Search Results - "Debecker, B."

  • Showing 1 - 10 results of 10
Refine Results
  1. 1

    Two-dimensional discrete element simulations of the fracture behaviour of slate by Debecker, B., Vervoort, A.

    “…The fracture behaviour of slate, which is a transversely isotropic rock with a (extreme) large strength anisotropy, is investigated. Two-dimensional discrete…”
    Get full text
    Journal Article
  2. 2

    Experimental observation of fracture patterns in layered slate by Debecker, B., Vervoort, A.

    Published in International journal of fracture (01-09-2009)
    “…The layered structure of slate rock induces strength anisotropy. The strength in the direction of the layers (schistosity) is considerably smaller than in any…”
    Get full text
    Journal Article
  3. 3

    Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling by Vandevelde, Bart, Ivankovic, A., Debecker, B., Lofrano, M., Vanstreels, K., Guo, W., Cherman, V., Gonzalez, M., Van der Plas, G., De Wolf, I., Beyne, E., Tokei, Z.

    Published in Microelectronics and reliability (01-06-2014)
    “…•Analytical modelling, FEM simulations and 4 point bending for BEOL strength analysis.•Reduced low-k stiffness results in exponential growth of stress in Cu…”
    Get full text
    Journal Article Conference Proceeding
  4. 4

    Current situation, trends and potential of renewable energy in Flanders by Tolón-Becerra, A., Lastra-Bravo, X.B., Steenberghen, T., Debecker, B.

    Published in Renewable & sustainable energy reviews (01-12-2011)
    “…The current European Union (EU) energy policy seeks to reach a balance between sustainable development, competitiveness and secure supply. In this sense, the…”
    Get full text
    Journal Article
  5. 5
  6. 6

    Influence of organizational factors on the offer and success rate of a trial of labor after cesarean section in Belgium: an ecological study by Vandenberghe, Griet, Vercoutere, An, Cuvellier, Nadège, Van Oost, Elke, Leroy, Charlotte, Goemaes, Régine, Laubach, Monika, Boulvain, Michel, Daelemans, Caroline, Ackermans, J., Anton, D., Bafort, M., Batter, A., Belhomme, J., Beliard, A., Bollen, B., Boon, V., Bosteels, J., Bracke, V., Ceysens, G., Chaban, F., Chantraine, F., Christiaensen, E., Clabout, L., Cryns, P., Dallequin, M.-C., De Keersmaecker, B., De Keyser, J., De Knijf, A., Scheir, P., De Loose, J., De Vits, A., De Vos, T., Debecker, B., Delforge, C., Deloor, J., Depauw, V., Depierreux, A., Devolder, K., Claes, L., Dirx, S., Eerdekens, C., Emonts, P., Goenen, E., Grandjean, P., Hollemaert, S., Houben, S., Jankelevitch, E., Janssen, G., Quitnelier, J., Kacem, Y., Klay, C., Laurent, A., Legrève, J.-F., Lestrade, A., Lietaer, C., Loccufier, A., Logghe, H., Loumaye, F., Mariman, V., Minten, N., Mortier, D., Mulders, K., Palgen, G., Pezin, T., Polisiou, K., Riera, C., Romain, M., Rombaut, B., Ruymbeke, M., Scharpé, K., Schockaert, C., Segers, A., Serkei, E., Steenhaut, P., Steylemans, A., Thaler, B., Van Dalen, W., Van De Poel, E., Van Deynse, E., Van Dijck, R., Van Holsbeke, C., Van Hoorick, L., Van Olmen, G., Vanballaer, P., Vancalsteren, K., Vandeginste, S., Vandepitte, S., Verbeken, K., Vereecke, A., Verheecke, M., Watkins-Masters, L., Wijckmans, V., Wuyts, K.

    Published in BMC pregnancy and childbirth (22-09-2023)
    “…Abstract Background Trial of Labor After Cesarean is an important strategy for reducing the overall rate of cesarean delivery. Offering the option of vaginal…”
    Get full text
    Journal Article
  7. 7

    Delamination in BEOL: Analysis of interface failure by combined experimental & modeling approaches by Debecker, B., Vanstreels, K., Gonzalez, M., Vandevelde, B.

    “…It is demonstrated that the widely used equation to derive the adhesive strength from the external load in a 4 point bending test has a certain error by taking…”
    Get full text
    Conference Proceeding
  8. 8

    Chip package interaction (CPI): Thermo mechanical challenges in 3D technologies by Gonzalez, M., Vandevelde, B., Ivankovic, A., Cherman, V., Debecker, B., Lofrano, M., De Wolf, I., Beyer, G., Swinnen, B., Tokei, Z., Beyne, E.

    “…The residual stresses generated during different processing steps and during thermal cycling of 3D stack packages, mimicking its service life, are quantified…”
    Get full text
    Conference Proceeding
  9. 9

    Strength analysis of advanced node BEOL under CPI induced stresses by Debecker, B., Vanstreels, K., Gonzalez, M., Vandevelde, B., Tokei, Z.

    “…At nanoscale level, the strength of the BEOL is determined by two competing failure mechanisms: adhesive failure (delamination) at the different interfaces and…”
    Get full text
    Conference Proceeding
  10. 10

    IC-Package Interaction by Vandevelde, B., Ivankovic, A., Debecker, B., Lofrano, M., Vanstreels, K., Guo, W., Cherman, V., Gonzalez, M., Van der Plas, G., De Wolf, I., Beyne, E., Tokei, Z.

    “…Chip Package Interaction (CPI) gained a lot of importance in the last years. The reason is twofold. First, advanced node IC technologies requires dielectrics…”
    Get full text
    Conference Proceeding