Search Results - "Clode, M."

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  1. 1

    Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates by Kotadia, H.R., Mokhtari, O., Clode, M.P., Green, M.A., Mannan, S.H.

    Published in Journal of alloys and compounds (15-01-2012)
    “…► Systematic investigation on the Sn–3.8Ag–0.7Cu (SAC) solder alloy with Zn addition on Cu and Ni–P (ENIG) substrates. ► Intermetallic compounds (IMCs) growth…”
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  2. 2

    Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects by Li, J.F., Mannan, S.H., Clode, M.P., Whalley, D.C., Hutt, D.A.

    Published in Acta materialia (01-06-2006)
    “…This paper reports on the interfacial reaction kinetics between molten Sn–58Bi solder and Cu substrates for extended temporal scales. Also studied are the…”
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  3. 3

    Measuring nutrition‐related outcomes in a cohort of multi‐trauma patients following intensive care unit discharge by Wittholz, K., Fetterplace, K., Clode, M., George, E. S., MacIsaac, C. M., Judson, R., Presneill, J. J., Deane, A. M.

    Published in Journal of human nutrition and dietetics (01-06-2020)
    “…Background Functional recovery is an important outcome for those who survive critical illness. The present study aimed to assess nutrition provision and…”
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  4. 4

    Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates by Kotadia, H. R., Mokhtari, O., Bottrill, M., Clode, M. P., Green, M. A., Mannan, S. H.

    Published in Journal of electronic materials (01-12-2010)
    “…In this study we consider the effect of separately adding 0.5 wt.% to 1.5 wt.% Zn or 0.5 wt.% to 2 wt.% Al to the eutectic Sn-3.5Ag lead-free solder alloy to…”
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  5. 5

    Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders by Li, J.F., Mannan, S.H., Clode, M.P., Chen, K., Whalley, D.C., Liu, C., Hutt, D.A.

    Published in Acta materialia (2007)
    “…A time dependence of the form t 1/ n with n > 3 was observed for the thickening kinetics of the Ni 3Sn 4 scallops formed in both the Sn–58Bi/Ni and…”
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  6. 6

    237 Meal and daily variation in enzyme to fat matching in CF patients across a 7 day period: A cross-sectional study by Tierney, A.C, Yuen, A. Tsee Woon, Casamento, J, Fong-To, S.A, Clode, M, King, S

    Published in Journal of cystic fibrosis (01-06-2015)
    “…Background Pancreatic exocrine insufficiency (PEI) affects 85–90% of CF patients. Recommendations for pancreatic enzyme replacement therapy (PERT) are based on…”
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  7. 7

    234 Vegetable, fruit, dairy and discretionary food intake of cystic fibrosis (CF) patients and comparison with the general population: A cross-sectional study by Tierney, A.C, Fong-To, S.A, Clode, M, Casamento, J, Yuen, A. Tsee Woon, King, S

    Published in Journal of cystic fibrosis (01-06-2015)
    “…Background Energy and macronutrient targets form the cornerstone of CF dietary recommendations. However, little is known of diet quality and intakes of core…”
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  8. 8

    Dissolution and interfacial reaction of Nb in contact with the molten 52In–48Sn solder by Li, J.F., Mannan, S.H., Clode, M.P., Johnston, C., Crossley, A.

    Published in Acta materialia (01-09-2007)
    “…The dissolution and interfacial reaction of Nb in contact with the molten 52In–48Sn solder has been investigated in the temperature range 192–260 °C for…”
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  9. 9

    Constitutive equations for modelling flow softening due to dynamic recovery and heat generation during plastic deformation by Zhou, M, Clode, M.P

    Published in Mechanics of materials (01-02-1998)
    “…The flow softening of metals at elevated temperatures is modelled in this paper based on the theory of viscoplasticity. A single internal state variable…”
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  10. 10

    Lifetime of solid metals in contact with liquid solders for high-temperature liquid solder assemblies by Li, J.F., Mannan, S.H., Clode, M.P.

    Published in Scripta materialia (01-05-2006)
    “…The rates of barrier layer thickness losses for Ni, Cu, Pt, Ti, V, Nb, Ta and W metallizations in contact with the molten 52In–48Sn solder at 200 °C have been…”
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    Hot torsion tests to model the deformation behavior of aluminium alloys at hot working temperatures by Zhou, M, Clode, M.P

    Published in Journal of materials processing technology (01-12-1997)
    “…Knowledge of the deformation behavior of aluminium alloys at hot working temperatures is very important for high temperature manufacturing processes such as…”
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  13. 13

    Drug allergy and pollinosis. A short report by Palma-Carlos, A G, Clode, M H, Ferreira, A Marques, Palma-Carlos, M L

    “…2 series of patients with pollinosis and drug allergy studied 10 years apart and comprising 115 cases are presented. In both series grass pollens and…”
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  15. 15

    Turbutest™ in the training of asthmatic Turbuhaler™ users by Branco Ferreira, M, Santos, A, Clode, MH, Palma Carlos, AG

    Published in Allergy (Copenhagen) (01-04-1999)
    “…Background: Correct utilization of inhalation devices is a key factor in asthma management. Objective assessment of the ability to use inhaler devices is…”
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  16. 16

    Thermal analysis of the torsion test under hot-working conditions by Zhou, M., Clode, M.P.

    Published in Computational materials science (1998)
    “…It is important to estimate the temperature changes in material testing so that the interpretation of test data can be improved and the derived constitutive…”
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  17. 17

    Edge effects in intermetallic compound crystal growth between Nb and molten 52In–48Sn solder by Li, J. F., Mannan, S. H., Clode, M. P.

    Published in Applied physics letters (06-03-2006)
    “…A solder/substrate couple consisting of a Nb substrate and eutectic 52In–48Sn solder shows promise for high-temperature liquid solder interconnects. In this…”
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  18. 18

    A finite element analysis for the least temperature rise in a hot torsion test specimen by Zhou, M, Clode, M.P

    Published in Finite elements in analysis and design (01-11-1998)
    “…The temperature distribution in a hot torsion specimen, caused by plastic deformation, is predicted by a finite element analysis with the aim of obtaining an…”
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    Benefits of Wheel-Tool Gap Sensing in Conform™ Extrusion Machinery by Khawaja, K, Seneviratne, L, Clode, M P

    Published in IEEE/ASME transactions on mechatronics (01-08-2005)
    “…[...] it is shown that machine setup times prior to production can be reduced from 35 to 5 min with active gap sensing…”
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