Search Results - "Dishongh, T.J."

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  1. 1

    In situ temperature measurements of PQFPs during infrared reflow by Dube, M., Dishongh, T.J., Beatty, K.E., Pecht, M.

    Published in Circuit world (01-12-1998)
    “…Temperature measurements using thermocouples are made at several locations on J-leaded plastic quad-flat packs and printed wiring boards during the reflow…”
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    Journal Article
  2. 2

    Innovative circuit board level routing designs for BGA packages by Titus, A., Jaiswal, B., Dishongh, T.

    Published in IEEE transactions on advanced packaging (01-11-2004)
    “…Advances in the performance of electronic devices have resulted in high input/output counts both at the chip and the package level, which has led to the…”
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    Journal Article
  3. 3

    Perspectives to understand risks in the electronic industry by Dasgupta, A., Magrab, E.B., Anand, D.K., Eisinger, K., McLeish, J.G., Torres, M.A., Lall, P., Dishongh, T.J.

    “…The key perspectives that reveal sources of risk in the electronics industry have been identified. The needs of the low-volume industry are found to be very…”
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    Journal Article