Effect of Bismuth Addition on Physical Properties of Sn-Zn Lead-Free Solder Alloy

Effect of Bismuth Addition on Physical Properties of Sn-Zn Lead-Free Solder Alloy

The aim of this work is to improve the properties of eutectic Sn-9Zn solder alloy by adding different amounts of bismuth to produce alternate lead-free solder alloys for use in electronic applications. Phase identification of the various solders was performed by x-ray diffraction analysis. Scanning...

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Bibliographic Details
Published in:Journal of electronic materials Vol. 48; no. 12; pp. 8089 - 8095
Main Authors: Al-Ezzi, Athil, Al-Bawee, Abbas, Dawood, Feryal, Shehab, Abeer A.
Format: Journal Article
Language:English
Published: New York Springer US 01-12-2019
Springer Nature B.V
Subjects:
Alloys
Bismuth
Characterization and Evaluation of Materials
Chemistry and Materials Science
Contact angle
Differential scanning calorimetry
Electric contacts
Electronics and Microelectronics
Eutectic alloys
Instrumentation
Lead free
Materials Science
Melting points
Morphology
Optical and Electronic Materials
Physical properties
Solders
Solid State Physics
Tin base alloys
Ultrasonic testing
Wettability
melting point
contact angle
pasty range
Sn-9Zn
lead-free solder
electrical resistivity
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Summary:The aim of this work is to improve the properties of eutectic Sn-9Zn solder alloy by adding different amounts of bismuth to produce alternate lead-free solder alloys for use in electronic applications. Phase identification of the various solders was performed by x-ray diffraction analysis. Scanning electron microscopy was employed for morphological characterization of the prepared solder alloys. Spreading tests were used to measure the contact angle, and the electrical resistance was measured. Differential scanning calorimetry (DSC) thermographs were obtained for the alternate lead-free alloys. The results showed that Bi addition could clearly improve the wettability and physical properties of the Sn-9Zn base alloy by decreasing the melting point.
ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-019-07577-w