Search Results - "Dehé, Alfons"
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1
Dual-Backplate CMUTs with Wide Bandwidth and Low Driving Voltage for Airborne Applications
Published in IEEE transactions on ultrasonics, ferroelectrics, and frequency control (01-10-2023)“…In this work, novel airborne capacitive micromachined ultrasonic transducers (CMUTs) based on a dual-backplate (DBP) technology are presented. In contrast to…”
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Journal Article -
2
Acoustic Transmission Measurements for Extracting the Mechanical Properties of Complex 3D MEMS Transducers
Published in Micromachines (Basel) (24-08-2024)“…Recent publications on acoustic MEMS transducers present a new three-dimensional folded diaphragm that utilizes buried in-plane vibrating structures to…”
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3
Acoustic transmission line based modelling of microscaled channels and enclosures
Published in The Journal of the Acoustical Society of America (01-02-2019)“…An analytical model is presented that describes the acoustical impedance of cylindrical tubes and concentrically connected systems of such tubes valid up to…”
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Journal Article -
4
Modeling and physical analysis of an out-of-plane capacitive MEMS transducer with dynamically coupled electrodes
Published in Microsystem technologies : sensors, actuators, systems integration (01-06-2022)“…This paper presents a physics-based system-level compact model of a novel out-of-plane capacitive MEMS transducer for detection of mechanical forces, pressure…”
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5
Silicon microphone development and application
Published in Sensors and actuators. A. Physical. (12-02-2007)“…This paper gives an overview of the development of Silicon microphones fabricated in a standard BiCMOS process line of Infineon. MEMS development results in…”
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6
AC transfer function of electrostatic capacitive sensors based on the 1-D equivalent model: application to silicon microphones
Published in Journal of microelectromechanical systems (01-12-2003)“…Parallel plate electrostatic transducers can be described with the one-dimensional (1-D) lumped model. The one-dimensional approximation based on the elastic,…”
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Journal Article -
7
Improved Mounting of Strain Sensors by Reactive Bonding
Published in Journal of materials engineering and performance (2021)“…Aim of this work is to improve the bond between a strain sensor and a device on which the strain shall be determined. As strain sensor, a CMOS-integrated chip…”
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Journal Article -
8
Plasma techniques in the production of customized MEMS‐applications
Published in Plasma processes and polymers (01-09-2019)“…Micro electromechanical systems (MEMS) have found their way into many kinds of applications. Especially sensors are daily used by each of us in products like…”
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9
Sensor-Based Nerve Compression Measurement: A Scoping Review of Current Concepts and a Preclinical Evaluation of Commercial Microsensors
Published in Frontiers in bioengineering and biotechnology (11-07-2022)“…Background: Chronic nerve compression is the most common indication for nerve surgery. However, the clinical diagnosis still relies on surrogate parameters…”
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10
Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation
Published in Microsystem technologies : sensors, actuators, systems integration (01-03-2016)“…The fracture strength of poly-silicon as widely used membrane material in micro electro mechanical system applications has a critical impact in respect to…”
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11
Multi field modeling of a microelectromechanical speaker system with electrostatic driving principle
Published in Microsystem technologies (01-04-2014)“…The need for computer modeling tools capable of precisely simulating multi-field interactions is increasing. The accurate modeling of an electrostatically…”
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Journal Article Conference Proceeding -
12
Constant charge operation of capacitor sensors based on switched-current circuits
Published in IEEE sensors journal (01-12-2003)“…A new method to perform the readout of capacitive sensors is presented in this paper. The sensitivity of integrated capacitive sensors is investigated and…”
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Journal Article -
13
Design of a poly silicon MEMS microphone for high signal-to-noise ratio
Published in 2013 Proceedings of the European Solid-State Device Research Conference (ESSDERC) (01-09-2013)“…This paper reports on the state of the art silicon micromachined microphone utilizing a dual poly silicon membrane system. MEMS chips from 1.4mm down to 1.0mm…”
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Conference Proceeding -
14
Properties of InGaAs/InP thermoelectric and surface bulk micromachined infrared sensors
Published in Applied physics letters (11-11-1996)“…We present a concept for the realization of InGaAs/InP micromachined thermoelectric sensors. The advantages of InGaAs lattice matched to InP combine perfectly…”
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15
Low Power Capacitive Ultrasonic Transceiver Array for Airborne Object Detection
Published in 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) (01-01-2020)“…This work presents a low power ultrasonic transceiver line array enabling energy efficient airborne object detection. The line array is based on capacitive…”
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Conference Proceeding -
16
A novel silicon "star-comb" microphone concept for enhanced signal-to-noise-ratio: Modeling, design and first prototype
Published in 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) (01-06-2017)“…A novel comb-structure-based, capacitive MEMS microphone concept is proposed, which is expected to significantly reduce viscous damping losses, challenging the…”
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Conference Proceeding -
17
A Non-Linear Lumped Model for the Electro-Mechanical Coupling in Capacitive MEMS Microphones
Published in Journal of microelectromechanical systems (01-06-2021)“…This work provides an analytical non-linear model for the capacitive transduction in MEMS transducers with perforated counter-electrodes, especially applicable…”
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18
Broadband thermoelectric microwave power sensors using GaAs foundry process
Published in 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278) (2002)“…The paper presents the first demonstration of an integrated MMIC compatible thermoelectric microwave power sensor for frequencies between 1 to 20 GHz using a…”
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Conference Proceeding Journal Article -
19
Analytical analysis and finite element simulation of advanced membranes for silicon microphones
Published in IEEE sensors journal (01-10-2005)“…In this paper, advanced membrane designs are simulated in order to improve the sensitivity of micromachined silicon condenser microphones. Analytical analyzes…”
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Journal Article -
20
Design and Characterization of Macroscopic Indirect Photoacoustic Gas Sensor
Published in 2022 IEEE Sensors (30-10-2022)“…A macroscopic photoacoustic gas sensing (PAS) system, along with the design considerations, are presented in this paper. The system is based on the indirect…”
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Conference Proceeding