Search Results - "Fabia, M.G."
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Lead frame Hillock-Induced Silicon Crack
Published in 2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits (01-07-2006)“…End customer in circuit test rejects at a rate of 2-5% was sent back to manufacturer for analysis and inspection. Electrical failure analysis had revealed some…”
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Conference Proceeding
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Understanding Protective Overcoat Damages: Failure Analysis to the Next Level
Published in 2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits (01-07-2006)“…Failure analysis (FA) is key in root cause identification for any problem solving journey. Diagnosis given provides insights on mechanisms by which failures…”
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Conference Proceeding