Search Results - "Dai, Jingru"

Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure by Hui Zhang, Jianfeng Li, Jingru Dai, Corfield, Martin, Xuejian Liu, Yan Liu, Zhengren Huang, Johnson, Christopher Mark

“…This paper proposes an advanced Si3N4 ceramic-based structure with through vias designed and filled with brazing alloy as a reliable interconnect solution in…”
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Magnetic resonance imaging for the diagnosis of malignant mixed Mullerian tumor of ovary: Two case reports by Jin, Xiaofeng, Zhu, Ping, Fan, Shufeng, Dai, Jingru

“…Malignant mixed Mullerian tumor (MMMT) is also known as carcinosarcoma, mostly occurring in the uterus, and occurred in ovary is very rare. The disease is…”
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Low-Temperature Die Attachment by Pressureless Cu Sintering for Semiconductor Packaging by Dai, Jingru, Wang, Yangang, Grant, Thomas, Morshed, Muhmmad

“…This study focuses on the process optimization of pressureless Cu sintering for semiconductor die attach application. The die attachment joints were sintered…”
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Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints by Li, Jianfeng, Dai, Jingru, Johnson, Christopher Mark

“…The power cycling reliability of flexible printed circuit board (PCB) interconnect smaller/thinner (ST) 9.5 mm × 5.5 mm × 0.07 mm and larger/thicker (LT)…”
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Microstructural Response of Highly Porous Sintered Nano-silver Particle Die Attachments to Thermomechanical Cycling by Agyakwa, Pearl A., Robertson, Stuart, Dai, Jingru, Mouawad, Bassem, Zhou, Zhaoxia, Liu, Changqing, Johnson, C. Mark

“…This paper deals with the performance of sintered nano-silver bonds used as wide-bandgap power module die attachment technology. The paper specifically…”
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A Lifetime Prediction Method for IGBT Modules Considering the Self-Accelerating Effect of Bond Wire Damage by Qin, Fei, Bie, Xiaorui, An, Tong, Dai, Jingru, Dai, Yanwei, Chen, Pei

“…As core components of power converters, the insulated gate bipolar transistor (IGBT) module is required to have long-term reliability in increasingly more…”
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Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process by Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Corfield, Martin, Johnson, Christopher Mark

“…This study investigates a time-reduced sintering process for die attachment, prepared, within a processing time of several seconds using dry nanosilver film…”
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Electrical Performance and Reliability Characterization of a SiC MOSFET Power Module With Embedded Decoupling Capacitors by Yang, Li, Li, Ke, Dai, Jingru, Corfield, Martin, Harris, Anne, Paciura, Krzysztof, O Brien, John, Johnson, C. Mark

“…Integration of decoupling capacitors into silicon carbide (SiC) metal oxide semiconductor field effect transistor ( mosfet ) modules is an advanced solution to…”
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Process and reliability of die attachment by time-reduced sintering of nanosilver film by Dai, Jingru

“…This study focused on the time-reduced sintering process of nanosilver film and power cycling reliability of the sintered die attachments. The aim is to…”
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Estimation of Daily Winter Precipitation in the Snowy Mountains of Southeastern Australia by Dai, Jingru, Manton, Michael J., Siems, Steven T., Ebert, Elizabeth E.

“…Wintertime precipitation in the Snowy Mountains provides water for agriculture, industry, and domestic use in inland southeastern Australia. Unlike most of…”
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Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling by Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Corfield, Martin, Johnson, Christopher Mark

“…13.5 mm <inline-formula> <tex-math notation="LaTeX">{\times }\,\, </tex-math></inline-formula>13.5 mm sintered nano-silver attachments for power devices onto…”
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Packaging for fast switching power electronics by Marchant, Stewart, Dai, Jingru, Mouawad, Bassem, Empringham, Lee, Clare, Jon

“…This work investigates printed circuit board embedding of the power devices in order to support low inductance, fast switching package designs. The embedding…”
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Thermal performance and reliability of high temperature SiC power module with direct-cooled stacked Si3N4 substrates by Dai, Jingru, Li, Jianfeng, Mouawad, Bassem, Johnson, Christopher Mark

“…This work is concerned with the thermal performance and reliability of the SiC power module with direct-cooled stacked Si 3 N 4 substrates for high temperature…”
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A High Performance and Low Cost Half Bridge IGBT Planar Power Module by Li, Jainfeng, Li, Ke, Dai, Jingru, Johnson, Christopher Mark, Lin, Xi

“…This study presents the development and performance of a half bride insulated-gate bipolar transistor planar power module integrated with a turbulent water…”
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Electrical Performance and Reliability Characterization of a SiC MOSFET Power Module With Embedded Decoupling Capacitors by Yang, Li, Li, Ke, Dai, Jingru, Corfield, Martin, Harris, Anne, Paciura, Krzysztof, O Brien, John, Johnson, C. Mark

“…Integration of decoupling capacitors into silicon carbide (SiC) metal oxide semiconductor field effect transistor ( mosfet ) modules is an advanced solution to…”
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Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process by Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Corfield, Martin, Johnson, Christopher Mark

“…This study investigates the power cycling reliability of nanosilver sintered joints formed by a time-reduced sintering process, designed for use on a die…”
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Effect of Crack Evolution on the Resistance and Current Density of the Al Metallization in the IGBT Module During Power Cycling by Qin, Fei, Zhao, Jingyi, An, Tong, Dai, Jingru, Dai, Yanwei, Chen, Pei

“…This study quantifies the correlations between crack evolution and electrical performance degradation of the Al metallization in insulated gate bipolar…”
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