Search Results - "Deleonibus, Simon"

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  1. 1

    Looking into the future of Nanoelectronics in the Diversification Efficient Era by Deleonibus, Simon

    Published in Science China. Information sciences (01-06-2016)
    “…The linear scaling of CMOS has encountered, since its beginning, many hurdles which request new process modules, driven mainly by the maximization of energy…”
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    Journal Article
  2. 2

    The Energy and Variability Efficient Era (E.V.E.) is Ahead of Us by Deleonibus, Simon

    “…Major power consumption reduction will drive future design of technologies and architectures that will request less greedy devices and interconnect systems…”
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    Journal Article
  3. 3

    Ultra-thin films and multigate devices architectures for future CMOS scaling by Deleonibus, Simon

    Published in Science China. Information sciences (01-05-2011)
    “…The nanoelectronics industry is facing historical challenges to scale down CMOS devices to meet demands for low voltage, low power, high performance and…”
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    Journal Article
  4. 4

    Size Dependence of Surface-Roughness-Limited Mobility in Silicon-Nanowire FETs by Poli, S., Pala, M.G., Poiroux, T., Deleonibus, S., Baccarani, G.

    Published in IEEE transactions on electron devices (01-11-2008)
    “…Lateral size effects on surface-roughness-limited mobility in silicon-nanowire FETs are analyzed by means of a full- quantum 3-D self-consistent simulation. A…”
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    Journal Article
  5. 5

    Experimental Investigation on the Quasi-Ballistic Transport: Part I-Determination of a New Backscattering Coefficient Extraction Methodology by Barral, V., Poiroux, T., Saint-Martin, J., Munteanu, D., Autran, J.-L., Deleonibus, S.

    Published in IEEE transactions on electron devices (01-03-2009)
    “…A new fully experimental method to determine the backscattering coefficient and the ballistic ratio of n- and p-FDSOI and multigate nanodevices is proposed in…”
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    Journal Article
  6. 6

    Foreword by Deleonibus, Simon

    Published in Solid-state electronics (01-04-2007)
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    Journal Article
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    Editor's note by Ru HUANG Hiroshi IWAI Cor CLAEYS Simon DELEONIBUS Runsheng WANG

    “…Over the past 50 years,the microelectronics technology has recognized rapid development,resulting in a successful Si-based integrated circuit(IC)industry,with…”
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    Journal Article
  11. 11

    Towards a World of More Functions in Integrated Sustainable Systems by Deleonibus, Simon

    “…Major power consumption reduction will drive future design of technologies and architectures that will request less greedy devices and interconnect systems…”
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    Conference Proceeding
  12. 12

    Experimental Investigation on the Quasi-Ballistic Transport: Part II-Backscattering Coefficient Extraction and Link With the Mobility by Barral, V., Poiroux, T., Munteanu, D., Autran, J.-L., Deleonibus, S.

    Published in IEEE transactions on electron devices (01-03-2009)
    “…Using a new extraction methodology taking into account multisubband population and carrier degeneracy, we have experimentally determined backscattering…”
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    Journal Article
  13. 13

    Differential body effect analysis and optimization of the LArge Tilt Implanted Sloped Shallow Trench Isolation Process (LATI-STI) by DELEONIBUS, S, HEITMANN, M, GOBIL, Y, MARTIN, F, DEMOLLIENS, O, GUIBERT, J.-C, TOFFOLI, A

    Published in Japanese Journal of Applied Physics (01-08-1996)
    “…The optimization of a LArge Tilt Implanted Sloped shallow Trench Isolation (LATI-STI) process for Non Volatile Memories is presented. The process uses 70°…”
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    Journal Article
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    High pressure high temperature steam oxidation poly buffer LOCOS (HP-HTPBL) field isolation process for reduced encroachment and low stress by DELEONIBUS, S, MARTIN, F, KIM, S. S, EMAMI, A, FLORIN, B, HEITZMANN, M, LEROUX, C

    Published in Japanese Journal of Applied Physics (01-09-1996)
    “…The characterization of High Pressure-High Temperature Poly Buffer LOCOS (HP-HTPBL) isolation for 0.2 µ m design rules Non Volatile Memories is presented…”
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    Journal Article
  15. 15

    Experimental evaluation of gate architecture influence on DG SOI MOSFETs performance by Widiez, J., Lolivier, J., Vinet, M., Poiroux, T., Previtali, B., Dauge, F., Mouis, M., Deleonibus, S.

    Published in IEEE transactions on electron devices (01-08-2005)
    “…Using a novel process flow, we managed to cointegrate several devices on the same wafer; single gate (SG), ground plane (GP), perfectly aligned double gate…”
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    Journal Article
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    On the mobility in high- κ/metal gate MOSFETs: Evaluation of the high- κ phonon scattering impact by Weber, Olivier, Cassé, Mikael, Thevenod, Laurent, Ducroquet, Frédérique, Ernst, Thomas, Deleonibus, Simon

    Published in Solid-state electronics (01-04-2006)
    “…We report an experimental study of the mobility in TiN/HfO 2 gate stacks focused on the accurate determination of the HfO 2 remote soft phonon scattering…”
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    Journal Article
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    Multi-Channel Field-Effect Transistor (MCFET)-Part I: Electrical Performance and Current Gain Analysis by Bernard, E., Ernst, T., Guillaumot, B., Vulliet, N., Coronel, P., Skotnicki, T., Deleonibus, S., Faynot, O.

    Published in IEEE transactions on electron devices (01-06-2009)
    “…Multi-Channel Field-Effect Transistor (MCFET) structures with ultralow I OFF (16 pA/mum) and high I ON (N: 2.27 mA/mum and P: 1.32 mA/mum) currents are…”
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    Journal Article
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    Integration of diamond in fully-depleted silicon-on-insulator technology as buried insulator: A theoretical analysis by Mazellier, Jean-Paul, Faynot, Olivier, Cristoloveanu, Sorin, Deleonibus, Simon, Bergonzo, Philippe

    Published in Diamond and related materials (01-07-2008)
    “…We examine here by electro-thermal simulation tools (SILVACO's Atlas) a configuration of Silicon-On-Insulator substrate for Fully-Depleted MOSFET…”
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    Journal Article Conference Proceeding
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    Static and Dynamic TCAD Analysis of IMOS Performance: From the Single Device to the Circuit by Mayer, F., Le Royer, C., Le Carval, G., Clavelier, L., Deleonibus, S.

    Published in IEEE transactions on electron devices (01-08-2006)
    “…Impact ionization MOSFET (IMOS) is a device that enables to reach subthreshold slopes as small as 5 mV/dec. This device has an asymmetric doping profile, and…”
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    Journal Article