Search Results - "De Moor, Piet"

Light-In-Flight Imaging by a Silicon Image Sensor: Toward the Theoretical Highest Frame Rate by Etoh, Takeharu Goji, Okinaka, Tomoo, Takano, Yasuhide, Takehara, Kohsei, Nakano, Hitoshi, Shimonomura, Kazuhiro, Ando, Taeko, Ngo, Nguyen, Kamakura, Yoshinari, Dao, Vu Truon Son, Nguyen, Anh Quang, Charbon, Edoardo, Zhang, Chao, De Moor, Piet, Goetschalckx, Paul, Haspeslagh, Luc

“…Light in flight was captured by a single shot of a newly developed backside-illuminated multi-collection-gate image sensor at a frame interval of 10 ns without…”
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Thin-Film Quantum Dot Photodiode for Monolithic Infrared Image Sensors by Malinowski, Pawel E, Georgitzikis, Epimitheas, Maes, Jorick, Vamvaka, Ioanna, Frazzica, Fortunato, Van Olmen, Jan, De Moor, Piet, Heremans, Paul, Hens, Zeger, Cheyns, David

“…Imaging in the infrared wavelength range has been fundamental in scientific, military and surveillance applications. Currently, it is a crucial enabler of new…”
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An Image Signal Accumulation Multi-Collection-Gate Image Sensor Operating at 25 Mfps with 32 × 32 Pixels and 1220 In-Pixel Frame Memory by Dao, Vu Truong Son, Ngo, Nguyen, Nguyen, Anh Quang, Morimoto, Kazuhiro, Shimonomura, Kazuhiro, Goetschalckx, Paul, Haspeslagh, Luc, De Moor, Piet, Takehara, Kohsei, Etoh, Takeharu Goji

“…The paper presents an ultra-high-speed image sensor for motion pictures of reproducible events emitting very weak light. The sensor is backside-illuminated…”
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Impact of the limitations of state-of-the-art micro-fabrication processes on the performance of pillar array columns for liquid chromatography by Op de Beeck, Jeff, De Malsche, Wim, Tezcan, Deniz S., De Moor, Piet, Desmet, Gert

“…► Pillar array columns with inter pillar distances down to 0.23μm were fabricated. ► Micro-fabrication limitations were investigated by means of SEM. ► Column…”
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Hydrodynamic chromatography separations in micro- and nanopillar arrays produced using deep-UV lithography by Op de Beeck, Jeff, De Malsche, Wim, De Moor, Piet, Desmet, Gert

“…We report on a series of hydrodynamic chromatography separations conducted in micropillar array columns with an interpillar distance spacing of, respectively,…”
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High-density hybrid interconnect methodologies by John, Joachim, Zimmermann, Lars, Moor, Piet De, Hoof, Chris Van

“…The ultra-high-density hybrid flip–chip integration of an array of detectors and its dedicated readout electronics can be achieved not only with a variety of…”
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3D integration technologies for imaging applications by De Moor, Piet

“…The aim of this paper is to give an overview of micro-electronic technologies under development today, and how they are impacting on the radiation detection…”
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Through-silicon via and die stacking technologies for microsystems-integration by Beyne, E., De Moor, P., Ruythooren, W., Labie, R., Jourdain, A., Tilmans, H., Tezcan, D.S., Soussan, P., Swinnen, B., Cartuyvels, R.

“…The highest integration density of microsystems can be obtained using a 3D-stacking approach, where each layer of the stack is realized using a different…”
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The RELAXd project: Development of four-side tilable photon-counting imagers by Vykydal, Zdenek, Visschers, Jan, Tezcan, Deniz Sabuncuoglu, De Munck, Koen, Borgers, Tom, Ruythooren, Wouter, De Moor, Piet

“…The feasibility of using photon-counting imaging techniques with X-rays, neutrons or other types of radiation for many applications in materials analysis and…”
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Extreme ultraviolet detection using AlGaN-on-Si inverted Schottky photodiodes by Malinowski, Pawel E., Duboz, Jean-Yves, De Moor, Piet, Minoglou, Kyriaki, John, Joachim, Horcajo, Sara Martin, Semond, Fabrice, Frayssinet, Eric, Verhoeve, Peter, Esposito, Marco, Giordanengo, Boris, BenMoussa, Ali, Mertens, Robert, Van Hoof, Chris

“…We report on the fabrication of aluminum gallium nitride (AlGaN) Schottky diodes for extreme ultraviolet (EUV) detection. AlGaN layers were grown on silicon…”
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AlGaN-on-Si-Based 10-μm Pixel-to-Pixel Pitch Hybrid Imagers for the EUV Range by MALINOWSKI, Pawel E, DUBOZ, Jean-Yves, KROTH, Udo, GOTTWALD, Alexander, LAUBIS, Christian, MERTENS, Robert, VAN HOOF, Chris, DE MOOR, Piet, JOHN, Joachim, MINOGLOU, Kyriaki, SRIVASTAVA, Puneet, SEMOND, Fabrice, FRAYSSINET, Eric, GIORDANENGO, Boris, BENMOUSSA, Ali

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Hydrodynamic chromatography separations in micro- and nanopillar arrays produced using deep-UV lithography (J. Sep. Science 35'15) by Op de Beeck, Jeff, De Malsche, Wim, De Moor, Piet, Desmet, Gert

“…DOI: 10.1002/jssc.201200076 Micro‐pillar array columns with an inter‐pillar spacing down to 500 nm have been designed and fabricated enabling hydrodynamic…”
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First Demonstration of Hybrid CMOS Imagers With Simultaneous Very Low Crosstalk and High-Broadband Quantum Efficiency by Minoglou, K., De Munck, K., De Vos, J., Tezcan, D. S., Van Hoof, C., De Moor, P.

“…One key challenge in the development of backside-illuminated CMOS imagers is to keep crosstalk (XT) low while enabling high quantum efficiency (QE). In this…”
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AlGaN-on-Si-Based 10- mu hbox m Pixel-to-Pixel Pitch Hybrid Imagers for the EUV Range by Malinowski, Pawel E, Duboz, Jean-Yves, De Moor, Piet, John, Joachim, Minoglou, Kyriaki, Srivastava, Puneet, Semond, Fabrice, Frayssinet, Eric, Giordanengo, Boris, BenMoussa, Ali, Kroth, Udo, Gottwald, Alexander, Laubis, Christian, Mertens, Robert, Van Hoof, Chris

“…We report on the fabrication of extreme ultraviolet (EUV) hybrid imagers with backside-illuminated detector chip based on aluminum gallium nitride (AlGaN)…”
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AlGaN-on-Si-Based 10-[Formula Omitted] Pixel-to-Pixel Pitch Hybrid Imagers for the EUV Range by Malinowski, Pawel E, Duboz, Jean-Yves, De Moor, Piet, John, Joachim, Minoglou, Kyriaki, Srivastava, Puneet, Semond, Fabrice, Frayssinet, Eric, Giordanengo, Boris, BenMoussa, Ali, Kroth, Udo, Gottwald, Alexander, Laubis, Christian, Mertens, Robert, Van Hoof, Chris

“…We report on the fabrication of extreme ultraviolet (EUV) hybrid imagers with backside-illuminated detector chip based on aluminum gallium nitride (AlGaN)…”
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High performance Hybrid and Monolithic Backside Thinned CMOS Imagers realized using a new integration process by De Munck, K., Sabuncuoglu Tezcan, D., Borgers, T., Ruythooren, W., De Moor, P., Sedky, S., Toccafondi, C., Bogaerts, J., Van Hoof, C.

“…Hybrid and monolithic thinned backside illuminated CMOS imagers operating at full depletion at low substrate voltages were developed. The combination of a 50…”
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AlGaN-on-Si-Based 10- \mu\hbox Pixel-to-Pixel Pitch Hybrid Imagers for the EUV Range by Malinowski, P. E., Duboz, J., De Moor, P., John, J., Minoglou, K., Srivastava, P., Semond, F., Frayssinet, E., Giordanengo, B., BenMoussa, A., Kroth, U., Gottwald, A., Laubis, C., Mertens, R., Van Hoof, C.

“…We report on the fabrication of extreme ultraviolet (EUV) hybrid imagers with backside-illuminated detector chip based on aluminum gallium nitride (AlGaN)…”
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Backside-Illuminated GaN-on-Si Schottky Photodiodes for UV Radiation Detection by Malinowski, P.E., John, J., Duboz, J.Y., Hellings, G., Lorenz, A., Madrid, J.G.R., Sturdevant, C., Cheng, K., Leys, M., Derluyn, J., Das, J., Germain, M., Minoglou, K., De Moor, P., Frayssinet, E., Semond, F., Hochedez, J.-F., Giordanengo, B., Mertens, R.

“…In this letter, we report on the fabrication of near-ultraviolet photodetectors based on gallium nitride (GaN) layers grown on a Si(111) substrate…”
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Influence of Extreme Thinning on 130-nm Standard CMOS Devices for 3-D Integration by De Munck, K., Chiarella, T., De Moor, P., Swinnen, B., Van Hoof, C.

“…The influence of thinning standard 130-nm CMOS technology device wafers to residual silicon thicknesses of 20 and 5 mum has been studied. Electrical…”
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Multispectral CCD-in-CMOS Time Delay Integration imager for high resolution Earth observation by Mahato, Swaraj Bandhu, Thijs, Steven, Bentell, Jonas, Wu, Linkun, Tack, Klaas, Boulenc, Pierre, Lasnet, Dorian, Van Langendonck, Renaud, De Moor, Piet

“…Many future small satellite missions are aimed to provide low-cost remote sensing data at unprecedented revisit rates, with a ground resolution of less than…”
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