Search Results - "Essl, Werner"

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  1. 1

    Particle growth across the scales: A combination of ab initio, molecular dynamics, and kinetic Monte Carlo simulations for Fe2Al5 in liquid Zn by Scheiber, Daniel, Eßl, Werner, Spitaler, Jürgen, Reiss, Georg

    Published in Acta materialia (01-01-2024)
    “…We study the growth of Fe2Al5 particles in liquid Zn with a multi-scale approach from ab initio molecular statics and dynamics to kinetic Monte Carlo (kMC)…”
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    Journal Article
  2. 2

    Morphology of Fe2Al5 particles and the interface to WC coating in the context of hot-dip galvanizing: An ab initio study by Scheiber, Daniel, Eßl, Werner, Strutzenberger, Johann, Goodwin, Frank, Spitaler, Jürgen, Reiss, Georg

    Published in Journal of alloys and compounds (25-05-2020)
    “…The focus of this ab initio study is the interaction between Fe2Al5 particles and WC surfaces in the hot-dip galvanizing processes. In a first step, we compute…”
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  3. 3

    A modification to extended proper orthogonal decomposition-based correlation analysis: The spatial consideration by Lohrasbi, Sina, Hammer, René, Eßl, Werner, Reiss, Georg, Defregger, Stefan, Sanz, Wolfgang

    “…•A bottleneck of the EPOD method for correlation analysis is described.•The role of the spatial distribution of the modes is clarified, and a procedure to take…”
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  4. 4

    Reversible Reaction Kinetics Model for the Formation of Dross Particles in Hot-Dip Galvanizing Lines by Reiss, Georg, Eßl, Werner, Strutzenberger, Johann, Trasca, Raluca Andreea, Unger, Harald, Angeli, Gerhard

    “…Dross particle formation in the hot-dip galvanizing zinc bath and dross build-up on the sink rolls can cause surface defects on the steel-strip…”
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  5. 5
  6. 6

    Impact of electric field at rough copper lines on failure time due to electrochemical migration in PCBs by Reiss, Georg, Kosednar-Legenstein, Barbara, Riedler, Johann, Eßl, Werner

    Published in Microelectronics and reliability (01-02-2021)
    “…The impact of the electric field between rough copper lines on the failure time for electrochemical migration (ECM) in printed circuit boards is analyzed by…”
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  7. 7

    Impact of hydrodynamics on growth and morphology of faceted crystals by Stefan-Kharicha, Mihaela, Kharicha, Abdellah, Zaidat, Kader, Reiss, Georg, Eßl, Werner, Goodwin, Frank, Wu, Menghuai, Ludwig, Andreas, Mugrauer, Claudia

    Published in Journal of crystal growth (01-07-2020)
    “…•We studied the influence of the flow on the faceted growth of a hexagonal crystal.•A front tracking interface model was used based on a cellular automaton…”
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  8. 8

    Thermo-Hydraulic Characteristics of Micro-Scale Surface Roughness Topology of Additively Manufactured Surface Model: Modal Decomposition Perspective by Lohrasbi, Sina, Hammer, René, Eßl, Werner, Reiss, Georg, Defregger, Stefan, Sanz, Wolfgang

    Published in Energies (Basel) (01-11-2021)
    “…As a consequence of rapid development of additive manufacturing (3D printing) methods, the academic/industrial demand has been continuously increasing. One…”
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  9. 9

    Hydrodynamically driven facet kinetics in crystal growth by Stefan-Kharicha, Mihaela, Kharicha, Abdellah, Zaidat, Kader, Reiss, Georg, Eßl, Werner, Goodwin, Frank, Wu, Menghuai, Ludwig, Andreas, Mugrauer, Claudia

    Published in Journal of crystal growth (15-04-2022)
    “…•The hydrodynamic influence on faceted crystal growth was clearly observed and evidence was presented in this paper.•An asymmetry of the crystal facets growth…”
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  10. 10

    A Comprehensive Review on the Core Thermal Management Improvement Concepts in Power Electronics by Lohrasbi, Sina, Hammer, Rene, Essl, Werner, Reiss, Georg, Defregger, Stefan, Sanz, Wolfgang

    Published in IEEE access (2020)
    “…A heat sink is a specific type of heat exchanger integrated with heat generating devices - mostly electronics - for the sake of thermal management. In the…”
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  11. 11

    Thermo-chemical Fluid Flow Simulation in Hot-Dip Galvanizing: The Evaluation of Dross Build-Up Formation by Reiss, Georg, Ishmurzin, Anton, Mugrauer, Claudia, Eßl, Werner, Ecker, Werner, Strutzenberger, Johann, Unger, Harald, Angeli, Gerhard

    “…This paper presents a new computational framework to investigate the driving force for the formation of intermetallic dross particles in the zinc bath and…”
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  12. 12

    Numerical Analysis of Convective Mass Transfer during Multi-Droplet Impingement on a Structured Surface in the Presence of an Adhered Liquid Film—An Application to Spray Etching of PCBs by Eßl, Werner, Reiss, Georg, Raninger, Peter, Ecker, Werner, Körbler, Nadine, Gerold, Eva, Antrekowitsch, Helmut, Klocek, Jolanta, Krivec, Thomas

    Published in Fluids (Basel) (01-06-2023)
    “…Multi-droplet impingement is a fundamental aspect inherent to all kinds of technical spray processes which typically aim at enhancing the convective exchange…”
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  13. 13

    LES‐VOF Simulation and POD Analysis of the Gas‐Jet Wiping Process in Continuous Galvanizing Lines by Eßl, Werner, Pfeiler, Claudia, Reiss, Georg, Ecker, Werner, Riener, Christian K., Angeli, Gerhard

    Published in Steel research international (01-02-2018)
    “…Gas‐Jet wiping is a widely applied technology in continuous galvanizing mills, which enables the adjustment of the specific coating mass by an impinging…”
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  14. 14

    Investigation of the Gas‐Jet Wiping Process − Two‐Phase Large Eddy Simulations Elucidate Impingement Dynamics and Wave Formation on Zinc Coatings by Pfeiler, Claudia, Eßl, Werner, Reiss, Georg, Riener, Christian K., Angeli, Gerhard, Kharicha, Abdellah

    Published in Steel research international (01-09-2017)
    “…In addition to corrosion resistance and processing properties, high coating uniformity is a key quality criterion for galvanized steel sheets. Hydrodynamic gas…”
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  15. 15

    Some Examples for Advanced Numerical Solutions Pushing the Limits of Commercial Software by Antretter, Thomas, Hasenhütl, Eva, Eßl, Werner, Hofmann, Arno, Ecker, Werner, Heiß, Christian, Galler, Robert, Parteder, Erik

    “…The finite element method has proven its versatility in vast areas of engineering disciplines. Nevertheless, there are still many applications that require…”
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