Search Results - "Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003"

Improvement on thermal performance of a disk-shaped miniature heat pipe with nanofluid by Hsin-Tang Chien, Chien-In Tsai, Ping-Hei Chen, Po-Yeh Chen

“…The present study used nanofluid as the working medium for a disk-shaped miniature heat pipe (DMHP). The nanofluid is a suspension with gold nanoparticles of…”
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Laser bonding and packaging of plastic microfluidic chips by Jianjun Lai, Xiqu Chen, Xuefang Wang, Xinjian Yi, Sheng Liu

“…Plastics-based microfluidic and other microanalytical platforms have a great potential in bioMEMS applications, because many plastics are low cost and…”
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Comparison of isothermal mechanical fatigue properties of lead free solder joints and bulk solders by Andersson, C., Zonghe Lai, Johan Liu, Hairong Jiang, Yongning Yu

“…Low cycle isothermal mechanical fatigue testing of both bulk solders and solder joints of eutectic Sn-37wt%Pb and Sn-3.5wt%Ag and Sn-4.0wt%Ag-0.5wt%Cu were…”
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A study of metallization processing ceramic package by Xia Qingshui, Tu Chuanzheng, Cheng Kai, Wang Luning, Fan Zheng Liang

“…This paper introduces the metallization process in ceramic package and discusses some important factors in the process…”
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Non-hermetic opto-electronic packaging based on micro-machined silicon bench platform by Sheng Liu, Zhiyin Gan, Xiansong Chen, Jianbin Zhaol, Hou Bin

“…Non-hermetic opto-electronic packaging, coupled with passive coupling, provides the direction for reducing the cost of automating packaging and assembly…”
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Dancing with bumping by Fei-Jain Wu

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Solder ball joints: voiding, qualification and mechanical issues by Collier, T.

“…Solder ball failure can be caused by a number of technicalities. The three common root causes that lead to package failure are inadequate qualification,…”
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The delamination of solder ball involving moisture and thermal effect in IC package by Jun Wang, Fei Xiao

“…The difference of CTE leads to stress concentration at the interface in the package. The underfill material is wildly used for reducing the mismatch of CTE in…”
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Unique new packaging of semiconductor packaging technology high performation by encapsulation epoxy resin and VPES (vacuum printing encapsulation systems) by Okuno, A.

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Research and development of electronic packaging technology in Taiwan by Shen-Li Fu, Rong-Shen Lee, Chen, T.

“…The research and development of electronic packaging technology in Taiwan are introduced. Basic researches are mostly conducted by university professors, and…”
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New anisotropic conductive film (ACF) by Yokoyama, A., Maehara, K., Takagi, K.

“…Asahikasei has originally developed the new conductive powder AMG/sup R/ which has a specific structure mainly composed of copper and a small amount of silver,…”
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The study on pad of AlN multilayer cofire ceramic substrate by Hu Yongda, Jiang Ming, Yang Bangchao, Zhang Hao, Cui Song, Zhang Jingguo

“…Aluminum nitride (AlN) has been considered as a material for ceramic packages in the semiconductor industry toward higher speed, power dissipation and…”
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Effect of the texture of indium on its mechanical properties by Yudong Liu, Guohai Chen, Qianqian Li, Jusheng Ma

“…The mechanics properties of indium bumps connecting optoelectric device is critical to the reliability: Bumps after welding have a very low shear strength, and…”
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Semicon Packaging Industry at Sanja Group

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3M tribo-coating development and its application on microinterconnect flexible circuit by Ke Zhang, Juang Meng Mok, Choong Meng, H., Yong Peng Lee

“…To develop a conductive polymer formulation which can be printed using an automated reel-to-reel process to form a thin film (0.1 to 25 /spl mu/m) on…”
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Recent developments of direct bonded copper (DBC) substrates for power modules by Schulz-Harder, J., Exel, K.

“…DBC substrates are the standard circuit boards for power modules. Using DBC technology, thick copper foils (0.125 mm-0.7 mm) are cladded to alumina or aluminum…”
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New proposed adhesive tape application mechanism for stacking die applications by Cheung, Y.M., Chong, A.C.M.

“…One approach to develop a high-density electronic package for memory modules is stacking the dice in the packaging and assembly processes. The development of…”
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A performance prediction model for a piezoresistive transducer pressure sensor by Xu Song, Sheng Liu

“…The performance of a piezoresistive transducer pressure sensor to thermal and pressure environments can be predicted by the finite element method. A simplified…”
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Parallel gap bonding mechanism of joint formation for thin-film metallization by Chenxi Wang, Chunqing Wang

“…A parallel gap bonding mechanism for joint formation of Ni/NiCr joints was described in this paper. A 2D thermal conduction model was proposed-to calculate the…”
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RF SiP technology innovation through integration by Jianhua Wu, Anderson, M.J., Coller, D., Guth, G.

“…System-in-package (SiP) products have been growing rapidly in recent years as an alternative to system-on-chip (SoC) products. As a packaging technology…”
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