Search Results - "Farkas, Gabor"

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  1. 1

    Analytical Prediction of the Thermal Behavior of Semiconductor Power Devices from Room-Temperature I–V Measurements by Ress, Sandor, Farkas, Gabor, Rencz, Marta

    Published in Energies (Basel) (01-06-2024)
    “…The thermal characterization of power devices is an inevitable task in the industry. Thermal transient testing is one of the major tools for this…”
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    Journal Article
  2. 2

    On the Reproducibility of Thermal Measurements and of Related Thermal Metrics in Static and Transient Tests of Power Devices by Farkas, Gabor, Schweitzer, Dirk, Sarkany, Zoltan, Rencz, Marta

    Published in Energies (Basel) (2020)
    “…Traditionally the thermal behavior of power devices is characterized by temperature measurements at the junction and at accessible external points. In large…”
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    Journal Article
  3. 3

    Structural Analysis of Power Devices and Assemblies by Thermal Transient Measurements by Farkas, Gabor, Sarkany, Zoltan, Rencz, Marta

    Published in Energies (Basel) (2019)
    “…Power modules composed of semiconductor dice, thermal interface layers, and cooling mounts can be characterized by thermal transient testing at their actual…”
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    Journal Article
  4. 4

    Possibilities of using raster data in client‐side web maps by Farkas, Gábor

    Published in Transactions in GIS (01-02-2020)
    “…Companies and individual developers have recently put serious effort into improving web mapping libraries. A significant front in this development is…”
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    Journal Article
  5. 5

    Applicability of open-source web mapping libraries for building massive Web GIS clients by Farkas, Gábor

    Published in Journal of geographical systems (01-07-2017)
    “…The increasing capabilities of web browsers and the growing spread of JavaScript have an impact on the development of web-based GIS systems. While in…”
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    Journal Article
  6. 6

    Real-time data visualization of welding robot data and preparation for future of digital twin system by Magyar, Péter, Hegedűs-Kuti, János, Szőlősi, József, Farkas, Gábor

    Published in Scientific reports (03-05-2024)
    “…The application of industrial technologies is undergoing significant changes. Finding the level at which to use efficient cyberphysical systems is perhaps one…”
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    Journal Article
  7. 7

    Multi-Domain Modelling of LEDs for Supporting Virtual Prototyping of Luminaires by Poppe, András, Farkas, Gábor, Gaál, Lajos, Hantos, Gusztáv, Hegedüs, János, Rencz, Márta

    Published in Energies (Basel) (2019)
    “…This paper presents our approaches to chip level multi-domain LED (light emitting diode) modelling, targeting luminaire design in the Industry 4.0 era, to…”
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    Journal Article
  8. 8

    Activity release from damaged fuel during the Paks-2 cleaning tank incident in the spent fuel storage pool by Hózer, Zoltán, Szabó, Emese, Pintér, Tamás, Varjú, Ilona Baracska, Bujtás, Tibor, Farkas, Gábor, Vajda, Nóra

    Published in Journal of nuclear materials (01-07-2009)
    “…During crud removal operations the integrity of 30 fuel assemblies was lost at high temperature at the unit No. 2 of the Paks NPP. Part of the fission products…”
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    Journal Article
  9. 9
  10. 10

    Cyber‐physical‐based welding systems: Components and implementation strategies by Szőlősi, József, Magyar, Péter, Antal, József, Szekeres, Béla J., Farkas, Gábor, Andó, Mátyás

    Published in IET cyber-physical systems (01-05-2024)
    “…Abstract The conditions for a feasible Cyber‐Physical System (CPS) in a welding environment are explored for the manufacturing technology components while also…”
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    Journal Article
  11. 11

    The Buda Chronicles : The First Printed Book in Hungary: Printer, Work, Provenance, Patronage by Farkas, Farkas Gábor

    Published in Bibliofilia (01-01-2015)
    “…On Jun 5th, 1473 on the eve of Pentecost one of the happiest men in the Buda Royal Palace must have been Andreas Hess, a typographer of German origin who was…”
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    Journal Article
  12. 12

    Influence of Flood Waves, Production Wells, and Precipitation on Shallow Groundwater Using a Linear Regression Model Approach Based on a Case Study of Mohács Island, Hungary by Hervai, András, Farics, Éva, Sisák, István, Farkas, Gábor, Kovács, János, Lóczy, Dénes

    Published in Water (Basel) (01-05-2020)
    “…Studying the relationship between river water and shallow groundwater (SGW) during flood events is a research topic receiving increasing attention for many…”
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    Journal Article
  13. 13

    In-situ transient testing of thermal interface sheets and metal core boards in power switch assemblies by Farkas, Gabor, Zettner, Juergen, Sarkany, Zoltan, Rencz, Marta

    “…In power switch assemblies the heat is removed through laminate stacks containing thermal interface materials (TIM). Some information on a TIM layer quality…”
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    Conference Proceeding
  14. 14
  15. 15

    3D Scanning and Model Error Distribution-Based Characterisation of Welding Defects by Hegedűs-Kuti, János, Szőlősi, József, Varga, Dániel, Farkas, Gábor, Ruppert, Tamás, Abonyi, János, Andó, Mátyás

    “…The inspection of welded structures requires particular attention due to many aspects that define the quality of the product. Deciding on the suitability of…”
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    Journal Article
  16. 16

    Community prevalence of SARS-CoV-2 in England from April to November, 2020: results from the ONS Coronavirus Infection Survey by Pouwels, Koen B, House, Thomas, Pritchard, Emma, Robotham, Julie V, Birrell, Paul J, Gelman, Andrew, Vihta, Karina-Doris, Bowers, Nikola, Boreham, Ian, Thomas, Heledd, Bell, Iain, Bell, John I, Newton, John N, Farrar, Jeremy, Benton, Pete, Walker, Ann Sarah, Pouwels, Koen B., Crook, Derrick, Matthews, Philippa C., Peto, Tim, Pritchard, Emma, Stoesser, Nicole, Vihta, Karina-Doris, Howarth, Alison, Doherty, George, Kavanagh, James, Chau, Kevin K., Martins Ferreira, Lucas, Marsden, Brian D., Mongkolsapaya, Juthathip, Cornall, Richard, Stuart, David I., Screaton, Gavin, Bell, John, Cox, Stuart, Paddon, Kevin, James, Tim, House, Thomas, Newton, John N., Birrell, Paul, Sheppard, Tim, Athey, Graham, Moody, Dan, Curry, Leigh, Brereton, Pamela, Hay, Jodie, Vansteenhouse, Harper, Benton, Pete, Rourke, Emma, Henry, Sarah, Scruton, James, Stokes, Peter, Thomas, Tina, Allen, John, Black, Russell, Bovill, Heather, Braunholtz, David, Brown, Dominic, Collyer, Sarah, Crees, Megan, Daglish, Colin, Davies, Byron, Donnarumma, Hannah, Douglas-Mann, Julia, Felton, Antonio, Finselbach, Hannah, Fordham, Eleanor, Ipser, Alberta, Jenkins, Joe, Kent, Katherine, Kerai, Geeta, Lloyd, Lina, Masding, Victoria, Osborn, Ellie, Patel, Alpi, Pereira, Elizabeth, Pett, Tristan, Reeve, Donna, Shah, Palvi, Snook, Ruth, Studley, Ruth, Sutherland, Esther, Swinn, Eliza, Thomas, Heledd, Tudor, Anna, Weston, Joshua, Leib, Shayla, Tierney, James, Farkas, Gabor, Cobb, Raf, Compton, Lewis, Irving, James, Clarke, John, Mullis, Rachel, Ireland, Lorraine, Airimitoaie, Diana, Fisher, Sarah, Moore, Zoe, McLean, James, Kerby, Matt

    Published in The Lancet. Public health (01-01-2021)
    “…Decisions about the continued need for control measures to contain the spread of severe acute respiratory syndrome coronavirus 2 (SARS-CoV-2) rely on accurate…”
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    Journal Article
  17. 17

    Thermal transient characterization of semiconductor devices with programmed powering by Farkas, G.

    “…Thermal transient testing of semiconductor devices typically needs a well defined power level for heating and a proper data acquisition equipment for recording…”
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    Conference Proceeding
  18. 18

    Criticality analysis of purchased materials based on fuzzy signatures by Farkas, Gabor, Foldesi, Peter, Koczy, Laszlo T.

    “…Selecting and evaluating the suppliers represent a very complex task, because a wide range of attributions must be taken into consideration and many of them…”
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    Conference Proceeding
  19. 19

    Issues in testing advanced power semiconductor devices by Farkas, Gabor, Sarkany, Zoltan, Rencz, Marta

    “…Thermal transient testing is a widely used tool in reliability testing of power semiconductors and structure integrity analysis of packages, cooling mounts…”
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    Conference Proceeding
  20. 20

    Thermal Measurement and Modeling of Multi-Die Packages by Poppe, A., Yan Zhang, Wilson, J., Farkas, G., Szabo, P., Parry, J., Rencz, M., Szekely, V.

    “…Thermal measurement and modeling of multi-die packages with vertical (stacked) and lateral arrangement became a hot topic recently in different fields like RAM…”
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    Journal Article