Search Results - "Daewon Ha"
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Analog reservoir computing via ferroelectric mixed phase boundary transistors
Published in Nature communications (23-10-2024)“…Analog reservoir computing (ARC) systems have attracted attention owing to their efficiency in processing temporal information. However, the distinct…”
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2
Device modeling of two-steps oxygen anneal-based submicron InGaZnO back-end-of-line field-effect transistor enabling short-channel effects suppression
Published in Scientific reports (12-11-2022)“…Amorphous oxide semiconductor (AOS) field-effect transistors (FETs) have been integrated with complementary metal-oxide-semiconductor (CMOS) circuitry in the…”
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3
Observation of bulk HfO2 defects by spectroscopic ellipsometry
Published in Journal of vacuum science & technology. A, Vacuum, surfaces, and films (01-07-2004)“…Spectroscopic ellipsometry was used to investigate the oxidation of pure Hf films on silicon for the formation of HfO2 (hafnium oxide) gate-dielectric films in…”
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4
Highly manufacturable 7nm FinFET technology featuring EUV lithography for low power and high performance applications
Published in 2017 Symposium on VLSI Technology (01-06-2017)“…7nm CMOS FinFET technology featuring EUV lithography, 4 th gen. dual Fin and 2 nd gen. multi-eWF gate stack is presented, providing 20% faster speed or…”
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Conference Proceeding -
5
Extremely scaled silicon nano-CMOS devices
Published in Proceedings of the IEEE (01-11-2003)“…Silicon-based CMOS technology can be scaled well into the nanometer regime. High-performance, planar, ultrathin-body devices fabricated on silicon-on-insulator…”
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6
Molybdenum gate technology for ultrathin-body MOSFETs and FinFETs
Published in IEEE transactions on electron devices (01-12-2004)“…Damage-free sputter deposition and highly selective dry-etch processes have been developed for molybdenum (Mo) metal gate technology, for application to fully…”
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7
Investigation of Gate-Induced Drain Leakage (GIDL) Current in Thin Body Devices: Single-Gate Ultra-Thin Body, Symmetrical Double-Gate, and Asymmetrical Double-Gate MOSFETs
Published in Japanese Journal of Applied Physics (2003)“…Gate-induced drain leakage (GIDL) current is investigated in single-gate (SG) ultra-thin body FET, symmetrical double-gate (DG) FinFET, and asymmetrical DG…”
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8
Hydrogen annealing effect on DC and low-frequency noise characteristics in CMOS FinFETs
Published in IEEE electron device letters (01-03-2003)“…The hydrogen annealing process has been used to improve surface roughness of the Si-fin in CMOS FinFETs for the first time. Hydrogen annealing was performed…”
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9
Progress, Challenges, and Opportunities in Oxide Semiconductor Devices: A Key Building Block for Applications Ranging from Display Backplanes to 3D Integrated Semiconductor Chips
Published in Advanced materials (Weinheim) (01-10-2023)“…As Si has faced physical limits on further scaling down, novel semiconducting materials such as 2D transition metal dichalcogenides and oxide semiconductors…”
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10
Nanoscale ultrathin body PMOSFETs with raised selective germanium source/drain
Published in IEEE electron device letters (01-09-2001)“…Nanoscale ultrathin body (UTB) p-channel MOSFETs with body thickness down to 4 nm and raised source and drain (S/D) using selectively deposited Ge are…”
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11
Design Guidelines of Multibridge Channel-Ferroelectric FET for 3-nm Node and Beyond
Published in IEEE transactions on electron devices (01-11-2024)“…Multibridge channel-ferroelectric field-effect transistor (MBC-FeFET) with metal-ferroelectric-metal-insulator-silicon (MFMIS) gate-stack is an advanced noble…”
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12
A Comprehensive Study of Transient Characteristics in FeFET Using In-Situ V t Measurement Method
Published in IEEE electron device letters (01-08-2024)Get full text
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A Comprehensive Study of Transient Characteristics in FeFET Using In-Situ Vt Measurement Method
Published in IEEE electron device letters (01-08-2024)“…In ferroelectric FETs (FeFETs), the transient characteristics is a key issue to be addressed. Therefore, it is important to have an understanding based on…”
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14
Prospective Innovation of DRAM, Flash, and Logic Technologies for Digital Transformation (DX) Era
Published in 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (12-06-2022)“…DX (digital transformation) is expected to lead a steeper acceleration in the growth trajectory and open a greater opportunity in the semiconductor industry…”
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Conference Proceeding -
15
Revival of Ferroelectric Memories Based on Emerging Fluorite-Structured Ferroelectrics
Published in Advanced materials (Weinheim) (01-10-2023)“…Over the last few decades, the research on ferroelectric memories has been limited due to their dimensional scalability and incompatibility with complementary…”
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Understanding the Memory Window of Ferroelectric FET and Demonstration of 4.8-V Memory Window With 20-nm HfO 2
Published in IEEE transactions on electron devices (01-08-2024)Get full text
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Understanding the Memory Window of Ferroelectric FET and Demonstration of 4.8-V Memory Window With 20-nm HfO2
Published in IEEE transactions on electron devices (01-08-2024)“…In this work, with the goal of developing a large memory window (MW) ferroelectric field-effect transistor (FeFET) for high-density stand-alone storage…”
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18
Strategies for a Wide Memory Window of Ferroelectric FET for Multilevel Ferroelectric VNAND Operation
Published in IEEE electron device letters (01-07-2024)“…Basic gate stack structure of the Ferroelectric FET is Metal-ferroelectric-insulator-silicon (MFIS), where the memory window (M.W) is <inline-formula>…”
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Anomalous junction leakage current induced by STI dislocations and its impact on dynamic random access memory devices
Published in IEEE transactions on electron devices (01-05-1999)“…As the density of dynamic random access memory (DRAM) increases up to giga-bit regime, one of the important problems is the control of the process-induced…”
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A Large Window Nonvolatile Transistor Memory for High-Density and Low-Power Vertical NAND Storage Enabled by Ferroelectric Charge Pumping
Published in IEEE electron device letters (09-10-2024)“…In this work, we have developed a large memory window (MW) ferroelectric field effect transistor (FeFET) memory for vertical NAND storage. We demonstrate that:…”
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