Search Results - "F., ARCIONI"

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    Reliability and Performance of Wafer Level Fan Out Package for Automotive Radar by Hartner, W., Fink, M., Haubner, G., Geissler, C., Lodermeyer, J., Niessner, M., Arcioni, F., Wojnowski, M.

    “…Embedded wafer level ball grid array (eWLB) or FO-WLP (Fan-out wafer-level packaging) is investigated as a package for MMICs (Monolithic Microwave Integrated…”
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    Conference Proceeding
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    SiGe HBT large-signal modelling and its application to the design of millimetre wave amplifiers by Arcioni, F., Pascual, J.P., Fernandez, T., Zamanillo, J.M., Mediavilla, A., Artal, E., Filimon, V., Luy, J.F.

    “…In this paper, different topologies for linear and nonlinear SiGe HBT modelling are presented. The parameters are extracted from DC and S-parameters…”
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    Conference Proceeding