Search Results - "Djomeni, Larissa"
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Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias
Published in Microelectronic engineering (25-05-2014)“…•The MOCVD TiN films are N-riched.•Plasma treatment changes the films from amorphous to 7nm crystal grain size.•The films have larger gap in Ti and N…”
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Journal Article Conference Proceeding -
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In-situ X-ray μLaue diffraction study of copper through-silicon vias
Published in Microelectronics and reliability (01-01-2016)“…In this work, we developed an original in-situ strain investigation of a Cu through silicon vias (TSVs) sample using X-ray μLaue diffraction mapping. We…”
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Journal Article