Integration of tall triple-gate devices with inserted-Ta/sub x/N/sub y/ gate in a 0.274/spl mu/m/sup 2/ 6T-SRAM cell and advanced CMOS logic circuits
We present the fabrication process of a fully functional 0.274/spl mu/m2 6T-SRAM cell with inserted-Ta/sub x/N/sub y/ tall tripple gate devices. Several advancements over our previous report by A. Naekaerts et al. (2004) are: reduction of the 6T-SRAM cell size from 0.314 to 0.274/spl mu/m2 using fur...
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Published in: | Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005 pp. 106 - 107 |
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Main Authors: | , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , |
Format: | Conference Proceeding |
Language: | English |
Published: |
IEEE
2005
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Subjects: | |
Online Access: | Get full text |
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Summary: | We present the fabrication process of a fully functional 0.274/spl mu/m2 6T-SRAM cell with inserted-Ta/sub x/N/sub y/ tall tripple gate devices. Several advancements over our previous report by A. Naekaerts et al. (2004) are: reduction of the 6T-SRAM cell size from 0.314 to 0.274/spl mu/m2 using further litho process optimizations; insertion of 5nm TaN-based layer in the gate stack of the cell devices; improved OPC for CD control and integration of SRAM and logic. A high static noise margin of 216mV at 1.0V has been achieved with devices having a Lg=37nm. This is the smallest 6T-SRAM cell with MG devices reported so far. |
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ISBN: | 4900784001 9784900784000 |
ISSN: | 0743-1562 |
DOI: | 10.1109/.2005.1469230 |