Search Results - "Domer, S.M."

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  1. 1
    Model for yield and manufacturing prediction on VLSI designs for advanced technologies, mixed circuitry, and memories

    Model for yield and manufacturing prediction on VLSI designs for advanced technologies, mixed circuitry, and memories by Domer, S.M., Foertsch, S.A., Raskin, G.D.

    Published in IEEE journal of solid-state circuits (01-03-1995)
    “…A yield model has been developed and validated for use in optimizing VLSI floorplanning in next generation products. The model successfully predicts yields and…”
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    Journal Article Conference Proceeding
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  2. 2
    A scalable thermal mechanical test chip for package characterization and qualifications

    A scalable thermal mechanical test chip for package characterization and qualifications by Duffalo, J.M., Domer, S.M., Hollstein, R.L., Hullinger, A.K., Niederkorn, A.J., Wecker, N.J.

    “…A thermal mechanical test chip (TMTC) has been designed to reduce the cycle time and cost of package reliability qualifications. The TMTC moves package…”
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    Conference Proceeding
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  3. 3
    Component level yield/cost model for predicting VLSI manufacturability on designs using mixed technologies, circuitry, and redundancy

    Component level yield/cost model for predicting VLSI manufacturability on designs using mixed technologies, circuitry, and redundancy by Domer, S.M., Foertsch, S.A., Raskin, G.D.

    “…A yield model has been developed and validated for use in optimizing VLSI floorplanning in next generation products. The model successfully predicts yields and…”
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    Conference Proceeding
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