Search Results - "Dai, Yanwei"

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  1. 1

    Analytical prediction for depth of subsurface damage in silicon wafer due to self-rotating grinding process by Zhang, Lixiang, Chen, Pei, An, Tong, Dai, Yanwei, Qin, Fei

    Published in Current applied physics (01-05-2019)
    “…Subsurface damage (SSD) induced by silicon wafer grinding process is an unavoidable problem in semiconductor manufacturing. Although experimental attempts have…”
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    Journal Article
  2. 2

    Protrusion of Through-Silicon-Via (TSV) Copper with Double Annealing Processes by Zhang, Min, Qin, Fei, Chen, Si, Dai, Yanwei, Chen, Pei, An, Tong

    Published in Journal of electronic materials (01-05-2022)
    “…Copper filled through silicon via (TSV-Cu) is a crucial technology for chip stacking and three-dimensional (3D) vertical packaging. The multiple thermal…”
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  3. 3

    Correlations between Microstructure and Residual Stress of Nanoscale Depth Profiles for TSV-Cu/TiW/SiO2/Si Interfaces after Different Thermal Loading by Zhang, Min, Chen, Fangzhou, Qin, Fei, Chen, Si, Dai, Yanwei

    Published in Materials (01-01-2023)
    “…In this paper, the residual stresses with a nanoscale depth resolution at TSV-Cu/TiW/SiO2/Si interfaces under different thermal loadings are characterized…”
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  4. 4

    Crack Effect on the Equivalent Thermal Conductivity of Porously Sintered Silver by Qin, Fei, Hu, Yuankun, Dai, Yanwei, An, Tong, Chen, Pei, Gong, Yanpeng, Yu, Huiping

    Published in Journal of electronic materials (01-10-2020)
    “…Characterizations of equivalent thermal conductivity (ETC) of sintered silver is an important topic due to the thermal–mechanical reliability requirements of…”
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  5. 5

    Macro-Mesoscale Modeling of the Evolution of the Surface Roughness of the Al Metallization Layer of an IGBT Module during Power Cycling by An, Tong, Zheng, Xueheng, Qin, Fei, Dai, Yanwei, Gong, Yanpeng, Chen, Pei

    Published in Materials (26-02-2023)
    “…One of the main failure modes of an insulated-gate bipolar transistor (IGBT) module is the reconstruction of an aluminum (Al) metallization layer on the…”
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  6. 6

    Modelling and Optimization of Continual Laser Joining Processes for Silicon Aluminum Alloy in Microwave Devices by Wang, Song, Shi, Ge, Zhao, Libo, Dai, Yanwei, Hou, Tianyu, He, Ying, Chen, Ping, Qin, Fei

    Published in Crystals (Basel) (01-04-2023)
    “…Due to its higher energy and smaller heating area, laser joining technology is widely used in aluminum alloy welding and other industrial fields, which meets…”
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  7. 7

    Life prediction of corrosion-fatigue based on a new crack growth rate model with damage and the extended finite element method by Chen, Zhiying, Dai, Yanwei, Liu, Yinghua

    Published in Engineering fracture mechanics (01-09-2023)
    “…[Display omitted] •A new corrosion-fatigue crack growth rate model introducing damage is proposed.•A robust and efficient crack surface update method is…”
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  8. 8

    Crack propagation simulation and overload fatigue life prediction via enhanced physics-informed neural networks by Chen, Zhiying, Dai, Yanwei, Liu, Yinghua

    Published in International journal of fatigue (01-09-2024)
    “…•The enhanced PINNs specifically for solving crack problems are proposed.•An automatic crack growth simulation method is developed based on PINNs.•The…”
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  9. 9

    Structural fatigue crack propagation simulation and life prediction based on improved XFEM-VCCT by Chen, Zhiying, Dai, Yanwei, Liu, Yinghua

    Published in Engineering fracture mechanics (08-11-2024)
    “…•The underlying principles of XFEM-VCCT framework are explained in detail.•A strategy combining level set and interpolation methods for crack length is…”
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  10. 10

    Inverse identification of cohesive zone parameters for sintered nano-silver joints based on dynamic convolution neural network by Wei, Jiahui, Dai, Yanwei, Qin, Fei

    Published in Engineering fracture mechanics (15-11-2023)
    “…•MLP, CNN, and DCNN models are proposed to inversely extract bilinear CZM parameters of sintered nano-silver ENF joints.•The DCNN model shows better accuracy…”
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  11. 11

    A higher-order asymptotic solution for 3D sharp V-notch front tip fields in creeping solids by Kong, Weichen, Dai, Yanwei, Liu, Yinghua

    Published in Engineering fracture mechanics (05-08-2024)
    “…[Display omitted] •A more accurate higher-order asymptotic solution of 3D V-notch and crack front tip fields is established theoretically.•The constraint…”
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  12. 12

    Numerical study on high-cycle fatigue crack growth of sinusoidal interface based on cyclic cohesive zone model by Chen, Zhiying, Dai, Yanwei, Liu, Yinghua

    Published in International journal of fatigue (01-09-2023)
    “…[Display omitted] •A discrete interface element suitable for complex shape interface is developed.•The general calibration method for the cyclic cohesive zone…”
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  13. 13

    Out-of-plane effect on the sharp V-notch tip fields in power-law creeping solids: A three-dimensional asymptotic analysis by Kong, Weichen, Dai, Yanwei, Liu, Yinghua

    “…Understanding the three-dimensional (3D) effect on the notch tip field is important for the fracture mechanics analysis of engineering materials and…”
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  14. 14

    Deep learning assisted prediction on main factors influencing shear strength of sintered nano Ag-Al joints under high temperature aging by Zhao, Libo, Dai, Yanwei, Qin, Fei

    Published in Engineering failure analysis (01-01-2025)
    “…•Based on small test data, CTGAN was used to obtain a reliable enhanced dataset.•Shear strength of Ag-Al bonded joints with surface finish was predicted by DL…”
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  15. 15

    Three-dimensional sharp V-notch stress intensity factor and strain energy rate density under creeping conditions by Kong, Weichen, Dai, Yanwei, Liu, Yinghua

    Published in Engineering fracture mechanics (01-09-2022)
    “…•The 3D sharp V- notch stress intensity factor under creeping condition is presented and discussed.•The effect of out-of-plane effect on strain energy rate…”
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  16. 16

    Numerical prediction based on XFEM for mixed-mode crack growth path and fatigue life under cyclic overload by Chen, Zhiying, Bao, Hongchen, Dai, Yanwei, Liu, Yinghua

    Published in International journal of fatigue (01-09-2022)
    “…•An efficient and stable method for crack growth is proposed based on XFEM.•The SIFs of mixed-mode crack is accurately calculated.•Crack paths of structures…”
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  17. 17

    Summer O3 pollution cycle characteristics and VOCs sources in a central city of Beijing-Tianjin-Hebei area, China by Guan, Yanan, Liu, Xuejiao, Zheng, Zhiyang, Dai, Yanwei, Du, Guimin, Han, Jing, Hou, Li'an, Duan, Erhong

    Published in Environmental pollution (1987) (15-04-2023)
    “…One of the major pollutants influencing urban air quality in China is O3. O3 is the second most important pollutant affecting air quality in Shijiazhuang,…”
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  18. 18

    Shearing fracture toughness enhancement for sintered silver with nickel coated multiwall carbon nanotubes additive by Dai, Yanwei, Zan, Zhi, Zhao, Shuai, Li, Yanning, Qin, Fei

    Published in Engineering fracture mechanics (01-02-2022)
    “…[Display omitted] •Shearing fracture toughness for different contents of nickel coated multiwall CNTs sintered silver are presented.•Enhanced shearing fracture…”
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  19. 19

    Nanoindentation Elastoplastic and Creep Behaviors of Sintered Nano-Silver Doped with Nickel-Modified Multiwall Carbon Nanotube Filler by Dai, Yanwei, Zan, Zhi, Zhao, Libo, Qin, Fei

    Published in Journal of electronic materials (01-02-2024)
    “…In this paper, the elastoplastic and creep constitutive behaviors of sintered silver with varying amounts of nickel-modified multiwall carbon nanotubes are…”
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  20. 20

    Characteristics and effects of T-stresses in central-cracked unstiffened and stiffened plates under mode I loading by Huang, Xingling, Liu, Yinghua, Dai, Yanwei

    Published in Engineering fracture mechanics (01-02-2018)
    “…[Display omitted] •T-stress is affected by plate thickness and stiffener’s size, location and integrity.•An improved analytical solution of crack tip plastic…”
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