Search Results - "Dishongh, T."

Thermomechanical behavior of micron scale solder joints under dynamic loads by Zhao, Y, Basaran, C, Cartwright, A, Dishongh, T

“…Recent trends in reliability and fatigue life analysis of electronic devices have involved developing structural integrity models for predicting the operating…”
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In situ temperature measurements of PQFPs during infrared reflow by Dube, M., Dishongh, T.J., Beatty, K.E., Pecht, M.

“…Temperature measurements using thermocouples are made at several locations on J-leaded plastic quad-flat packs and printed wiring boards during the reflow…”
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Experimental evaluation of a single access point bluetooth localisation system by Kelly, D, McLoone, S, Dishongh, T

“…Location tracking is a wide field of research with many different solutions. One common trait of many of these solutions is the necessity for a large amount of…”
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Innovative circuit board level routing designs for BGA packages by Titus, A., Jaiswal, B., Dishongh, T.

“…Advances in the performance of electronic devices have resulted in high input/output counts both at the chip and the package level, which has led to the…”
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Thermomechanical behavior of BGA solder joints under vibrations: an experimental observation by Zhao, Y., Basaran, C., Cartwright, A., Dishongh, T.

“…Recent trends in reliability and fatigue life analysis of electronic devices have involved developing structural integrity models for predicting the operating…”
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Impact of temperature cycle profile on fatigue life of solder joints by Dishongh, T., Basaran, C., Cartwright, A.N., Ying Zhao, Heng Liu

“…In this paper the influence of the temperature cycle time history profile on the fatigue life of ball grid array (BGA) solder joints is studied. Temperature…”
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Thermomechanical analysis in electronic packaging with unified constitutive model for materials and joints by Desai, C.S., Basaran, C., Dishongh, T., Prince, J.L.

“…A unified constitutive modeling approach based on the disturbed state concept (DSC) provides improved characterization of thermomechanical response of joining…”
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Flow network modeling for improving flow distribution of microelectronics burn-in oven by Bin Lian, Dishongh, T., Pullen, D., Hongfei Yan, Jing Chen

“…Modern microelectronics, especially high performance microprocessors need to go through rigorous test and stressing to identify infant mortality failure. One…”
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Evaluation of factors affecting bonding rate of calcium phosphate ceramic coatings for in vivo strain gauge attachment by Szivek, John A., Anderson, Philip L., Dishongh, Terrance J., DeYoung, Donald W.

“…The aim of this study was to compare the bone‐bonding rates of eight calcium phosphate ceramic (CPC) coatings attached to strain gauges, alone and in…”
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SELECTING A TEMPERATURE TIME HISTORY FOR PREDICTING FATIGUE LIFE OF MICROELECTRONICS SOLDER JOINTS by Basaran, Cemal, Dishongh, Terry, Zhao, Ying

“…Temperature cycling tests are standard industry practice for determining the thermomechanical fatigue life of solder joints. Industry-standard temperature…”
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Reliability of stack packaging varying the die stacking architectures for flash memory applications by Hossain, M.M., Yongje Lee, Akhter, R., Agonafer, D., Pekin, S., Dishongh, T.

“…Thermal analysis on various die stacking architectures, which are commonly employed in semiconductor flash products shows that thermal issues are not dominant…”
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Experimental characterization of material degradation of solder joint under fatigue loading by Hong Tang, Basaran, C.

“…Thermal fatigue damage is a progressive process of material degradation. The objective of this study is to experimentally quantify the material degradation of…”
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i\In situ\-i\ temperature measurements of PQFPs during infrared reflow by Dube, M, Dishongh, T J, Beatty, K E, Pecht, M

“…This paper presents an experimental investigation where temperature measurements using thermocouples were made at several locations on J-leaded plastic…”
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Thermomechanical Behavior of Micron Scale Solder Joints: An Experimental Observation by Zhao, Y., Basaran, C., Cartwright, A., Dishongh, T.

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A Bluetooth-based minimum infrastructure home localisation system by Kelly, D., McLoone, S., Dishongh, T.

“…Indoor location tracking is a function best suited to wireless LAN devices. This generally precludes it from home use in isolated rural areas, where WLAN is a…”
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Evaluation of Bluetooth Communications for the Deployment of Assisted Living Technologies in Home Environments by McGrath, M.J., Burns, A., Dishongh, T.

“…Using five different commercially available class one and class two Bluetooth dongles a total of seven homes which represented a cross section of typical Irish…”
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Single Access Point Location Tracking for In-Home Health Monitoring by Kelly, D., McLoone, S., Dishongh, T., McGrath, M., Behan, J.

“…There is a steady increase in the importance placed on location based systems, particularly in the field of elder care. The focus of this paper is on the…”
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Computational Modeling of the Reliability of Stacked Low Density Interconnects Devices by Hossain, M.M., Yongje Lee, Akhter, R., Agonafer, D., Dishongh, T.

“…As consumers demand more functions in their hand-held devices, the need for more memory in a limited space is increasing. Over the past few years, die stacking…”
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Inelastic behavior of microelectronics solder joints under concurrent vibration and thermal cycling by Zhao, Y., Basaran, C., Cartwright, A., Dishongh, T.

“…Concurrent vibration and thermal environment is commonly encountered in the service life of electronic packaging, such as automotive, airplane, military and…”
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Thermal management of die stacking architecture that includes memory and logic processor by Dewan-Sandur, B.P., Kaisare, A., Agonafer, De, Agonafer, Da, Amon, C., Pekin, S., Dishongh, T.

“…The convergence of computing and communications dictates building up rather than out. As consumers demand more functions in their hand-held devices, the need…”
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