Search Results - "Dishongh, Terry"

A study of medication-taking and unobtrusive, intelligent reminding by Hayes, Tamara L, Cobbinah, Kofi, Dishongh, Terry, Kaye, Jeffrey A, Kimel, Janna, Labhard, Michael, Leen, Todd, Lundell, Jay, Ozertem, Umut, Pavel, Misha, Philipose, Matthai, Rhodes, Kevin, Vurgun, Sengul

“…Poor medication adherence is one of the major causes of illness and of treatment failure in the United States. The objective of this study was to conduct an…”
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Enabling affordable and efficiently deployed location based smart home systems by Kelly, Damian, McLoone, Sean, Dishongh, Terry

“…With the obvious eldercare capabilities of smart environments it is a question of "when", rather than "if", these technologies will be routinely integrated…”
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Thermo-Mechanical Challenges in Stacked Packaging by Agonafer, Dereje, Kaisare, Abhijit, Hossain, Mohammad M., Lee, Yongje, Dewan-Sandur, Bhavani P., Dishongh, Terry, Pekin, Senol

“…The convergence of computing and communications dictates building up rather than out. As consumers demand more functionality in their hand-held devices, the…”
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Thermo-Mechanical Challenges in Stacked Packaging: Recent topics in electronics cooling-From transistors to systems by AGONAFER, Dereje, KAISARE, Abhijit, HOSSAIN, Mohammad M, LEE, Yongje, DEWAN-SANDUR, Bhavani P, DISHONGH, Terry, PEKIN, Senol

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SELECTING A TEMPERATURE TIME HISTORY FOR PREDICTING FATIGUE LIFE OF MICROELECTRONICS SOLDER JOINTS by Basaran, Cemal, Dishongh, Terry, Zhao, Ying

“…Temperature cycling tests are standard industry practice for determining the thermomechanical fatigue life of solder joints. Industry-standard temperature…”
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The deployment of a non-intrusive alternative to sleep/wake wrist actigraphy in a home-based study of the elderly by Walsh, Lorcan, McLoone, Sean, Behan, Julie, Dishongh, Terry

“…This paper reports on experimental trials with an Under Mattress Bed Sensor (UMBS), an easily deployable, non-contact, low cost alternative to the actigraphy…”
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Reliability of stack packaging varying the die stacking architectures for flash memory applications by Hossain, M.M., Yongje Lee, Akhter, R., Agonafer, D., Pekin, S., Dishongh, T.

“…Thermal analysis on various die stacking architectures, which are commonly employed in semiconductor flash products shows that thermal issues are not dominant…”
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Single access point localisation for wearable wireless sensors by Kelly, Damian, McLoone, Sean, Logan, Beth, Dishongh, Terry

“…Knowledge of a subject's location and motion throughout an environment is of significant use to in-home health monitoring and activity recognition systems…”
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Experimental characterization of material degradation of solder joint under fatigue loading by Hong Tang, Basaran, C.

“…Thermal fatigue damage is a progressive process of material degradation. The objective of this study is to experimentally quantify the material degradation of…”
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A Bluetooth-based minimum infrastructure home localisation system by Kelly, D., McLoone, S., Dishongh, T.

“…Indoor location tracking is a function best suited to wireless LAN devices. This generally precludes it from home use in isolated rural areas, where WLAN is a…”
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Evaluation of Bluetooth Communications for the Deployment of Assisted Living Technologies in Home Environments by McGrath, M.J., Burns, A., Dishongh, T.

“…Using five different commercially available class one and class two Bluetooth dongles a total of seven homes which represented a cross section of typical Irish…”
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Single Access Point Location Tracking for In-Home Health Monitoring by Kelly, D., McLoone, S., Dishongh, T., McGrath, M., Behan, J.

“…There is a steady increase in the importance placed on location based systems, particularly in the field of elder care. The focus of this paper is on the…”
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Computational Modeling of the Reliability of Stacked Low Density Interconnects Devices by Hossain, M.M., Yongje Lee, Akhter, R., Agonafer, D., Dishongh, T.

“…As consumers demand more functions in their hand-held devices, the need for more memory in a limited space is increasing. Over the past few years, die stacking…”
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Thermal management of die stacking architecture that includes memory and logic processor by Dewan-Sandur, B.P., Kaisare, A., Agonafer, De, Agonafer, Da, Amon, C., Pekin, S., Dishongh, T.

“…The convergence of computing and communications dictates building up rather than out. As consumers demand more functions in their hand-held devices, the need…”
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Design for stackability of flash memory devices based on thermal optimization by Akhter, R., Sandur, B.P.D., Hossain, M., Kaisare, A., Agonafer, D., Lawrence, K., Dishongh, T.

“…Convergence of computing and communications dictates building up rather than out. As consumers demand more functions in their hand-held devices, the need for…”
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Impact of temperature cycle profile on fatigue life of solder joints by Dishongh, T., Basaran, C., Cartwright, A.N., Ying Zhao, Heng Liu

“…In this paper the influence of the temperature cycle time history profile on the fatigue life of ball grid array (BGA) solder joints is studied. Temperature…”
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