Search Results - "Fellner, Klaus"

Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads by Fellner, Klaus, Antretter, Thomas, Fuchs, Peter F., Tao, Qi

“…Different Printed Circuit Board (PCB) designs were tested in an Interconnection Stress Test. In such a test, PCBs were subjected to temperature cycles…”
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Local damage simulations of printed circuit boards based on in-plane cohesive zone parameters by Filipp Fuchs, Peter, Fellner, Klaus, Pinter, Gerald

“…Purpose - The purpose of this paper is to analyse, in a finite element simulation, the failure of a multilayer printed circuit board (PCB), exposed to an…”
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Finite element analysis of arbitrarily complex electronic devices by Gschwandl, Mario, Fuchs, Peter, Fellner, Klaus, Antretter, Thomas, Krivec, Thomas, Tao Qi

“…The capability and the range of functions of electronic devices have strongly developed over the last decade, while their size has significantly decreased. At…”
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Determination of cyclic mechanical properties of thin copper layers for PCB applications by Fellner, Klaus, Fuchs, Peter F., Antretter, Thomas, Pinter, Gerald, Schongrundner, Ronald

“…The overall objective of this research work is the characterization of the mechanical behavior of Printed Circuit Boards (PCBs) under cyclic thermal loads. The…”
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Adhesion of printed circuit boards with bending and the effect of reflow cycles by Schongrundner, R., Cordill, M. J., Berger, J., Kruckl, H., Fellner, K., Krivec, T., Kurz, M., Fuchs, P. F., Maier, G. A.

“…During manufacturing and use printed circuit boards (PCB) are subjected to different mechanical and thermal loads. These loads can cause the PCBs to develop a…”
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