Search Results - "Dahringer, D."
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1
GaAs MQW modulators integrated with silicon CMOS
Published in IEEE photonics technology letters (01-04-1995)“…We demonstrate integration of GaAs-AlGaAs multiple quantum well modulators to silicon CMOS circuitry via flip-chip solder-bonding followed by substrate…”
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2
3-D integration of MQW modulators over active submicron CMOS circuits: 375 Mb/s transimpedance receiver-transmitter circuit
Published in IEEE photonics technology letters (01-11-1995)“…We accomplish the integration of GaAs-AlGaAs multiple quantum well modulators directly on top of active silicon CMOS circuits. This enables optoelectronic VLSI…”
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3
1-Gb/s two-beam transimpedance smart-pixel optical receivers made from hybrid GaAs MQW modulators bonded to 0.8 μm silicon CMOS
Published in IEEE photonics technology letters (01-03-1996)“…We have made two-beam smart-pixel optical receivers using a hybrid attachment of GaAs-AlGaAs multiple quantum-well (MQW) pin devices to foundry-fabricated…”
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4
High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS
Published in IEEE journal of selected topics in quantum electronics (01-04-1996)“…We present the first high-speed optoelectronic very large scale integrated circuit (VLSI) switching chip using III-V optical modulators and detectors flip-chip…”
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5
Arrays of optoelectronic switching nodes comprised of flip-chip-bonded MQW modulators and detectors on silicon CMOS circuitry
Published in IEEE photonics technology letters (01-02-1996)“…We describe 8/spl times/8 arrays of smart pixels, designed and fabricated using MQW modulators and detectors flip-chip-solder-bonded to silicon CMOS circuits…”
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6
Clocked-sense-amplifier-based smart-pixel optical receivers
Published in IEEE photonics technology letters (01-08-1996)“…We introduce the concept of synchronous smart-pixel optical receivers, and present the first use of a clocked-sense amplifier as a smart-pixel optical…”
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7
Large array of GaAs modulators and detectors flip-chip solder bonded to silicon CMOS using InGaP as the selective etch stop for GaAs substrate removal
Published in Journal of crystal growth (01-05-1997)“…We demonstrate the integration of a large (64 × 68) p-i(MQW)-n GaAs diode array to a silicon CMOS chip, using flip-chip solder bump bonding techniques together…”
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8
Marketing Services Internationally: Barriers and Management Strategies
Published in The Journal of services marketing (01-03-1991)“…Focuses on the international marketing of services and the need for service marketers to be aware ofbarriers to international marketing unique to the service…”
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9
Some aspects of adhesive-induced corrosion in electronic devices
Published in 1973 EIC 11th Electrical Insulation Conference (01-09-1973)“…Corrosion is usually not the primary concern of engineers who design and fabricate electronic devices, nor is it usually the prime concern of many materials…”
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10
Lemon Laws: Intent, Experience, and a Pro‐Consumer Model
Published in The Journal of consumer affairs (01-06-1988)“…Under deregulation, public policies regarding consumer rights and product warranties have shifted. This paper reviews the rationale for lemon laws, state…”
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Journal Article -
11
Federal Trade Commission Redefinition of Deception and Public Policy Implications: Let the Buyer Beware
Published in The Journal of consumer affairs (1984)“…The current movement toward market deregulation in the United States is perhaps no better illustrated than by the proposals put forth by the Chairman of the…”
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12
Will a global marketing strategy work? An energy conservation perspective
Published in Journal of the Academy of Marketing Science (01-04-1989)“…A study was conducted of standardization of marketing strategy across national boundaries. The study analyzed consumers in the US, the Netherlands, France, and…”
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13
3-D integration of MQW SEED detectors and modulators over active sub-micron CMOS circuits: Application to a 2KBit parallel photonic page buffer
Published in LEOS '95. IEEE Lasers and Electro-Optics Society 1995 Annual Meeting. 8th Annual Meeting. Conference Proceedings (1995)“…The efficacy of many system-designs based on free-space optical interconnects and smart-pixels, depends on the availability of a flexible, high-density,…”
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Conference Proceeding -
14
Marketing Services Internationally Barriers and ManagementStrategies
Published in The Journal of services marketing (01-03-1991)“…Focuses on the international marketing of services and the need for service marketers to be aware ofbarriers to international marketing unique to the service…”
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Journal Article -
15
THE INFLUENCE OF COUNTRY AND PRODUCT ON RETAILER OPERATING PRACTICES: A CROSS NATIONAL COMPARISON
Published in International marketing review (01-02-1985)“…This study examines the extent to which retailer's country of origin and product assortment influence retailer operating practices. Although conventional…”
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16
Anisotropically conductive polymer films with a uniform dispersion of particles
Published in IEEE transactions on components, hybrids, and manufacturing technology (01-12-1993)“…Anisotropically conductive films consisting of a single layer of magnetically separated conductor spheres in a polymer matrix are described. In a vertical…”
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17
Alienation and Market System Development: Lessons for the Multinational Marketer
Published in Economic and political weekly (27-02-1982)“…This paper has a threefold objective. First it proposes a model of how market system development interacts with the environment to affect consumer expectations…”
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18
1-Gb/s two-beam transimpedance smart-pixel optical receivers made from hybrid GaAs MQW modulators bonded to 0.8 mum silicon CMOS
Published in IEEE photonics technology letters (01-03-1996)“…We have made two-beam smart-pixel optical receivers using a hybrid attachment of GaAs-AlGaAs multiple quantum-well (MQW) pin devices to foundry-fabricated…”
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Journal Article -
19
Soil burial tests: Effect of soil burial exposure on the properties of adhesives and pressure-sensitive tapes
Published in Bell System Technical Journal (01-01-1972)“…The effects of long-term soil burial on some physical properties of adhesive bonded test specimens and pressure-sensitive adhesive tapes are presented. Changes…”
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20
15 /spl mu/m solder bonding of GaAs/AlGaAs MQW devices to MOSIS 0.8 /spl mu/m CMOS for 1 Gb/s two-beam smart-pixel receiver/transmitter
Published in 1996 IEEE International Solid-State Circuits Conference. Digest of TEchnical Papers, ISSCC (1996)“…A two-beam optical repeater circuit operates to 1 Gb/s, consumes 10 mW, occupies about 1100 /spl mu/m/sup 2/, and is realized with a technology capable of…”
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