Search Results - "Detzel, Thomas"

A comparative micro-cantilever study of the mechanical behavior of silicon based passivation films by Matoy, Kurt, Schönherr, Helmut, Detzel, Thomas, Schöberl, Thomas, Pippan, Reinhard, Motz, Christian, Dehm, Gerhard

“…A comprehensive study on the mechanical behavior of plasma enhanced chemical vapor deposited silicon oxide, oxynitride and nitride thin films is provided…”
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Influence of Buffer Carbon Doping on Pulse and AC Behavior of Insulated-Gate Field-Plated Power AlGaN/GaN HEMTs by Verzellesi, Giovanni, Morassi, Luca, Meneghesso, Gaudenzio, Meneghini, Matteo, Zanoni, Enrico, Pozzovivo, Gianmauro, Lavanga, Simone, Detzel, Thomas, Haberlen, Oliver, Curatola, Gilberto

“…Pulse behavior of insulated-gate double-field-plate power AlGaN/GaN HEMTs with C-doped buffers showing small current-collapse effects and dynamic RDS,on…”
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Interface fracture properties of thin films studied by using the micro-cantilever deflection technique by Matoy, Kurt, Detzel, Thomas, Müller, Matthias, Motz, Christian, Dehm, Gerhard

“…The mechanical behavior of interfaces between silicon oxide and metallic thin films is investigated using an alternative approach which is based on the…”
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Micron-sized fracture experiments on amorphous SiOx films and SiOx/SiNx multi-layers by Matoy, Kurt, Schönherr, Helmut, Detzel, Thomas, Dehm, Gerhard

“…In this study miniaturized monolithic cantilevers of thermally grown silicon oxide and multi-layer cantilevers of plasma enhanced chemical vapor deposited…”
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On the temperature dependence of Na migration in thin SiO 2 films during ToF-SIMS O 2 + depth profiling by Krivec, Stefan, Detzel, Thomas, Buchmayr, Michael, Hutter, Herbert

“…The detection of Na in insulating samples by means of time of flight-secondary ion mass spectrometry (ToF-SIMS) depth profiling has always been a challenge. In…”
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The effect of bias-temperature stress on Na+ incorporation into thin insulating films by Krivec, Stefan, Buchmayr, Michael, Detzel, Thomas, Froemling, Till, Fleig, Juergen, Hutter, Herbert

“…The action of Na + incorporation into thin insulating films and transport therein under influence of a bias voltage and temperature (BT stress) is the subject…”
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On the temperature dependence of Na migration in thin SiO2 films during ToF-SIMS O2+ depth profiling by Krivec, Stefan, Detzel, Thomas, Buchmayr, Michael, Hutter, Herbert

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On the temperature dependence of Na migration in thin Si02 films during ToF-SIMS O2+ depth profiling by KRIVEC, Stefan, DETZEL, Thomas, BUCHMAYR, Michael, HUTTER, Herbert

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Erratum to: The effect of bias-temperature stress on [Na.sup.+] incorporation into thin insulating films by Krivec, Stefan, Buchmayr, Michael, Detzel, Thomas, Froemling, Till, Fleig, Juergen, Hatter, Herbert

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Erratum to: The effect of bias-temperature stress on Na+ incorporation into thin insulating films by Krivec, Stefan, Buchmayr, Michael, Detzel, Thomas, Froemling, Till, Fleig, Juergen, Hutter, Herbert

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The effect of bias-temperature stress on N[a.sup.+] incorporation into thin insulating films by Krivec, Stefan, Buchmayr, Michael, Detzel, Thomas, Froemling, Till, Fleig, Juergen, Hutter, Herbert

“…The action of N[a.sup.+] incorporation into thin insulating films and transport therein under influence of a bias voltage and temperature (BT stress) is the…”
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The effect of bias-temperature stress on Na+ incorporation into thin insulating films : Applied Surface Analysis by KRIVEC, Stefan, BUCHMAYR, Michael, DETZEL, Thomas, FROEMLING, Till, FLEIG, Juergen, HUTTER, Herbert

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Microscopic stress simulation of non-planar chip technologies by Zarbakhsh, Javad, Karunamurthy, Balamurugan, Trejo-Caballero, Carlos O., Barti, Endre, Detzel, Thomas

“…Finite element simulations were used to study the thermo-mechanical stress state at the chip corner in a chip–package system. Accurate geometry of a non-planar…”
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Modeling of stress evolution of electroplated Cu films during self-annealing by Rui Huang, Robl, Werner, Detzel, Thomas, Ceric, Hajdin

“…Electroplated Cu films are known to change their microstructure at room temperature due to the self-annealing effect. This recrystallization process results in…”
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The Commercialization of GaN Power Devices: Value Proposition, Manufacturing, and Reliability by Detzel, Thomas, Charles, Alain, Deboy, Gerald, Haeberlen, Oliver, McDonald, Timothy

“…Compact devices with unique switching performance, this has been the promise of GaN power devices since several years. After a development journey of more than…”
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Modeling of multi-temperature-cycle wafer curvature by Zarbakhsh, Javad, Lederer, Martin, Rui Huang, Detzel, Thomas, Weiss, Brigitte

“…A multi-temperature-cycle wafer curvature experiment was performed in order to study the temperature dependent material properties of copper films. The…”
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Disparate tendency of stress evolution of thin and thick electroplated Cu films at room temperature by Rui Huang, Robl, Werner, Dehm, Gerhard, Ceric, Hajdin, Detzel, Thomas

“…The self-annealing effect of electroplated copper films was investigated by measuring the time dependence of the film stress for different film thicknesses…”
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Prediction of wafer bow through thermomechanical simulation of patterned hard coated copper films by Zarbakhsh, J., Detzel, T., Rui Huang, Leicht, M., Nelle, P., Woehlert, S.

“…Due to the large difference in the coefficients of thermal expansion of the materials used in advanced semiconductor manufacturing, the fabrication process of…”
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Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing by Rui Huang, Robl, W., Ceric, H., Detzel, T., Dehm, G.

“…Electroplated copper films are known to change their microstructure due to the self-annealing effect. The self-annealing effect of electroplated copper films…”
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