Search Results - "Fennessy, K.P."

Passive alignment optical subassemblies for military/aerospace fiber-optic transmitter/receiver modules by Beranek, M.W., Chan, E.Y., Chiu-Chao Chen, Davido, K.W., Hager, H.E., Chi-Shain Hong, Koshinz, D.G., Rassaian, M., Soares, H.P., St. Pierre, R.L., Anthony, P.j., Cappuzzo, M.A., Gates, J.V., Gomez, L.T., Henein, G.E., Shmulovich, J., Occhionero, M.A., Fennessy, K.P.

“…Under the DARPA sponsored Avionics Optoelectronic Module Technology program, new passive alignment carrier (PAC) optical subassemblies (LED-PAC and PIN-PAC)…”
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Cost-effective manufacturing of aluminium silicon carbide (AlSiC) electronic packages by Occhionero, M.A., Hay, R.A., Adams, R.W., Fennessy, K.P.

“…Current microelectronics places ever increasing demands on the performance of electronic packaging materials and systems in terms of thermal management,…”
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Passive alignment optical subassemblies for military/aerospace fiber-optic transmitter/receiver applications by Beranek, M.W., St. Pierre, R.L., Anthony, P.J., Cappuzzo, M.A., Gates, J.V., Gomez, L.T., Henein, G.E., Shmulovich, J., Occhionero, M.A., Fennessy, K.P., Chan, E.Y., Chen, C.C., Davido, K.W., Hager, H.E., Hong, C.S., Koshinz, D.G., Rassaian, M., Soares, H.P.

“…Under the DARPA sponsored Avionics Optoelectronic Module Technology program, Boeing, Lucent Technologies, and Ceramics Process Systems have collaboratively…”
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