Search Results - "Dellmann, Laurent"

Projected phase-change memory devices by Koelmans, Wabe W., Sebastian, Abu, Jonnalagadda, Vara Prasad, Krebs, Daniel, Dellmann, Laurent, Eleftheriou, Evangelos

“…Nanoscale memory devices, whose resistance depends on the history of the electric signals applied, could become critical building blocks in new computing…”
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Changes in electrical transport and density of states of phase change materials upon resistance drift by Krebs, Daniel, Bachmann, Tobias, Jonnalagadda, Prasad, Dellmann, Laurent, Raoux, Simone

“…Phase-change memory technology has become more mature in recent years. But some fundamental problems linked to the electrical transport properties in the…”
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29.5- \hbox^ Recording Areal Density on Barium Ferrite Tape by Cherubini, Giovanni, Pantazi, Angeliki, Rothuizen, Hugo E., Berman, David, Imaino, Wayne, Jubert, Pierre-Olivier, McClelland, Gary, Koeppe, Peter V., Tsuruta, Kazuhiro, Harasawa, Takeshi, Murata, Yuto, Cideciyan, Roy D., Musha, Atsushi, Noguchi, Hitoshi, Ohtsu, Hiroki, Shimizu, Osamu, Suzuki, Ryota, Dellmann, Laurent, Eleftheriou, Evangelos, Haeberle, Walter, Jelitto, Jens, Kartik, Venkataraman, Lantz, Mark A., Olcer, Sedat

“…The recording performance of a new magnetic tape based on ultra-fine, perpendicularly-oriented BaFe particles was investigated. Specifically, using a low…”
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Oxygenated amorphous carbon for resistive memory applications by Santini, Claudia A., Sebastian, Abu, Marchiori, Chiara, Jonnalagadda, Vara Prasad, Dellmann, Laurent, Koelmans, Wabe W., Rossell, Marta D., Rossel, Christophe P., Eleftheriou, Evangelos

“…Carbon-based electronics is a promising alternative to traditional silicon-based electronics as it could enable faster, smaller and cheaper transistors,…”
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Applications of SOI-based optical MEMS by Noell, W., Clerc, P.-A., Dellmann, L., Guldimann, B., Herzig, H.-P., Manzardo, O., Marxer, C.R., Weible, K.J., Dandliker, R., de Rooij, N.

“…After microelectromechanical systems (MEMS) devices have been well established, components of higher complexity are now developed. Particularly, the…”
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29.5- hbox Gb / in 2 Recording Areal Density on Barium Ferrite Tape by Cherubini, Giovanni, Cideciyan, Roy D, Dellmann, Laurent, Eleftheriou, Evangelos, Haeberle, Walter, Jelitto, Jens, Kartik, Venkataraman, Lantz, Mark A, Olcer, Sedat, Pantazi, Angeliki, Rothuizen, Hugo E, Berman, David, Imaino, Wayne, Jubert, Pierre-Olivier, McClelland, Gary, Koeppe, Peter V, Tsuruta, Kazuhiro, Harasawa, Takeshi, Murata, Yuto, Musha, Atsushi, Noguchi, Hitoshi, Ohtsu, Hiroki, Shimizu, Osamu, Suzuki, Ryota

“…The recording performance of a new magnetic tape based on ultra-fine, perpendicularly-oriented BaFe particles was investigated. Specifically, using a low…”
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29.5-[Formula Omitted] Recording Areal Density on Barium Ferrite Tape by Cherubini, Giovanni, Cideciyan, Roy D, Dellmann, Laurent, Eleftheriou, Evangelos, Haeberle, Walter, Jelitto, Jens, Kartik, Venkataraman, Lantz, Mark A, Olcer, Sedat, Pantazi, Angeliki, Rothuizen, Hugo E, Berman, David, Imaino, Wayne, Jubert, Pierre-Olivier, McClelland, Gary, Koeppe, Peter V, Tsuruta, Kazuhiro, Harasawa, Takeshi, Murata, Yuto, Musha, Atsushi, Noguchi, Hitoshi, Ohtsu, Hiroki, Shimizu, Osamu, Suzuki, Ryota

“…The recording performance of a new magnetic tape based on ultra-fine, perpendicularly-oriented BaFe particles was investigated. Specifically, using a low…”
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Fabrication process of high aspect ratio elastic and SU-8 structures for piezoelectric motor applications by Dellmann, L., Roth, S., Beuret, C., Racine, G.-A., Lorenz, H., Despont, M., Renaud, P., Vettiger, P., de Rooij, N.F.

“…We report on recent advances in micro fabrication technology using micromolding and high aspect ratio structuring of photopolymer. The direct application is…”
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29.5-Gb/in2 Recording Areal Density on Barium Ferrite Tape by CHERUBINI, Giovanni, CIDECIYAN, Roy D, ROTHUIZEN, Hugo E, BERMAN, David, IMAINO, Wayne, JUBERT, Pierre-Olivier, MCCLELLAND, Gary, KOEPPE, Peter V, TSURUTA, Kazuhiro, HARASAWA, Takeshi, MURATA, Yuto, MUSHA, Atsushi, DELLMANN, Laurent, NOGUCHI, Hitoshi, OHTSU, Hiroki, SHIMIZU, Osamu, SUZUKI, Ryota, ELEFTHERIOU, Evangelos, HAEBERLE, Walter, JELITTO, Jens, KARTIK, Venkataraman, LANTZ, Mark A, ÖLCER, Sedat, PANTAZI, Angeliki

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Polymer-Waveguide-Based Board-Level Optical Interconnect Technology for Datacom Applications by Dangel, R., Berger, C., Beyeler, R., Dellmann, L., Gmur, M., Hamelin, R., Horst, F., Lamprecht, T., Morf, T., Oggioni, S., Spreafico, M., Offrein, B.J.

“…On the basis of a realized 12times10 Gb/s card-to-card optical link demonstrator, the capabilities of a polymer-waveguide-based board-level optical…”
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Design and implementation of an optical interconnect demonstrator with board-integrated waveguides and microlens coupling by Berger, C., Bapst, U., Bona, G.-L., Dangel, R., Dellmann, L., Dill, P., Kossel, M.A., Morf, T., Offrein, B., Schmatz, M.L.

“…We discuss some of the trade-offs that we are facing when choosing design parameters for future optical backplane interconnects. We present some of our current…”
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Polymer-Waveguide-Based Board-Level Optical Interconnect Technology for Datacom Applications : Electrical performance analysis and simulation of interconnects, packages and devices composing electronic systems for high performance applications by DANGEL, Roger, BERGER, Christoph, SPREAFICO, Mauro, JAN OFFREIN, Bert, BEYELER, René, DELLMANN, Laurent, GMÜR, Max, HAMELIN, Régis, HORST, Folkert, LAMPRECHT, Tobias, MORF, Thomas, OGGIONI, Stefano

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Low-loss copper film ion-exchanged optical waveguides with step-like index profiles in glass by Lehky, J.-M., Erni, D., Robin, F., Dellmann, L., Dangel, R., Offrein, B.J., Bachtold, W.

“…Copper-film ion-exchange in glass is highly promising for fabricating optical waveguides. Enhanced steepness of the refractive index profile results from…”
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Optical links for printed circuit boards by Berger, C., Beyeler, R., Bona, G.-L., Dangel, R., Dellmann, L., Dill, P., Horst, F., Kossel, M.A., Menolfi, C., Morf, T., Offrein, B., Schmatz, M.L., Toifl, T., Weiss, J.

“…We identify applications for optics-enabled printed circuit boards, together with a list of requirements that have to be met for real-world products. We draw…”
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