Search Results - "Ehsan, Abang Annuar"
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1
Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint
Published in Scientific reports (06-09-2022)“…This study investigated the effectiveness of heat shield placement locations during the rework process to avoid thermal and mechanical damage to adjacent ball…”
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Journal Article -
2
Customizing ultraviolet curable polymer‐ink properties via reactive diluent modification and viscosity control
Published in Journal of applied polymer science (15-01-2024)“…In inkjet 3D printing, material selection plays a crucial role in shaping both printing performance and material characteristics. Achieving the desired…”
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Journal Article -
3
Sensitivity Enhancement of Heterocore Macrobend Fiber Optics by Adding a ZnO Film
Published in International journal of optics (2021)“…Optical fibers with high sensitivity are in demand due to their great potential in sensor application. Semiconductors, such as ZnO, are good materials. Using…”
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4
Optoelectrical Properties of Hexamine Doped-Methylammonium Lead Iodide Perovskite under Different Grain-Shape Crystallinity
Published in Nanomaterials (Basel, Switzerland) (01-04-2023)“…The crystallinity properties of perovskite influence their optoelectrical performance in solar cell applications. We optimized the grain shape and…”
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5
Performance Analysis of Disposable Flow Cell for Nitrite Detection
Published in IEEE access (2019)“…This paper describes the work on the development of disposable micro sample cell for optical spectroscopy. The disposable flow cell is an attractive approach…”
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6
Investigation of AWG demultiplexer based SOI for CWDM application
Published in EPJ Web of Conferences (01-01-2017)“…9-channel Arrayed Waveguide Grating (AWG) demultiplexer for conventional and tapered structure were simulated using beam propagation method (BPM) with channel…”
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Journal Article Conference Proceeding -
7
Chemical tapering of polymer optical fiber
Published in EPJ Web of Conferences (01-01-2017)“…Polymer optical fibers (POFs) have significant advantages over numerous sensing applications. The key element in developing sensor is by removing the cladding…”
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Journal Article Conference Proceeding -
8
Acrylic and metal based Y-branch plastic optical fiber splitter with optical NOA63 polymer waveguide taper region
Published in Optical review (Tokyo, Japan) (01-01-2011)“…We proposed a simple low-cost acrylic and metal-based Y-branch plastic optical fiber (POF) splitter which utilizes a low cost optical polymer glue NOA63 as the…”
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9
Machining of acrylic-based Y-branch plastic optical fiber coupler with suspended waveguide taper
Published in Optical review (Tokyo, Japan) (01-01-2012)“…An acrylic-based Y-branch plastic optical fiber (POF) with a middle suspended waveguide taper has been developed. The suspended high index contrast waveguide…”
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10
Acrylic-based asymmetric and variable coupling ratio Y-branch plastic optical fiber coupler
Published in Optical review (Tokyo, Japan) (01-01-2012)“…Acrylic-based asymmetric and variable couplers have been developed using a single structured Y-branch design with a high-index-contrast waveguide taper and a…”
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11
Fabrication of 1×2 asymmetric plastic optical fiber coupler for portable optical access-card system
Published in Optical review (Tokyo, Japan) (2011)“…An optical code generating device using plastic optical fiber (POF) coupler for a portable optical access card system is presented. The code generating device…”
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12
Characterisation and process optimisation of photosensitive acrylates for photonics applications
Published in Science and technology of advanced materials (01-04-2005)“…In this paper, we present our recent progress on the characterisation and process optimisation of photoresist-like fluorinated acrylate and Cyclomer acrylate…”
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13
Large cross-section rib silicon-on-insulator (SOI) S-bend waveguide
Published in Optik (Stuttgart) (01-02-2017)“…S-bend SOI waveguide is known as the most critical part for SOI device design. Normalized output power for the different parameter of the S-bend waveguide has…”
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14
Cardinal and Ordinal Directions Approach in Investigating Arrayed Solder Joints Crack Propagation of Ball Grid Array Semiconductor Packages
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-09-2022)“…An accelerated reliability testing via thermal cycling test (TCT) was used to test ball grid array (BGA) components' reliability. Five variables were observed;…”
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15
Air-Processable Perovskite Solar Cells by Hexamine Molecule Phase Stabilization
Published in ACS omega (30-05-2023)“…Perovskite solar cells have emerged as a potential energy alternative due to their low cost of fabrication and high power conversion efficiency. Unfortunately,…”
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16
Electro-optics interaction imaging in active plasmonic devices
Published in Optical materials express (01-03-2014)“…During surface plasmon polariton (SPP) excitation, the imaging of the interaction between the DC current and the Transverse Mode (TM) optical field is reported…”
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17
Biomimetic Microstructure Design for Superhydrophobic Structure in Triboelectric Nanogenerator Device
Published in 2024 IEEE International Conference on Semiconductor Electronics (ICSE) (19-08-2024)“…Triboelectric nanogenerators (TENGs) convert kinetic energy into electrical charge, with liquid-solid TENGs utilizing the movement of water droplets for energy…”
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Conference Proceeding -
18
Intermetallic Compound Thickness of Ball Grid Array Solder Joints Under Thermal Cycling Test Using ANOVA
Published in 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) (19-10-2022)“…Thermal cycling testing is an accelerated reliability test that provides confidence that the design and the ball grid array (BGA) components assembly processes…”
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Conference Proceeding -
19
Sensitivity optimization of U-shaped fiber optics based on the Taguchi method
Published in OSA continuum (15-07-2021)“…The structure of macrobending fiber optics is an ideal structure for constructing fiber optic sensors. This study presents a new design and implementation of…”
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20
Effects of Underfill Materials on Behavior of Intermetallic Compound Thickness of Ball Grid Array Solder Joints Using ANOVA
Published in 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) (19-10-2022)“…Underfill material has normally been used to improve the ball grid array (BGA) component's reliability and performance by allowing ruggedness and portability…”
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Conference Proceeding