Search Results - "Cui, Weizhe"
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Investigations on the mechanism of microweld changes during ultrasonic wire bonding by molecular dynamics simulation
Published in Materials & design (01-07-2020)“…Despite the wide and long-term applications of ultrasonic (US) wire bonding and other US metal joining technologies, the mechanism of microweld changes during…”
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Comparing Q-Tree with Nested Grids for Simulating Managed River Recharge of Groundwater
Published in Water (Basel) (01-12-2020)“…The use of rivers to recharge groundwater is a key water resource management method. High-precision simulations of the groundwater level near rivers can be…”
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Hydrogeochemical Features and Genesis of Confined Groundwater and Health Perspectives for Sustainable Development in Urban Hengshui, North China Plain
Published in Journal of chemistry (16-04-2021)“…Groundwater in confined aquifers is the preferred water resource worldwide, and its hydrochemical quality is the premise for sustainable development. A…”
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Combining river replenishment and restrictions on groundwater pumping to achieve groundwater balance in the Juma River Plain, North China Plain
Published in Frontiers in earth science (Lausanne) (18-07-2022)“…In recent years, to alleviate the decline in groundwater levels, extensive restrictions on groundwater pumping have been implemented in the North China Plain…”
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High-performance solar-blind photodetector of β-Ga2O3 grown on sapphire with embedding an ultra-thin AlN buffer layer
Published in Journal of alloys and compounds (15-11-2024)“…The authors reported the MOCVD growth of high-quality β-Ga2O3 on c-plane sapphire substrate, resulting in the achievement of high performance solar blind deep…”
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Solar blind avalanche photodetector based on a n-β-Ga2O3/n-Si heterojunction via an introduction of AlN buffer layer for interface lattice and band Engineering
Published in Materials today physics (01-06-2024)“…The ultrawide-band gap semiconductor Ga2O3 as a photodetector heteroepitaxially grown on Si is expected to be widely used for weak solar-blind signal…”
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Molecular Dynamics Simulation of Microwelds Formation and Breakage During Ultrasonic Copper Wire Bonding
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01-05-2018)“…Nowadays ultrasonic (US) copper wire bonding gests more required and applied in power electronics. Despite its large amounts of usage, the underlying bonding…”
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