Search Results - "Dae-Gwan Kang"
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1
Prediction of data retention time distribution of DRAM by physics-based statistical Simulation
Published in IEEE transactions on electron devices (01-11-2005)“…We have developed a comprehensive TCAD framework that can predict the data retention time distribution of a dynamic random access memory (DRAM) chip using the…”
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Journal Article -
2
A New Direct Evaluation Method to Obtain the Data Retention Time Distribution of DRAM
Published in IEEE transactions on electron devices (01-09-2006)“…The authors have developed an efficient and accurate method to obtain the data retention time distribution of DRAM from the physics-based device simulation and…”
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3
The Simulation of the Dynamic Characteristics of Friction Stir Welding and the Structural Deflection of Base Materials
Published in Applied sciences (01-10-2022)“…Friction stir welding requires an optimized process because the quality of the weld can vary depending on the dynamic characteristics of the welding tool. In…”
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4
Modeling alpha-particle-induced accelerated soft error rate in semiconductor memory
Published in IEEE transactions on electron devices (01-07-2003)“…This paper presents an analytic integral model for the accelerated soft error rate (ASER). The model took into account the physical and structural parameters…”
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5
Physical analysis for saturation behavior of hot-carrier degradation in lightly doped drain N-channel metal-oxide-semiconductor field effect transistors
Published in Japanese Journal of Applied Physics (1994)“…This paper experimentally demonstrates that hot carrier degradation curves of lightly doped drain n-channel metal-oxide-semiconductor field effect transistors…”
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6
Impact of Nitrogen Implantation in Lightly Doped Drain (NIL) on Deep Sub-Micron CMOS Devices
Published in Japanese Journal of Applied Physics (2000)“…In this study, we investigate the device characteristics of lightly doped drain (LDD) metal-oxide-semiconductor field effect transistors (MOSFETs) with…”
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7
Trap evaluations of metal/oxide/silicon field-effect transistors with high- k gate dielectric using charge pumping method
Published in Applied physics letters (09-09-2002)“…The interface trap properties of metal/oxide/silicon field-effect transistors with high-k gate dielectrics are evaluated by the charge pumping method and…”
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8
Characteristics of n+–p junction leakage induced by tantalum pentoxide gate insulator and gate reoxidation
Published in Applied physics letters (21-05-2001)“…This letter will present the n+–p junction characteristics in tantalum pentoxide gate dielectric (Ta2O5) and gate reoxidation ambient. The n+–p junctions in…”
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9
Analysis of body bias effect with PD-SOI for analog and RF applications
Published in Solid-state electronics (01-08-2002)“…The interaction of the body bias effect, device size, and analog characteristics such as DC gain, the matching effect, and speed ( f T and f max) of the…”
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10
Effects of nitrogen implantation in silicon for shallow p+-n junction formation
Published in Applied physics letters (29-03-1999)“…This letter will present the effects of nitrogen implantation on shallow p+-n junction formation in silicon. The p+-n junctions fabricated at different…”
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Journal Article -
11
A simple voltage scaling formula for low-power CMOS circuits
Published in IEEE transactions on electron devices (01-04-1999)“…A simple formula is proposed for the analysis of the gate delay of CMOS gate under low V/sub DD/. The effects of device parameters on gate delay and energy are…”
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12
Current-crowding effect in diagonal MOSFET's
Published in IEEE electron device letters (01-06-1993)“…Electrical and reliability characteristics of diagonally shaped n-channel MOSFETs have been extensively investigated. Compared with the conventional device…”
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13
Ultra thin-oxide damage from gate charging during PETEOS deposition processing
Published in ICVC '99. 6th International Conference on VLSI and CAD (Cat. No.99EX361) (1999)“…This paper presents a study of plasma-enhanced tetraethylorthosilicate oxide process (PETEOS) induced charging damage to thin gate oxide reliability of p-and…”
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Conference Proceeding -
14
Optimization of repeater size to minimize interconnect line-induced delay time for high performance VLSI circuits
Published in ICVC '99. 6th International Conference on VLSI and CAD (Cat. No.99EX361) (1999)“…In this paper the dependence of interconnect line-induced delay time on the repeater size is characterized. In case of capacitance dominant interconnect line,…”
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Conference Proceeding -
15
Real time on-chip characterization of time delay arising from multi-level-metallization: decoupling of pure charging and drift-and-charging
Published in International Electron Devices Meeting 1998. Technical Digest (Cat. No.98CH36217) (1998)“…Time delay, /spl tau//sub D/ due to MLM is systematically characterized in circuit operating conditions. Novel utilization of simple test patterns is shown to…”
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Conference Proceeding -
16
An anomalous device degradation of SOI devices with STI
Published in 2000 IEEE International SOI Conference. Proceedings (Cat. No.00CH37125) (2000)“…The degradation of the electrical characteristics of SOI MOSFETs with STI structure is found to be dependent on the device size. The degradation is due to…”
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Conference Proceeding -
17
Performance improvements in high-density DRAM application using 0.15 /spl mu/m body-contacted SOI technology
Published in 2000 IEEE International SOI Conference. Proceedings (Cat. No.00CH37125) (2000)“…A 0.15 /spl mu/m silicon-on-insulator (SOI) CMOS technology, using a body-contacted (BC) SOI structure, is developed. This process technology is fully…”
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Conference Proceeding -
18
Modeling of retention time distribution of DRAM cell using a Monte-Carlo method
Published in IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004 (2004)“…A comprehensive Monte-Carlo method for the simulation of the data retention time distribution of DRAM cell has been developed using the current Green's…”
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Conference Proceeding -
19
Accurate evaluation of gate delay for low-power and high-density 0.18 /spl mu/m CMOSFET technology
Published in ICVC '99. 6th International Conference on VLSI and CAD (Cat. No.99EX361) (1999)“…The gate delay of ring oscillators in high V/sub T/ CMOSFET technology is characterized with respect to various channel widths (0.72 /spl mu/m-10 /spl mu/m)…”
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Conference Proceeding -
20
Characterization of crosstalk-induced noise for 0.18 /spl mu/m CMOS technology with 6-level metallization using time domain reflectometry and S-parameters
Published in International Electron Devices Meeting 1999. Technical Digest (Cat. No.99CH36318) (1999)“…Crosstalk-induced noise of 0.18 /spl mu/m CMOS Technology is characterized using time domain reflectometry and scattering parameters. The interconnect lines…”
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Conference Proceeding