Search Results - "Coyle, R.J."

The effect of modifications to the nickel/gold surface finish on assembly quality and attachment reliability of a plastic ball grid array (peer review version) by Coyle, R.J., Popps, D.E.H., Mawer, A., Cullen, D.P., Wenger, G.M., Solan, P.P.

“…Electrolytic and electroless Ni/Au are common pad surface finishes on area array (BGA or CSP) packages and printed wiring boards (PWB). The electroless…”
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Solder metallization interdiffusion in microelectronic interconnects by Zribi, A., Chromik, R.R., Presthus, R., Teed, K., Zavalij, L., DeVita, J., Tova, J., Cotts, E.J., Clum, J.A., Erich, R., Primavera, A., Westby, G., Coyle, R.J., Wenger, G.M.

“…We investigated the growth of intermetallic compounds in Cu/Ni/Au/PbSn solder joints. The substrates that we investigated had been Au plated by one of two…”
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The effect of variations in nickel/gold surface finish on the assembly quality and attachment reliability of a plastic ball grid array by Coyle, R.J., Wenger, G.M., Hodges, D.E., Mawer, A., Cullen, D.P., Solan, P.P.

“…Electrolytic and electroless Ni/Au are common pad surface finishes on area array (BGA or CSP) packages and printed wiring boards (PWB). The electroless…”
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Solder joint attachment reliability and assembly quality of a molded ball grid array socket by Coyle, R.J., Holliday, A., Solan, P.P., Yao, C., Cyker, H.A., Manock, J.C., Bond, R., Stenerson, R.E., Furrow, R.G., Occhipinti, M.V., Gahr, S.A.

“…This paper summarizes efforts to improve the assembly quality and solder joint reliability of a molded, plastic ball grid array socket. Metallographic analysis…”
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Shear testing and failure mode analysis for evaluation of BGA ball attachment by Erich, R., Coyle, R.J., Wenger, G.M., Primavera, A.

“…With increasing focus on BGA technology as a high performance package, there is an urgent need to develop industry-wide standards for package quality and…”
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Delivery of high power laser beams in a distributed materials processing system by Coyle, R.J., Serafino, A.J., Grimes, G.J.

“…An extensive multi-year experimental study of the delivery of high power laser beams through long step index plastic clad silica fibers was completed. The…”
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The influence of test parameters and package design features on ball shear test requirements by Coyle, R.J., Solan, P.P.

“…Ball shear testing is the most common test method used to assess solder ball attachment quality on area array packages. New package designs have a range of…”
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The influence of room temperature aging on ball shear strength and microstructure of area array solder balls by Coyle, R.J., Solan, P.P., Serafino, A.J., Gahr, S.A.

“…Solder ball shear strength is determined for ball grid array (BGA) packages in the as-received condition and after solder reflow preconditioning (exposure to…”
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Ball shear versus ball pull test methods for evaluating interfacial failures in area array packages by Coyle, R.J., Serafino, A.J., Solan, P.P.

“…In this investigation, a ball pull (tensile) test is investigated as an alternative to the ball shear test for evaluating the solder joint integrity of area…”
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Electrostatic discharge (ESD) mechanism for battery charge contact failure in cordless phones by Coyle, R.J., Min-Chung Jon

“…A comparison of the SEM EDX spectra for the metal charge contacts from field-returned cordless phones and for laboratory samples of fixed gap discharge (FGD)…”
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The influence of nickel/gold surface finish on the assembly quality and long term reliability of thermally enhanced BGA packages by Coyle, R.J., Holliday, A., Mescher, P., Solan, P.P., Gahr, S.A., Cyker, H.A., Dorey, K., Ejim, T.I.

“…Increasing numbers of chip carrier packages such as BGA and CSP use electroless nickel/immersion gold (ENi/IAu) surface finishes. However, the results of…”
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Assembly and reliability of thermally enhanced high I/O BGA packages by Ejim, T.I., Hollesen, D.B., Holliday, A., Gahr, S.A., Coyle, R.J.

“…Surface mount assembly defects for thermally enhanced high I/O, BGAs can range from 0 to 20 ppmj with packages that meet the JEDEC coplanarity specification of…”
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Reliability performance and failure mode of high I/O thermally enhanced ball grid array packages by Coyle, R.J., Ejim, T.I., Holliday, A., Solan, P.P., Dorey, J.K.

“…Thermally enhanced BGA packages can be susceptible to early failures during accelerated thermal cycling. These failures are attributed to a brittle fracture…”
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Stability of welding techniques used in single-mode laser packages by Moyer, R.S., Lipson, J., German, M.G., Kaufman, S., Hall, P.M., Coyle, R.J.

“…Critical alignments of single-mode laser packages have been secured using laser welds and resistance welds. Two methods were used to ascertain submicron…”
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Laser weld process improvements for optical isolator assembly by Kowalski, V.T., Coyle, R.J., Solan, P.P., Hogan, K.M.

“…Optical isolators are used in lightwave systems to reduce feedback that could be propagated in the signal fiber. Several methods can be used to assemble and…”
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