, Patrick F"

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  1. 1

    Investigation of precision, accuracy and confidence of X‐ray diffraction for determining crystallite size in nanopowders by Moore, Alexander P., Nemer, Martin B., Rodriguez, Mark A., Roberts, Christine C., Fleig, Patrick F., Papenguth, Hans W.

    Published in Journal of applied crystallography (01-06-2021)
    “…X‐ray diffraction (XRD) is often utilized as a method of determining bulk sample crystallite size in powder characterization. While it is generally accepted…”
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    Journal Article
  2. 2

    High-resolution integration of passives using micro-contact printing (μCP) by Lakeman, Charles D.E, Fleig, Patrick F

    Published in Microelectronics international (01-04-2003)
    “…As the number of passive components in electronic circuits increases, new methods for fabricating passives are under development to optimize utilization of…”
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    Journal Article
  3. 3

    Sol–gel derived, nanostructured oxide lubricant coatings by Taylor, Douglas J., Fleig, Patrick F., Schwab, Stuart T., Page, Richard A.

    Published in Surface & coatings technology (01-11-1999)
    “…A number of studies have shown that the introduction of lubricious solid films, especially metal oxides, can improve elevated temperature tribological…”
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    Journal Article
  4. 4

    Highresolution integration of passives using microcontact printing CP by Lakeman, Charles D.E., Fleig, Patrick F.

    Published in Microelectronics international (01-04-2003)
    “…As the number of passive components in electronic circuits increases, new methods for fabricating passives are under development to optimize utilization of…”
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    Journal Article
  5. 5

    Combining energy harvesting and power management for a complete wireless sensor power solution by Lakeman, Charles D.E., Fleig, Patrick F., Trainor, John T., Fuge, Mark A.

    “…Wireless sensors provide solutions to otherwise intractable problems where it is impractical to deploy wired sensors. One of the biggest challenges facing…”
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    Conference Proceeding
  6. 6

    High-resolution integration of passives using micro-contact printing ((mu)CP) by Lakeman, Charles D E, Fleig, Patrick F

    Published in Microelectronics international (01-01-2003)
    “…As the number of passive components in electronic circuits increases, new methods for fabricating passives are under development to optimize utilization of…”
    Get full text
    Journal Article