Integration of tall triple-gate devices with inserted-Ta/sub x/N/sub y/ gate in a 0.274/spl mu/m/sup 2/ 6T-SRAM cell and advanced CMOS logic circuits

We present the fabrication process of a fully functional 0.274/spl mu/m2 6T-SRAM cell with inserted-Ta/sub x/N/sub y/ tall tripple gate devices. Several advancements over our previous report by A. Naekaerts et al. (2004) are: reduction of the 6T-SRAM cell size from 0.314 to 0.274/spl mu/m2 using fur...

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Published in:Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005 pp. 106 - 107
Main Authors: Witters, L., Collaert, N., Nackaerts, A., Demand, M., Demuynek, S., Delvaux, C., Lauwers, A., Baerts, C., Beckx, S., Bouilart, W., Brus, S., Degroote, B., de Marneffe, J.F., Dixit, A., De Meyer, K., Ercken, M., Goodwin, M., Hendrickx, E., Heylen, N., Jaenen, P., Laidler, D., Leray, P., Locorotondo, S., Maenhoudt, M., Moclants, M., Pollentier, I., Ronse, K., Rooyackers, R., Van Aelst, J., Vandenberghe, G., Vandeweyer, T., Vanhaelemeersch, S., Van Hove, M., Van Olmen, J., Verhaegen, S., Versluijs, J., Vrancken, C., Wiaux, V., Willems, P., Wouters, J., Jurezak, M., Biesemans, S.
Format: Conference Proceeding
Language:English
Published: IEEE 2005
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Summary:We present the fabrication process of a fully functional 0.274/spl mu/m2 6T-SRAM cell with inserted-Ta/sub x/N/sub y/ tall tripple gate devices. Several advancements over our previous report by A. Naekaerts et al. (2004) are: reduction of the 6T-SRAM cell size from 0.314 to 0.274/spl mu/m2 using further litho process optimizations; insertion of 5nm TaN-based layer in the gate stack of the cell devices; improved OPC for CD control and integration of SRAM and logic. A high static noise margin of 216mV at 1.0V has been achieved with devices having a Lg=37nm. This is the smallest 6T-SRAM cell with MG devices reported so far.
ISBN:4900784001
9784900784000
ISSN:0743-1562
DOI:10.1109/.2005.1469230