Search Results - "Clum, J.A."

THERMAL EXPANSION OF SEVERAL Sn-BASED INTERMETALLIC COMPOUNDS by Jiang, Nan, Clum, J.A, Chromik, R.R, Cotts, E.J

“…It is sought to determine values of the coefficient of thermal expansion for several Sn-based intermetallic compounds. Five intermetallic compounds of special…”
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Solder metallization interdiffusion in microelectronic interconnects by Zribi, A., Chromik, R.R., Presthus, R., Teed, K., Zavalij, L., DeVita, J., Tova, J., Cotts, E.J., Clum, J.A., Erich, R., Primavera, A., Westby, G., Coyle, R.J., Wenger, G.M.

“…We investigated the growth of intermetallic compounds in Cu/Ni/Au/PbSn solder joints. The substrates that we investigated had been Au plated by one of two…”
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Teaching electroscience using computer-based instruction by Al-Holou, N., Clum, J.A.

“…This paper outlines our experience associated with teaching college level physics and electric circuits to nontraditional students using specially designed and…”
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