Search Results - "Djomeni, Larissa"

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    Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias by Djomeni, Larissa, Mourier, Thierry, Minoret, Stéphane, Fadloun, Sabrina, Piallat, Fabien, Burgess, Steve, Price, Andrew, Zhou, Yun, Jones, Christopher, Mathiot, Daniel, Maitrejean, Sylvain

    Published in Microelectronic engineering (25-05-2014)
    “…•The MOCVD TiN films are N-riched.•Plasma treatment changes the films from amorphous to 7nm crystal grain size.•The films have larger gap in Ti and N…”
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    Journal Article Conference Proceeding
  2. 2

    In-situ X-ray μLaue diffraction study of copper through-silicon vias by Sanchez, Dario Ferreira, Reboh, Shay, Weleguela, Monica Larissa Djomeni, Micha, Jean-Sébastien, Robach, Odile, Mourier, Thierry, Gergaud, Patrice, Bleuet, Pierre

    Published in Microelectronics and reliability (01-01-2016)
    “…In this work, we developed an original in-situ strain investigation of a Cu through silicon vias (TSVs) sample using X-ray μLaue diffraction mapping. We…”
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    Journal Article