Search Results - "Drozd, Z"

Deformation behaviour of Mg–Li alloys at elevated temperatures by Trojanová, Z., Drozd, Z., Lukáč, P., Chmelík, F.

“…The mechanical properties of three magnesium alloys Mg4Li, LA43 and LA45 have been investigated in compression tests at temperatures between 25 and 200 °C. The…”
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Strengthening in Mg–Li matrix composites by Trojanová, Z., Drozd, Z., Kúdela, S., Száraz, Z., Lukáč, P.

“…Mg– xLi ( x = 4, 8, 12) matrix composites reinforced with short δ-alumina (Al 2O 3) fibres were manufactured by the pressure infiltration process. Mg–8Li…”
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A reliability study of the lead-free solder connections of miniature chip components on hybrid circuits by Ročak, D., Maček, S., Sitek, J., Hrovat, M., Bukat, K., Drozd, Z.

“…The results of the influence of lead-free solder paste, design and process parameters on the attachment reliability of chip surface-mounted components (SMCs)…”
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Deformation behaviour of Mg–Li–Al alloys by Drozd, Zdeněk, Trojanová, Zuzanka, Kúdela, Stanislav

“…Two Mg–Li–Al alloys (LA43 and LA45) were deformed in compression at elevated temperatures. Stress relaxation tests were performed with the aim to reveal…”
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Anisotropy of Thermal Expansion in an AZ31 Magnesium Alloy Subjected to the Accumulative Roll Bonding by Drozd, Z., Trojanová, Z., Halmešová, K., Džugan, J., Lukáč, P., Minárik, P.

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Mechanical properties of Mg alloys composites reinforced with short Saffil ® fibres by Trojanová, Zuzanka, Gärtnerová, Viera, Lukáč, Pavel, Drozd, Zdeněk

“…AZ91 and ZE41 matrix composites reinforced with short δ-alumina fibres (Saffil ®) were manufactured by the squeeze casting technology. The structure of…”
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New flip-chip assembly system for prototyping and process investigations by Drozd, Z., Hackiewicz, H., Jezior, R., Lasocki, J., Lukasik, W., Orzechowski, J., Szwech, M.

“…The flip-chip assembly technology and a new laboratory stand for investigation of FC bonding processes are presented. The prototype system was developed by…”
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Thermally activated processes in microcrystalline Mg by Trojanová, Zuzanka, Drozd, Zdenĕk, Lukác̆, Pavel, Máthis, Kristián, Ferkel, Hans, Riehemann, Werner

“…The deformation characteristics of microcrystalline Mg are studied; an explanation is given for the rapid decrease in the flow stresses at elevated…”
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Life-time of lead-free soldered SMT joints by Szwech, M., Drozd, Z.

“…The work concern the life-time of electronic products according to ROHS Directive of European Community. Methods and results of accelerated mechanical and…”
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Infant mortality failures of lead - free solder joints by Szwech, M., Niedzwiedz, W., Drozd, Z.

“…Two goals of the work - verification of suitability of mechanical tests of solder joints reliability and infant mortality (early failures) of lead-free joints…”
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Influence of PCBs coatings wettability on lead-free SMT solder joints reliability by Sitek, J., Drozd, Z., Bukat, K.

“…The paper presents results of wettability study of PCBs with immersion Sn, Ni/Au and SnCu coatings before reflow soldering process. Furthermore the solder…”
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Thermal and Mechanical Reliability Tests of Lead - free soldered SMT Joints by Drozd, Z., Szwech, M., Kisiel, R.

“…One of the main goals in development of electronics manufacturing technology, after implementation of EU Directive RoHS, is the reliability improvement of…”
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Calculation of BGA contact resistance by using the contacts volume method by Wrona, R., Drozd, Z.

“…In Warsaw University of Technology was developed special BGA256r test specimen [1] for early failure detection during the reliability tests. The failures were…”
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Economic reliability test methods of new soldering materials by Niedzwiedz, W, Szwech, M, Chmielewski, J, Drozd, Z

“…According to RoHS directive, many new electronic products are manufactured by using of new technology and lead-free soldering materials. For reduction of the…”
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Assembly Problems in Lead-free and Mix Production by Sitek, J., Drozd, Z., Bukat, K.

“…Some electronic assemblers are faced to face with the necessity to use heterogeneous assembly of both very large and very small components on the same board…”
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Resistance of BGA Contacts During Reliability Tests by Wrona, R., Drozd, Z.

“…This paper shows the latest results of lead-free BGA solder joints investigations performed in frame of GrenRoSE Project financed by EC. First part is devoted…”
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Quality Management in Electronics Manufacturing after Implementation of RoHS Directive by Kisiel, R., Bukat, K., Drozd, Z., Szwech, M., Syryczyk, P., Girulska, A.

“…The improvement of electronic interconnection systems reliability after implementation of EU Directive RoHS is currently one of the main goals in development…”
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Resistance Measurements of BGA Contacts During Reliability Tests by Wrona, R., Drozd, Z., Szwech, M.

“…For mechanical fatigue tests were designed special test models of BGA package and test board, for measurements of solder joints and ball contact resistance by…”
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Characteristics of Accelerated Fatigue Tests by Cyclic Flexion of SMT PC boards by Drozd, Z., Szwech, M., Wrona, R.

“…The critical problem by implementation the EU RoHS directive is assurance of existing level of electronic products reliability. For accelerated reliability…”
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Mechanical cycling in accelerated life - time tests of lead - free soldered joints by Drozd, Z., Drozd, J., Bronowski, J., Szwech, M.

“…Typical accelerated life-time tests of soldered joints are temperature cycling and thermal shock cycling. In last time other, more economical and effective…”
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