Search Results - "Ejim, T.I."
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Growth of
Published in [Proceedings 1991] Third International Conference Indium Phosphide and Related Materials (1991)“…The growth of large diameter twin-free InP single crystals in the…”
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Conference Proceeding
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The influence of nickel/gold surface finish on the assembly quality and long term reliability of thermally enhanced BGA packages
Published in Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) (1999)“…Increasing numbers of chip carrier packages such as BGA and CSP use electroless nickel/immersion gold (ENi/IAu) surface finishes. However, the results of…”
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Conference Proceeding -
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Assembly and reliability of thermally enhanced high I/O BGA packages
Published in Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium (1997)“…Surface mount assembly defects for thermally enhanced high I/O, BGAs can range from 0 to 20 ppmj with packages that meet the JEDEC coplanarity specification of…”
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Conference Proceeding -
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Reliability performance and failure mode of high I/O thermally enhanced ball grid array packages
Published in Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205) (1998)“…Thermally enhanced BGA packages can be susceptible to early failures during accelerated thermal cycling. These failures are attributed to a brittle fracture…”
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Conference Proceeding -
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Bulk III-V compound semiconductor crystal growth
Published in AT&T technical journal (01-01-1989)“…This paper discusses the production of III-V compound semiconductor substrates characterized by structural perfection and chemical homogeneity. Special…”
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Journal Article