Search Results - "Dongshun Bai"

pH-Responsive Copolymer Films by Surface-Catalyzed Growth by Bai, Dongshun, Habersberger, Brian M, Jennings, G. Kane

“…We have engineered a new class of pH-responsive polymer films on gold surfaces by first developing a controlled, surface-catalyzed polymerization to prepare a…”
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Surface-Catalyzed Growth of Polymethylene-Rich Copolymer Films on Gold by Bai, Dongshun, Jennings, G. Kane

“…We report the preparation of a new class of copolymer films that consist of polymethylene (PM) with a low percentage (∼1−4%) of randomly distributed ethyl…”
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A Novel Cloud-Point Extraction Process for Preconcentrating Selected Polycyclic Aromatic Hydrocarbons in Aqueous Solution by Bai, Dongshun, Li, Jingliang, Chen, S. B, Chen, B.-H

“…A novel but simple cloud-point extraction (CPE) process is developed to preconcentrate the trace of selected polycyclic aromatic hydrocarbons (PAHs) with the…”
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Temporary Bonding and Debonding Technologies for Fan-Out Wafer-Level Packaging by Qi Wu, Xiao Liu, Kuo Han, Dongshun Bai, Flaim, Tony

“…Handheld consumer electronics are requiring more complex packaging designs to accommodate higher component densities and reduce form factor. Fan-out…”
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Advances in Temporary Bonding and Release Technology for Ultrathin Substrate Processing and High-Density Fan-Out Device Build-up by Phommahaxay, Alain, Podpod, Arnita, Slabbekoorn, John, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Dongshun Bai, Arnold, Kim

“…Thin substrate handling has become one of the cornerstone technologies that enabled the development of 3D stacked ICs over the past years. Temporary wafer…”
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Advances in Thin Wafer Debonding and Ultrathin 28-nm FinFET Substrate Transfer by Phommahaxay, Alain, Jourdain, Anne, Potoms, Goedele, Verbinnen, Greet, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Dongshun Bai, Yess, Kim, Arnold, Kim

“…Over the past few years, temporary bonding has expanded together with the development of 3D stacked IC (SIC) technology. As maturity of the various processes…”
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Single-release-layer process for temporary bonding applications in the 3D integration area by Jourdain, Anne, Phommahaxay, Alain, Velenis, Dimitrios, Guerrero, Alice, Dongshun Bai, Yess, Kim, Arnold, Kim, Miller, Andy, Rebibis, Kenneth, Beyer, Gerald, Beyne, Eric

“…One of the key aspects in 3D technology today is the bonding/debonding of a device wafer to a carrier wafer to enable wafer thinning and subsequent backside…”
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Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material by Phommahaxay, Alain, Potoms, Goedele, Verbinnen, Greet, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Dongshun Bai, Xiao Liu, Yess, Kim, Arnold, Kim, Spiess, Walter, Griesbach, Tim, Rapps, Thomas, Lutter, Stefan

“…Over the past few years, temporary bonding has spread together with the development of 3D stacked IC (SIC) technology. Maturity of the various processes has…”
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Process Development and Material Characteristics of TSV-Less Interconnection Technology for FOWLP by Wen-Wei Shen, Yu-Min Lin, Hsiang-Hung Chang, Tzu-Ying Kuo, Huan-Chun Fu, Yuan-Chang Lee, Shu-Man Lee, Ang-Ying Lin, Shin-Yi Huang, Tao-Chih Chang, Lee, Alvin, Su, Jay, Huang, Baron, Dongshun Bai, Xiao Liu, Kuan-Neng Chen

“…Fan-out wafer-level-packaging (FO-WLP) technology is developed with the advantages of smaller package size, higher Input/Output (I/O) counts, lower cost, and…”
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A low-temperature temporary lamination and laser debonding technology to enable cost-effective fabrication of a through-glass-via (TGV) interposer on a panel substrate by Lee, Alvin, Jay Su, Huang, Baron, Dongshun Bai, Wen-Wei Shen, Hsiang-Hung Chang, Chia-Wei Chiang

“…This paper describes a handling process for a thin glass panel, 200 mm × 200 mm × 130 (im, through double-side redistribution layer (RDL) formation to enable…”
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Ultrathin glass wafer lamination and laser debonding to enable glass interposer fabrication by Wen-Wei Shen, Hsiang-Hung Chang, Jen-Chun Wang, Cheng-Ta Ko, Tsai, Leon, Bor Kai Wang, Shorey, Aric, Lee, Alvin, Su, Jay, Dongshun Bai, Huang, Baron, Wei-Chung Lo, Kuan-Neng Chen

“…Interposer fabrication processes are applied in three-dimensional (3-D) integrated circuit (IC) integration to shorten the interconnection among different…”
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pH-Responsive Random Copolymer Films with Amine Side Chains by Bai, Dongshun, Ibrahim, Zulkifli, Jennings, G. Kane

“…We have designed pH-responsive copolymer films that consist of polymethylene (PM) with dilute randomly distributed side chains terminated with dimethylamine…”
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pH-Responsive Membrane Skins by Surface-Catalyzed Polymerization by Bai, Dongshun, Elliott, Steven M, Jennings, G. Kane

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Kinetics of pH Response for Copolymer Films with Dilute Carboxylate Functionality by Bai, Dongshun, Hardwick, Craig L, Berron, Brad J, Jennings, G. Kane

“…We have investigated the effects of film composition and thickness on the rate of pH-induced response of a copolymer film containing predominately…”
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Interaction between a Nonionic Surfactant and a Hydrophobically Modified 2-Hydroxyethyl Cellulose by Bai, Dongshun, Khin, Cho Cho, Chen, Shing Bor, Tsai, Chih-Chang, Chen, Bing-Hung

“…Interaction between the nonionic surfactant Tergitol 15-S-7 and hydrophobically modified 2-hydroxyethyl cellulose (HMHEC) was studied rheologically in a…”
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Surface-catalyzed growth of pH-responsive copolymer thin films by Bai, Dongshun

“…Polymer films that respond to pH have broad applications in chemical and biological sensors, smart membranes, and dynamic surfaces. We have engineered a new…”
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Advanced Multifunctional Temporary Bonding Materials with Heterogeneous Integrated Properties for Various Advanced Packaging Applications by Liu, Xiao, Bai, Dongshun, Kirchner, Lisa, Puligadda, Rama, Flaim, Tony

“…There is always an increasing demand for new materials with unique properties as technical enablers to facilitate different semiconducting advanced packaging…”
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A Novel Multifunctional Single-Layer Adhesive Used for both Temporary Bonding and Mechanical Debonding in Wafer-Level Packaging Applications by Cheng, Wenkai, Wang, Yubao, Blumenshine, Debbie, Liu, Xiao, Bai, Dongshun, Puligadda, Rama

“…Temporary bonding (TB) and debonding (DB) of wafers have been widely developed and applied over the last decade in various wafer-level packaging technologies,…”
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Surface-catalyzed growth of pH-responsive copolymer thin films by Bai, Dongshun

“…Polymer films that respond to pH have broad applications in chemical and biological sensors, smart membranes, and dynamic surfaces. We have engineered a new…”
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Laser release technology for wafer level packaging by Bai, Dongshun, Liu, Xiao, Zhang, Hong, Wu, Qi, Trichur, Ram, Puligadda, Rama, Flaim, Tony

“…Laser release technology provides advantages including high throughput and low stress during the release process, effective thin-substrate handling, and ease…”
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