Search Results - "Danila, Bayaras Abito" :: Katalog Arama

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Enabling Cu Pillar Flip Chip Assembly with Water Soluble Lead-free Solder Paste by Kumar, B. Senthil, Danila, Bayaras Abito, Joanne, Chong Mei Hoe, Fen, Zhang Rui, Rath, Santosh Kumar, Li-San, Chan, Jason, Wong Chin Yeung

Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01-12-2019)
“…This paper reports the evaluation of printability along with attachment of Copper (Cu) Pillar Flip Chip (FC) and passive component, such as 008004, for the…”

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Effect of free-air-ball palladium distribution on palladium-coated copper wire corrosion resistance by Liao Jinzhi, Zhang Xp, Sureshkumar, Vinobaji, Danila, Bayaras Abito, Chong Kim Hui, Lim Yee Weon, Lo Miew Wan, Loke Chee Keong, Bakar, Zaiton Bte

Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01-11-2016)
“…Since the development of palladium-coated copper wire (CuPd) in recent years, it has been widely used in the electronic industry due to its good performance,…”

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