Search Results - "FENGMAN LIU"

The high‐efficiency co‐design and the measurement verification of high‐bandwidth silicon photonic microring modulator by Wu, Yue, He, Huimin, Cao, Rui, Liu, Fengman

“…The microring modulator (MRM) is a small‐size and low‐power component, which is the potential for the next‐generation optical interconnection. By the…”
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Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package by Fengze Hou, Tingyu Lin, Liqiang Cao, Fengman Liu, Jun Li, Xuejun Fan, Zhang, G. Q.

“…Nowadays, fan-out package is regarded as one of the latest and most potential technologies because it possesses lower cost, thinner profile, and better…”
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Six-Degree-of-Freedom Posture Measurement Technologies Using Position Sensitive Detectors (PSDs): State of the Art by Meng, Xiangxu, Sun, Siwei, Yan, Xuetao, Liu, Fengman, Cao, Liqiang, Wang, Qidong, Sun, Yu

“…Six degree-of-freedom (6-DOF) posture measurement is an important academic research topic which has been broadly applied in many fields. As a high-speed…”
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High-Bandwidth Lumped Mach-Zehnder Modulators Based on Thin-Film Lithium Niobate by Yang, Peng, Sun, Siwei, Zhang, Yuqiang, Cao, Rui, He, Huimin, Xue, Haiyun, Liu, Fengman

“…Recently, lumped Mach-Zehnder Modulators (MZMs) have received renewed attention due to their potential for low power consumption and compact size. However, the…”
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Novel Low-Loss Fiber-Chip Edge Coupler for Coupling Standard Single Mode Fibers to Silicon Photonic Wire Waveguides by Sun, Siwei, Chen, Ying, Sun, Yu, Liu, Fengman, Cao, Liqiang

“…Fiber-to-chip optical interconnects is a big challenge in silicon photonics application scenarios such as data centers and optical transmission systems. An…”
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A novel dual-lens-coupling system for DFB laser based on hybrid integration by Wei, Juan, Sun, Yu, Xue, Haiyun, He, Huimin, Sun, Siwei, Liu, Fengman, Cao, Liqiang

“…A dual-lens-integrated distributed feedback (DFB) laser based on hybrid integration for single-mode transmitter optical subassembly (TOSAs) is discussed in…”
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Study on a Conformal Shielding Structure With Conductive Adhesive Coated on Molding Compound in 3-D Packages by He, Yi, Li, Jun, Tian, Gengxin, Liu, Fengman, Cao, Liqiang

“…With the continuous improvement of system integration, 3-D packages are becoming effective solutions for lighter, thinner, shorter, and smaller electronic…”
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Co-packaged optics (CPO): status, challenges, and solutions by Tan, Min, Xu, Jiang, Liu, Siyang, Feng, Junbo, Zhang, Hua, Yao, Chaonan, Chen, Shixi, Guo, Hangyu, Han, Gengshi, Wen, Zhanhao, Chen, Bao, He, Yu, Zheng, Xuqiang, Ming, Da, Tu, Yaowen, Fu, Qiang, Qi, Nan, Li, Dan, Geng, Li, Wen, Song, Yang, Fenghe, He, Huimin, Liu, Fengman, Xue, Haiyun, Wang, Yuhang, Qiu, Ciyuan, Mi, Guangcan, Li, Yanbo, Chang, Tianhai, Lai, Mingche, Zhang, Luo, Hao, Qinfen, Qin, Mengyuan

“…Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter traffic has grown at a compound annual growth rate of nearly 30%…”
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Design and Implementation of a High-Coupling and Multichannel Optical Transceiver With a Novel Packaging Structure by He, Huimin, Liu, Fengman, Xue, Haiyun, Wu, Peng, Song, Mangu, Chen, Cheng, Sun, Yu, Cao, Liqiang

“…Short-reach optical interconnection mainly focuses on the power consumption, the cost, and the volume. According to these requirements, the design and…”
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Design and implementation of a 700–2,600 MHz RF SiP module for micro base station by He, Yi, Liu, Fengman, Hou, Fengze, Wu, Peng, Li, Jun, Cao, Liqiang, Shangguan, Dongkai

“…In this paper, we present a complete 700–2,600 MHz RF SiP module for micro base station. This RF SiP design integrates transmitter, receiver, feedback module,…”
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A 9pJ/bit SOP optical transceiver with 80 Gbps two-way bandwidth by Liu Fengman, Li Baoxia, Li Zhihua, Wan Lixi, Gao Wei, Chu Yanbiao, Du Tianmin, Song Jian, Xiang Haifei, Wang Haidong, Yang Kun, Yang Binbin

“…The high-speed parallel optical transmitter module based on VCSEL/PD array, high-speed specialized integrated circuit, fiber array micro-optical components…”
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Optimizing Hierarchical 3-D Floorplanning with simulated annealing Algorithm by Chengyi, Liao, Qi, Zheng, Fengman, Liu, Huimin, He, Qidong, Wang

“…3DIC enables the vertical stacking of multiple chip layers, connected by silicon through-silicon vias (TSV), ultimately resulting in significant reductions in…”
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Design and Realization of Multi-Channel and High-Bandwidth 2.5D Transmitter Integrated With Silicon Photonic MZM by He, Huimin, Xue, Haiyun, Sun, Yu, Liu, Fengman, Cao, Liqiang

“…Recently, the interconnection bandwidth of the data center is rapidly increasing. To satisfy the requirement for the high-performance data center, a 4-channel…”
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A 10-Gbps x 12-Channel Pluggable Parallel Optical Transceiver Based on CXP Interface Specifications by KUN YANG, ZHIHUA LI, BAOXIA LI, WEI GAO, FENGMAN LIU, JIAN SONG, LIXI WAN

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High-sensitivity MEMS force and acceleration sensor based on graphene-induced non-radiative transition by Li, Guanghui, Liu, Fengman, Yang, Shengyi, Liu, Jiang-Tao, Li, Weimin, Wu, Zhenhua

“…The micro-electromechanical-system (MEMS) force and acceleration sensor, based on the graphene-induced non-radiative transition, was investigated using…”
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A new dual-zone position sensitive detector for roll angle Measurement: Design and validation by Meng, Xiangxu, Yan, Xuetao, Sun, Siwei, Liu, Fengman, Wang, Qidong, Cao, Liqiang

“…•A new dual-zone position sensitive detector is proposed and constructed with two centrally coincident photosensitive areas, separated by a specially designed…”
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Thermo-Mechanical and Compression Analyses for Large-Scale Co-packaged Optics (CPO) Assembly by Cao, Rui, He, Huimin, Hou, Fengze, Ma, Rui, Liu, Fengman, Wang, Qidong, Cao, Liqiang

“…With the development of artificial intelligence and other high-performance computing, the data transmission bandwidth in data centers has increased to 51.2…”
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Challenges and Technologies of Frontside Via-Last Active-Interposer Processes on Low-k Material for 3D Chiplet by Cao, Rui, He, Huimin, Chen, Lijun, Liao, Chengyi, Liu, Fengman, Cao, Liqiang, Wang, Qidong

“…3D chiplet technology based on TSV active interposer is an effective way to continue increasing integration, reducing power, and improving performance as…”
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High Positional Resolution Pin-Cushion Position Sensitive Detector by Deliberately Introducing Barrel Distortion by Sun, Siwei, Zheng, Qi, Meng, Xiangxu, Sun, Peng, Liu, Fengman, Cao, Liqiang

“…High positional resolution position sensitive detector (PSD) is strongly desired in high-precision position and angle measurement systems. However, a method…”
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Research on 3D Optical Module Integrating Edge Coupler and TSV by Zheng, Qi, Yang, Peng, Xue, Haiyun, He, Huimin, Cao, Rui, Dai, Fengwei, Sun, Siwei, Liu, Fengman, Wang, Qidong, Cao, Liqiang, Chen, Lijun, Sun, Xuyan, Sun, Peng

“…3D integration photonic interposer is becoming popular in the field of co-packaging optics (CPO). In this paper, we integrate the edge coupler and through…”
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