Search Results - "Dishongh, T.J."
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In situ temperature measurements of PQFPs during infrared reflow
Published in Circuit world (01-12-1998)“…Temperature measurements using thermocouples are made at several locations on J-leaded plastic quad-flat packs and printed wiring boards during the reflow…”
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2
Innovative circuit board level routing designs for BGA packages
Published in IEEE transactions on advanced packaging (01-11-2004)“…Advances in the performance of electronic devices have resulted in high input/output counts both at the chip and the package level, which has led to the…”
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Perspectives to understand risks in the electronic industry
Published in IEEE transactions on components, packaging, and manufacturing technology. Part A (01-12-1997)“…The key perspectives that reveal sources of risk in the electronics industry have been identified. The needs of the low-volume industry are found to be very…”
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