Search Results - "Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium"
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1
Thermally conductive aluminium nitride-filled epoxy resin (for electronic packaging)
Published in Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (1989)“…The thermal conductivity and the relative permittivity of an AlN particulate-filled epoxy resin have been investigated as a function of the volume loading…”
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2
Thermal characteristics of buried resistors
Published in Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (1989)“…Finite-element modeling and experiments using an infrared camera were carried out to determine the temperature distribution and hence the power rating of…”
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3
Parametric study of a VLSI plastic package using locally refined finite element models
Published in Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (1989)“…The authors present a parametric study of thermal stresses in plastic packages that are induced during the die attachment and encapsulation fabrication steps…”
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4
Mixing enhancement in flow past rectangular cavities as a result of periodically pulsed fluid motion
Published in Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (1989)“…Periodic elimination of the shear layer separating the mainstream and recirculatory regions in flow through a multicavity channel is possible by imposing a…”
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5
Thermal evaluations of 144 pin plastic flat packs
Published in Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (1989)“…Experimental thermal evaluation procedures and results for 144-pin plastic flat packs soldered on a circuit board are presented. The board is positioned at the…”
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6
Uniform temperature, ultrahigh flux heat sinks using curved surface subcooled nucleate boiling
Published in Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (1989)“…A novel type of heat exchange process is described for use in semiconductor heat sinks. It involves the use of subcooled, nucleate boiling at concave curved…”
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7
Thermal modeling and experimental techniques for microwave bipolar devices
Published in Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (1989)“…Many thermal issues facing the microwave bipolar industry are discussed, and the application of experimental and modeling techniques is demonstrated for real…”
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8
Prediction of electronic component temperatures at high altitude using low altitude measurements
Published in Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (1989)“…Analytical predictions of developing-flow, forced-air-cooled electronic component temperatures at high altitudes using near-sea-level temperature measurements…”
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9
A novel circuit for the evaluation of thermal impedance characteristics of MOS integrated circuits
Published in Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (1989)“…The MOS thermal impedance test circuit (MOST) is a simple device for evaluating thermal impedance values using the electrical test method. Results are…”
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10
A DC technique for determining GaAs MESFET thermal resistance
Published in Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (1989)“…A novel DC electrical method (DCEM) is described for measuring the thermal resistance of GaAs MESFETs using the temperature dependence of the gate metal…”
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11
Thermal studies of finned LSI packages under forced convection
Published in Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (1989)“…A description is given of extensive computer-based analytical and experimental studies on finned LSI packages, utilizing a cavity-down-type QFP (quad flat…”
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12
An integration algorithm for the temperature solution of the four-layer infinite plate structure
Published in Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (1989)“…An algorithm is presented for the effective and accurate integration of the temperature solution of a four-layer plate structure with infinite lateral…”
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13
Problem solving techniques in electronic cooling
Published in Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (1989)“…The goal of this study is to provide a general approach to the solution of problems confronted in the cooling of electronic systems. A review is presented of…”
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14
High heat flux cooling for silicon-on-silicon packaging
Published in Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (1989)“…The authors report the first data on cooling of silicon substrates using pool boiling of Freon-12 and compare the results to liquid-jet impingement cooling of…”
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15
Quantification of thermal contact conductance in electronic packages
Published in Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (1989)“…Results of an investigation are presented in which a numerical technique was used to predict interface pressures. Combining these predicted pressures and the…”
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16
Surface mount plastic packages-an assessment of their thermal performance
Published in Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (1989)“…Thermal characteristics of surface mount (SM) plastic packages such as small-outline integrated circuit (SOIC) packages, plastic leaded chip carriers (PLCCs),…”
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17
Calibration procedure developed for IR surface-temperature measurements
Published in Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (1989)“…A calibration procedure is provided that improves the accuracy and precision of two-dimensional temperature measurement. An infrared (IR) microscope detects…”
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18
Thermal diagnostics of semiconductor devices
Published in Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (1989)“…The ideal of complex investigation of the thermal performance of semiconductor devices is presented. Production diagnostics using thermal characteristics for…”
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19
Free convection air cooling of the electronic equipment: still a miracle waiting to be explored and explained
Published in Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (1989)“…An experimental program was carried out to determine the temperature field created by uniform arrays of electronic devices mounted on a printed circuit board…”
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20
Two-dimensional heat flow in a GTO having a highly interdigitated emitter
Published in Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (1989)“…Thermal analogs of thyristors having the form of transmission lines are used routinely for calculating thermal phenomena, but they cannot be used for a…”
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