Search Results - "Davis, Guy D."
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Development of an electrochemical impedance spectroscopy sealant test: I. Nonconductive sealants
Published in Journal of adhesion science and technology (01-01-2006)“…Distinguishing between sealants and providing laboratory prognostic tools is essential for qualifying new sealants. Current test methods do not provide…”
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Development of an electrochemical impedance spectroscopy sealant test: II. Conductive sealants
Published in Journal of adhesion science and technology (01-01-2006)“…Distinguishing between sealants and providing laboratory prognostic tools is essential for qualifying new sealants. Current test methods do not provide…”
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Journal Article -
3
Use of an electrochemical probe for predictive assessment of bonded repair
Published in International journal of adhesion and adhesives (2002)“…Boron/epoxy-Al double lap shear specimens were prepared and exposed to high humidity and temperature. Half of these was prepared using the grit blast/silane…”
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Enhancement of corrosion resistance of protective coatings formed by spontaneous surface polymerization
Published in International journal of adhesion and adhesives (2003)“…The corrosion resistance of a novel protective coating formed by spontaneous polymerization on aluminum was studied. The polymer coating was formed from…”
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Formation and properties of spontaneously polymerized fluorocoatings on aluminum
Published in Polymer engineering and science (01-11-2001)“…Spontaneous polymerization (S‐Poly) is a novel process to form protective polymer coatings on aluminum and other metals. Here we discuss polymerization and…”
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The thermal spraying of aluminum as an adhesive-bond pretreatment
Published in JOM (1989) (01-05-1997)“…Adhesive bonding is commonly used for the joining of aluminum in the aerospace industry and is increasingly used in the automotive and construction industries…”
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7
Guest Editorial
Published in Journal of adhesion science and technology (01-01-2009)Get full text
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8
Guest Editorial
Published in Journal of adhesion science and technology (01-01-2009)Get full text
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