Search Results - "Duval, F F C"

Polymer Filling of Silicon Trenches for 3-D Through Silicon vias Applications by Duval, F F C, Okoro, C, Civale, Y, Soussan, P, Beyne, E

“…Ring-shaped silicon trenches with a depth of 50 were filled with different spin-on dielectric (SOD) polymers. Ultimately, the polymer should serve as deep…”
Get full text

3-D Wafer-Level Packaging Die Stacking Using Spin-on-Dielectric Polymer Liner Through-Silicon Vias by Civale, Y, Tezcan, D S, Philipsen, H G G, Duval, F F C, Jaenen, P, Travaly, Y, Soussan, P, Swinnen, B, Beyne, E

“…In this paper, we report on the processing and the electrical characterization of a 3-D-wafer level packaging through-silicon-via (TSV) flow, using a…”
Get full text

Reliability Study of Polymers Used in Sub-4-μm Pitch RDL Applications by Chery, Emmanuel, Duval, Fabrice F. C., Stucchi, Michele, Slabbekoorn, John, Croes, Kristof, Beyne, Eric

“…Reliability results obtained on a photosensitive polymer-based redistribution layer (RDL) process with two-metal layers and a target pitch below…”
Get full text

Lead germanium oxide sinter-assisted PZT composite thick films by Duval, F.F.C., Dorey, R.A., Zhang, Q., Whatmore, R.W.

“…Thick films of niobium doped lead zirconate titanate (PNZT) were prepared from a sol-gel/PZT powder composite slurry. The effects of adding different amounts…”
Get full text

Fabrication of PZT Composite Thick Films for High Frequency Membrane Resonators by Duval, F F C, Dorey, R A, Wright, R W, Huang, Z, Whatmore, R W

“…High frequency, thickness mode resonators were fabricated using a 7 μm PZT thick film which was produced using a modified composite ceramic sol-gel process…”
Get full text

Characterisation of PZT thin film micro-actuators using a silicon micro-force sensor by Duval, Fabrice F.C., Wilson, Stephen A., Ensell, Graham, Evanno, Nicolas M.P., Cain, Markys G., Whatmore, Roger W.

“…This paper reports on the measurements of displacement and blocking force of piezoelectric micro-cantilevers. The free displacement was studied using a surface…”
Get full text

Development of compression molding process for Fan-Out wafer level packaging by Julien, Bertheau, Fabrice F.C., Duval, Tadashi, Kubota, Pieter, Bex, Koen, Kennes, Alain, Phommahaxay, Arnita, Podpod, Eric, Beyne, Andy, Miller, Gerald, Beyer

“…The present study deals with the investigation of compression mold processes and materials to enable a highdensity chip-first multi-die Fan-Out assembly. Wafer…”
Get full text

Fabrication and modeling of high-frequency PZT composite thick film membrane resonators by DUVAL, Fabrice F. C, DOREY, Robert A, WRIGHT, Robert W, ZHAORONG HUANG, WHATMORE, Roger W

“…High-frequency, thickness mode resonators were fabricated using a 7 microm piezoelectric transducer (PZT) thick film that was produced using a modified…”
Get full text

Photosensitive polymer reliability for fine pitch RDL applications by Chery, Emmanuel, Duval, Fabrice F. C., Stucchi, Michele, Slabbekoorn, John, Croes, Kristof, Beyne, Eric

“…We present the reliability results obtained on a two-metal level copper RDL patterned on a photosensitive polymer with a target pitch below 4 μm. Our polymer…”
Get full text

High Frequency PZT Composite Thick Film Resonators by DUVAL, F. F. C., DOREY, R. A., WRIGHT, R. W., HUANG, Z., WHATMORE, R. W.

“…High frequency, thickness mode resonators were fabricated using a 7 μm PZT thick film which was produced using a modified composite ceramic sol-gel process…”
Get full text

The Effect of Repeated Sol Infiltrations on the Microstructure and Electrical Properties of PZT Composite Sol-Gel Films by Dorey, R. A., Duval, F. F. C., Haigh, R. D., Whatmore, R. W.

“…PZT films in excess of 20 w m thick can readily be fabricated by repeated deposition of a powder/sol-gel slurry. The resultant films often contain a…”
Get full text

Stable TiO2/Pt electrode structure for lead containing ferroelectric thick films on silicon MEMS structures by DUVAL, F. F. C, DOREY, R. A, HAIGH, R. H, WHATMORE, R. W

“…A thermally stable electrode structure for lead zirconate titanate (PZT) thick films was developed for silicon/silicon nitride substrates by incorporating…”
Get full text

Fabrication and modeling of high-frequency PZT composite thick film membrance resonators by Duval, F.F.C., Dorey, R.A., Wright, R.W., Huang, Z., Whatmore, R.W.

“…High-frequency, thickness mode resonators were fabricated using a 7 /spl mu/m piezoelectric transducer (PZT) thick film that was produced using a modified…”
Get full text

Impact of the combination of stress buffer layer and wafer level underfill on 3D IC assembly using thermal compression bonding by Duval, F. F. C., Wang, T., Bex, P., Gerets, C., Lofrano, M., Rebibis, K. J., Sleeckx, E., Beyne, E.

“…This study focuses on the investigation of a buffer layer (BL) spin-on dielectric polymer material in combination with a dry-film underfill (WLUF) on the…”
Get full text

Comparison of properties of thermo-compression bonded 3D stacks using a liquid and a dry-film wafer level underfills by Duval, F. F. C., Wang, T., Capuz, G., Gerets, C., Miller, R. A., Rebibis, K. J., Beyne, E.

“…This papers reports on the study of two wafer level underfills (WLUF) for 3D stacked IC applications. WLUF either as a liquid (material A) or a dry-film…”
Get full text

Semi-additive Cu-polymer RDL process for interposers applications by Duval, F. F. C., Detalle, M., Sun, X., Beyne, E., Neve, C. Roda, Velenis, D.

“…This paper explores the possibility to use insulating spin-on dielectric materials for 2.5D interposers. Up to 7 photosensitive materials have been…”
Get full text