Search Results - "Dogruoz, M. Baris"

Measurements of skin friction and heat transfer beneath an impinging slot jet by Dogruoz, M. Baris, Ortega, Alfonso, Westphal, Russell V.

“…•Investigating turbulent slot jet impingement within jet potential core length.•Conducting pressure, velocity, wall skin friction and heat transfer…”
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Experiments and modeling of the hydraulic resistance and heat transfer of in-line square pin fin heat sinks with top by-pass flow by Dogruoz, M. Baris, Urdaneta, Mario, Ortega, Alfonso

“…In pin-fin heat sinks, the flow within the core exhibits separation and hence does not lend itself to simple analytical boundary layer or duct flow analysis of…”
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On the Conduction and Convection Heat Transfer From Lightweight Advanced Heat Sinks by Dogruoz, M Baris, Arik, Mehmet

“…Seamless advancements in the electronics industry lead to high heat fluxes from very limited thermal real estates. Use of natural convection air cooling is of…”
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A Thermal-aware DC-IR Drop Analysis for 2.5D IC by Xia, Shengxuan, Dogruoz, Baris M., Wang, Yansheng, Wu, Songping, Bai, Siqi, Hwang, Chulsoon, Wu, Zhonghua

“…With the trend of higher integration, 3D/2.5D IC solutions such as CoWoS (Chip-on-wafer-on-substrate) have become more popular in recent years. Power integrity…”
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An Investigation of Performance of Synthetic Jets Emanating from Circular, Elliptical and Rectangular Nozzles by Isil, Onuralp, Baris Dogruoz, M., Arik, Mehmet

“…Impinging synthetic jets have been considered as a future solution for cooling miniature structures. Synthetic jet performance is sensitive to a number of…”
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Computations with the multiple reference frame technique: Flow and temperature fields downstream of an axial fan by Dogruoz, M. Baris, Shankaran, Gokul

“…In numerical computations, axial fans are typically abstracted as two-dimensional surfaces, and this forms the basis for the "Lumped Fan" (LF) model. The…”
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Heat transfer in microchannels: substrate effects and cooling efficiency for rectangular and circular ducts by Dogruoz, M Baris, Arik, Mehmet, Pautsch, Adam

“…Recent advances in electronics lead to smaller sizes and higher heat generation rates. Heat removal at a very tight thermal envelope is only possible with…”
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Validation of an advanced fan model with multiple reference frame approach by Shankaran, Gokul V, Dogruoz, M Baris

“…Electronic enclosures commonly use fans, including axial fans, impellers and centrifugal blowers, when cooling by forced convection is required. Computational…”
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Sensitivity analysis in conjugate heat transfer for electronics cooling by Dogruoz, M. B., Sathyamurthy, P., Mathur, S.

“…This study presents sensitivity analysis in a conjugate heat transfer problem for electronics cooling. An algorithmic differentiation technique shown by Jemkov…”
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An experimental and computational investigation of a thin piezofan cooler by Dogruoz, M. Baris, Arik, Mehmet, Parsa, Shadi

“…Recent trends in electronic cooling systems are targeted towards a reduction in size, therefore small form factor/miniature cooling devices are of interest to…”
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Augmenting Heat Transfer from Fail-Safe Magneto-Rheological Fluid Dampers Using Fins by Dogruoz, M. Baris, Wang, Eric L., Gordaninejad, Faramarz, Stipanovic, Arthur J.

“…This paper presents a lumped system model for predicting the heat transfer from fail-safe magneto-rheological fluid dampers. For this study, a fail-safe damper…”
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Acoustic analysis of an axial fan by Hashim, Hafiz M., Dogruoz, M. Baris, Arik, Mehmet

“…Axial fans are often used in cooling electronic enclosures where low noise levels are highly demanded. Therefore, methods for predicting the noise emitted by…”
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An investigation into momentum and temperature fields of a meso-scale synthetic jet by Ghaffari, Omidreza, Dogruoz, M. Baris, Arik, Mehmet

“…Thermal management has become a critical part of advanced micro and nano electronics systems due to high heat transfer rates. More constraints such as…”
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Using state-space models for accurate computations of transient thermal behavior of electronic packages by Shankaran, Gokul V., Dogruoz, M. Baris, Magargle, Ryan

“…Under a given set of boundary conditions, thermal performance of an electronic system is generally evaluated based on its steady state response. It is a…”
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Investigation of power distribution on an axial fan by Hashim, Hafiz M., Yasa, Yusuf, Dogruoz, M. Baris, Arik, Mehmet, Mese, Erkan

“…Forced convection cooling systems utilize fans which can be axial or radial, small or large in many different configurations. Efficiency of a fan depends on…”
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Transient thermal behavior of SOIC packages - an optimization study by Dogruoz, M. Baris, Abarhama, Mehdi, Shankaranb, Gokul V.

“…Under a given set of boundary conditions, thermal performance of an electronic system is generally evaluated based on its steady state response. It is a…”
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Orthotropic thermal conductivity and Joule heating effects on the temperature distribution of printed circuit boards by Shankaran, Gokul V., Dogruoz, M. Baris, de Araujo, Daniel

“…A printed circuit board (PCB) comprises alternating layers of dielectric material and current carrying traces and vias. As performing system-level simulations…”
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An investigation on the conduction and convection heat transfer from advanced heat sinks by Dogruoz, M.B., Arik, M.

“…In natural convection applications, the components used for cooling may represent a significant portion of the overall weight of the system. Consequently,…”
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