Search Results - "Farkas, Gabor"
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Analytical Prediction of the Thermal Behavior of Semiconductor Power Devices from Room-Temperature I–V Measurements
Published in Energies (Basel) (01-06-2024)“…The thermal characterization of power devices is an inevitable task in the industry. Thermal transient testing is one of the major tools for this…”
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On the Reproducibility of Thermal Measurements and of Related Thermal Metrics in Static and Transient Tests of Power Devices
Published in Energies (Basel) (2020)“…Traditionally the thermal behavior of power devices is characterized by temperature measurements at the junction and at accessible external points. In large…”
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3
Structural Analysis of Power Devices and Assemblies by Thermal Transient Measurements
Published in Energies (Basel) (2019)“…Power modules composed of semiconductor dice, thermal interface layers, and cooling mounts can be characterized by thermal transient testing at their actual…”
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4
Possibilities of using raster data in client‐side web maps
Published in Transactions in GIS (01-02-2020)“…Companies and individual developers have recently put serious effort into improving web mapping libraries. A significant front in this development is…”
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Applicability of open-source web mapping libraries for building massive Web GIS clients
Published in Journal of geographical systems (01-07-2017)“…The increasing capabilities of web browsers and the growing spread of JavaScript have an impact on the development of web-based GIS systems. While in…”
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Real-time data visualization of welding robot data and preparation for future of digital twin system
Published in Scientific reports (03-05-2024)“…The application of industrial technologies is undergoing significant changes. Finding the level at which to use efficient cyberphysical systems is perhaps one…”
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Multi-Domain Modelling of LEDs for Supporting Virtual Prototyping of Luminaires
Published in Energies (Basel) (2019)“…This paper presents our approaches to chip level multi-domain LED (light emitting diode) modelling, targeting luminaire design in the Industry 4.0 era, to…”
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8
Activity release from damaged fuel during the Paks-2 cleaning tank incident in the spent fuel storage pool
Published in Journal of nuclear materials (01-07-2009)“…During crud removal operations the integrity of 30 fuel assemblies was lost at high temperature at the unit No. 2 of the Paks NPP. Part of the fission products…”
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9
The New Star of 1572 and Hungary
Published in Journal for the history of astronomy (01-11-2007)Get full text
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10
Cyber‐physical‐based welding systems: Components and implementation strategies
Published in IET cyber-physical systems (01-05-2024)“…Abstract The conditions for a feasible Cyber‐Physical System (CPS) in a welding environment are explored for the manufacturing technology components while also…”
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The Buda Chronicles : The First Printed Book in Hungary: Printer, Work, Provenance, Patronage
Published in Bibliofilia (01-01-2015)“…On Jun 5th, 1473 on the eve of Pentecost one of the happiest men in the Buda Royal Palace must have been Andreas Hess, a typographer of German origin who was…”
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Influence of Flood Waves, Production Wells, and Precipitation on Shallow Groundwater Using a Linear Regression Model Approach Based on a Case Study of Mohács Island, Hungary
Published in Water (Basel) (01-05-2020)“…Studying the relationship between river water and shallow groundwater (SGW) during flood events is a research topic receiving increasing attention for many…”
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In-situ transient testing of thermal interface sheets and metal core boards in power switch assemblies
Published in 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01-09-2017)“…In power switch assemblies the heat is removed through laminate stacks containing thermal interface materials (TIM). Some information on a TIM layer quality…”
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Bionomics and host plants of the invasive Cydia interscindana (Möschler, 1866) (Lepidoptera, Tortricidae), an emerging pest in the Carpathian Lowlands
Published in Nota lepidopterologica (01-01-2022)“…Cydia interscindana (Möschler, 1866) has spread through several European countries in the past few years, becoming an invasive pest of ornamental trees. It was…”
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15
3D Scanning and Model Error Distribution-Based Characterisation of Welding Defects
Published in Hungarian journal of industrial chemistry (2021)“…The inspection of welded structures requires particular attention due to many aspects that define the quality of the product. Deciding on the suitability of…”
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Community prevalence of SARS-CoV-2 in England from April to November, 2020: results from the ONS Coronavirus Infection Survey
Published in The Lancet. Public health (01-01-2021)“…Decisions about the continued need for control measures to contain the spread of severe acute respiratory syndrome coronavirus 2 (SARS-CoV-2) rely on accurate…”
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Thermal transient characterization of semiconductor devices with programmed powering
Published in 29th IEEE Semiconductor Thermal Measurement and Management Symposium (01-03-2013)“…Thermal transient testing of semiconductor devices typically needs a well defined power level for heating and a proper data acquisition equipment for recording…”
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Criticality analysis of purchased materials based on fuzzy signatures
Published in 2017 IEEE International Conference on Fuzzy Systems (FUZZ-IEEE) (01-07-2017)“…Selecting and evaluating the suppliers represent a very complex task, because a wide range of attributions must be taken into consideration and many of them…”
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Issues in testing advanced power semiconductor devices
Published in 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) (01-03-2016)“…Thermal transient testing is a widely used tool in reliability testing of power semiconductors and structure integrity analysis of packages, cooling mounts…”
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Thermal Measurement and Modeling of Multi-Die Packages
Published in IEEE transactions on components and packaging technologies (01-06-2009)“…Thermal measurement and modeling of multi-die packages with vertical (stacked) and lateral arrangement became a hot topic recently in different fields like RAM…”
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