Bonding of compound casted Ti/Al bimetal by heat treatment

Bonding of compound casted Ti/Al bimetal by heat treatment

The formation mechanism of the bonding between compound cast Al/Ti bimetal during a heat treatment regime was investigated. Commercially pure Al was cast and melt on a Ti bar in a steel tube, followed by heat treatment on the compound cast Ti/Al bimetal for different periods of time once the Al melt...

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Bibliographic Details
Published in:International journal of minerals, metallurgy and materials Vol. 28; no. 9; pp. 1515 - 1524
Main Authors: Fadaeinia, M., Raiszadeh, Ramin
Format: Journal Article
Language:English
Published: Beijing University of Science and Technology Beijing 01-09-2021
Springer Nature B.V
Department of Metallurgy and Materials Science,School of Engineering,Shahid Bahonar University of Kerman,Kerman 7616913439,Iran
Subjects:
Aluminum
Bimetals
Ceramics
Characterization and Evaluation of Materials
Chemical bonds
Chemistry and Materials Science
Composites
Corrosion and Coatings
Glass
Heat treating
Heat treatment
Materials Science
Metallic Materials
Metallurgy
Metals
Natural Materials
Oxide coatings
Research methodology
Solids
Spectrum analysis
Steel tubes
Surfaces and Interfaces
Temperature
Thin Films
Titanium base alloys
Tribology
compound casting
bonding
titanium/aluminium bimetal
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Summary:The formation mechanism of the bonding between compound cast Al/Ti bimetal during a heat treatment regime was investigated. Commercially pure Al was cast and melt on a Ti bar in a steel tube, followed by heat treatment on the compound cast Ti/Al bimetal for different periods of time once the Al melt was solidified. No bonding was observed between the two metals after the initial casting, which can be attributed to the presence of oxide films on the liquid Al and solid Ti alloys and the trapped atmosphere between them. The effect of these layers in preventing the formation of bonding was eliminated after heat treating the cast part at ∼973 K (∼700°C) for at least 15 min, and the metals started to bond with each other. A detailed description of this bonding mechanism is presented in this paper.
ISSN:1674-4799
1869-103X
DOI:10.1007/s12613-020-2107-z