Search Results - "Fen, Yong Puay"

3-D Modeling and Characterization for Die Attach Process by Bu, Lin, Ching, Wai Leong, Ling, Ho Siow, Rhee, Min Woo, Fen, Yong Puay

“…A new 3-D model for the die attach (DA) process is established and validated in this paper. With this model, the fluid flow characteristics of the DA process…”
Get full text

Copper wire bond reliability evaluation using a modular test chip by Trigg, A. D., Chai Tai Chong, Fen, S. Y. P., Kwee, J. L. T., Ming, C. C. H., Mung, S. C. S., Ping, C., Ganesh, V. P., Low, B., Chu, T. L., Leng, E. P.

“…The use of copper wire for wire bonding integrated circuits (ICs) has increased significantly in recent years, driven mainly by the dramatic increase in the…”
Get full text