Search Results - "Dragoi, V."

Competing‐risks model for prediction of small‐for‐gestational‐age neonate from estimated fetal weight at 19–24 weeks' gestation by Papastefanou, I., Nowacka, U., Syngelaki, A., Dragoi, V., Karamanis, G., Wright, D., Nicolaides, K. H.

“…ABSTRACT Objective To develop further a new competing‐risks model for the prediction of a small‐for‐gestational‐age (SGA) neonate, by including…”
Get full text

Visuo-frontal interactions during social learning in freely moving macaques by Franch, Melissa, Yellapantula, Sudha, Parajuli, Arun, Kharas, Natasha, Wright, Anthony, Aazhang, Behnaam, Dragoi, Valentin

“…Social interactions represent a ubiquitous aspect of our everyday life that we acquire by interpreting and responding to visual cues from conspecifics 1 …”
Get full text

Solving a Modified Syndrome Decoding Problem using Integer Programming by Dragoi, Vlad-Florin, Cayrel, Pierre-Louis, Colombier, Brice, Bucerzan, Dominic, Hoara, Sorin

“…In this article, we model a variant of the well-known syndrome decoding problem as a linear optimization problem. Most common algorithms used for solving…”
Get full text

Wafer bonding using Cu–Sn intermetallic bonding layers by Flötgen, C., Pawlak, M., Pabo, E., van de Wiel, H. J., Hayes, G. R., Dragoi, V.

“…Wafer-level Cu–Sn intermetallic bonding is an interesting process for advanced applications in the area of MEMS and 3D interconnects. The existence of two…”
Get full text

3D integration by wafer-level aligned wafer bonding by Dragoi, V., Burggraf, J., Kurz, F., Rebhan, B.

“…Wafer bonding is an attractive technology enabling manufacturing of complex wafer-level 3D architectures. The continuous demand for device size shrinking and…”
Get full text

Pre-bond megasonic cleaning with improved process control by Dussault, D., Liebscher, E., Fournel, F., Payen, N., Dragoi, V.

“…A pre-bond cleaning process was developed utilizing a unique, radially uniform, large area proximity type Megasonic transducer. In prior work this new cleaning…”
Get full text

Opportunities in 3D substrate bonding by Matthias, T., Uhrmann, T., Dragoi, V., Lindner, P.

“…Vertical stacking of thin chips combined with Through-Silicon-Vias (TSVs) as interconnects is an attractive path to higher functional density of ICs. Different…”
Get full text

Ordering series and parallel compositions by Dragoi, V., Cowell, S. R., Beiu, V.

“…In this article we analyze the reliability of networks constructed as repetitive compositions of simple identical structures (building blocks). More precisely,…”
Get full text

Effective conductances of Moore-Shannon hammocks by Cowell, S. R., Dragoi, V., Beiu, V., Rohatinovici, N.-C.

“…By assuming each device in a Moore-Shannon hammock network to have a finite conductance g when closed, we decompose the reliability polynomial h(p,q),…”
Get full text

Competing‐risks model for prediction of small‐for‐gestational‐age neonate from estimated fetal weight at 19–24weeks' gestation by Papastefanou, I, Nowacka, U, Syngelaki, A, Dragoi, V, Karamanis, G, Wright, D, Nicolaides, K H

“…ObjectiveTo develop further a new competing‐risks model for the prediction of a small‐for‐gestational‐age (SGA) neonate, by including second‐trimester…”
Get full text

Fabrication of GaAs laser diodes on Si using low-temperature bonding of MBE-grown GaAs wafers with Si wafers by Cengher, D., Hatzopoulos, Z., Gallis, S., Deligeorgis, G., Aperathitis, E., Androulidaki, M., Alexe, M., Dragoi, V., Kyriakis-Bitzaros, E.D., Halkias, G., Georgakilas, A.

“…We present a study of the properties of III–V structures integrated on Si by low-temperature GaAs–Si wafer bonding, using an intermediate spin-on-glass layer…”
Get full text

Analytical methods used for low temperature Cu–Cu wafer bonding process evaluation by Rebhan, B., Tollabimazraehno, S., Hesser, G., Dragoi, V.

“…Metal wafer bonding is a well-established technology in the semiconductor industry. This technology gains more and more importance due to increasing market…”
Get full text

Cu-Cu wafer bonding: An enabling technology for three-dimensional integration by Rebhan, B., Plach, T., Tollabimazraehno, S., Dragoi, V., Kawano, M.

“…Wafer-level hybrid bonding with Cu/SiO 2 is a very promising technique to fabricate three-dimensional integrated circuits, because it enables high performance…”
Get full text

Adaptation-Induced Plasticity of Orientation Tuning in Adult Visual Cortex by Dragoi, Valentin, Sharma, Jitendra, Sur, Mriganka

“…A key emergent property of the primary visual cortex (V1) is the orientation selectivity of its neurons. The extent to which adult visual cortical neurons can…”
Get full text

CMOS wafer bonding for back-side illuminated image sensors fabrication by Dragoi, V, Filbert, A, Zhu, S, Mittendorfer, G

“…Backside illuminated CMOS image sensors were developed in order to encompass the pixel area limitation due to metal interconnects. In this technology the fully…”
Get full text

Dynamics of neuronal sensitivity in visual cortex and local feature discrimination by Dragoi, Valentin, Sharma, Jitendra, Miller, Earl K, Sur, Mriganka

“…A striking aspect of natural scenes is that image features such as line orientation are strongly correlated at neighboring spatial locations but not at distant…”
Get full text

How Reliable are Compositions of Series and Parallel Networks Compared with Hammocks? by Dragoi, Vlad, Cowell, Simon Robin, Beiu, Valeriu, Hoara, Sorin, Gaspar, Pastorel

“…A classical problem in computer/network reliability is that of identifying simple, regular and repetitive building blocks (motifs) which yield reliability…”
Get full text

Megasonic - Enhanced development for photolithography yield improvement by Dussault, D., Dragoi, V.

“…MEMS-specific processes have had to adapt standard IC manufacturing technologies in order to accommodate its custom requirements. Photolithography is one of…”
Get full text

Asymmetric Synaptic Depression in Cortical Networks by Chelaru, Mircea I., Dragoi, Valentin

“…Synaptic depression is essential for controlling the balance between excitation and inhibition in cortical networks. Several studies have shown that the…”
Get full text

Improved Timing Attacks against the Secret Permutation in the McEliece PKC by Bucerzan, Dominic, Pierre-Louis Cayrel, Dragoi, Vlad, Richmond, Tania

“…In this paper, we detail two side-channel attacks against the McEliece public-key cryptosystem. They are exploiting timing differences on the Patterson…”
Get full text