Search Results - "Clode, M P"

Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates by Kotadia, H.R., Mokhtari, O., Clode, M.P., Green, M.A., Mannan, S.H.

“…► Systematic investigation on the Sn–3.8Ag–0.7Cu (SAC) solder alloy with Zn addition on Cu and Ni–P (ENIG) substrates. ► Intermetallic compounds (IMCs) growth…”
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Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects by Li, J.F., Mannan, S.H., Clode, M.P., Whalley, D.C., Hutt, D.A.

“…This paper reports on the interfacial reaction kinetics between molten Sn–58Bi solder and Cu substrates for extended temporal scales. Also studied are the…”
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Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates by Kotadia, H. R., Mokhtari, O., Bottrill, M., Clode, M. P., Green, M. A., Mannan, S. H.

“…In this study we consider the effect of separately adding 0.5 wt.% to 1.5 wt.% Zn or 0.5 wt.% to 2 wt.% Al to the eutectic Sn-3.5Ag lead-free solder alloy to…”
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Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders by Li, J.F., Mannan, S.H., Clode, M.P., Chen, K., Whalley, D.C., Liu, C., Hutt, D.A.

“…A time dependence of the form t 1/ n with n > 3 was observed for the thickening kinetics of the Ni 3Sn 4 scallops formed in both the Sn–58Bi/Ni and…”
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Constitutive equations for modelling flow softening due to dynamic recovery and heat generation during plastic deformation by Zhou, M, Clode, M.P

“…The flow softening of metals at elevated temperatures is modelled in this paper based on the theory of viscoplasticity. A single internal state variable…”
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Dissolution and interfacial reaction of Nb in contact with the molten 52In–48Sn solder by Li, J.F., Mannan, S.H., Clode, M.P., Johnston, C., Crossley, A.

“…The dissolution and interfacial reaction of Nb in contact with the molten 52In–48Sn solder has been investigated in the temperature range 192–260 °C for…”
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Lifetime of solid metals in contact with liquid solders for high-temperature liquid solder assemblies by Li, J.F., Mannan, S.H., Clode, M.P.

“…The rates of barrier layer thickness losses for Ni, Cu, Pt, Ti, V, Nb, Ta and W metallizations in contact with the molten 52In–48Sn solder at 200 °C have been…”
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Thermal analysis of the torsion test under hot-working conditions by Zhou, M., Clode, M.P.

“…It is important to estimate the temperature changes in material testing so that the interpretation of test data can be improved and the derived constitutive…”
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Hot torsion tests to model the deformation behavior of aluminium alloys at hot working temperatures by Zhou, M, Clode, M.P

“…Knowledge of the deformation behavior of aluminium alloys at hot working temperatures is very important for high temperature manufacturing processes such as…”
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A finite element analysis for the least temperature rise in a hot torsion test specimen by Zhou, M, Clode, M.P

“…The temperature distribution in a hot torsion specimen, caused by plastic deformation, is predicted by a finite element analysis with the aim of obtaining an…”
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Prediction of fatigue crack growth in notched members by Ahmad, H.Y., Clode, M.P., Yates, J.R.

“…An elastic-plastic model was used to predict the crack lengths and their growth rate and the fatigue lifetime of notched specimen. The model is based on…”
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THERMAL EFFECTS ON FLOW PROPERTIES OF ALUMINUM ALLOYS by Zhou, M., Ahmad, H. Y., Clode, M. P.

“…The flow properties of aluminum alloys under hot working conditions can be studied by hot torsion testing. However, the properties obtained may be severely…”
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Edge effects in intermetallic compound crystal growth between Nb and molten 52In–48Sn solder by Li, J. F., Mannan, S. H., Clode, M. P.

“…A solder/substrate couple consisting of a Nb substrate and eutectic 52In–48Sn solder shows promise for high-temperature liquid solder interconnects. In this…”
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Benefits of Wheel-Tool Gap Sensing in Conform™ Extrusion Machinery by Khawaja, K, Seneviratne, L, Clode, M P

“…[...] it is shown that machine setup times prior to production can be reduced from 35 to 5 min with active gap sensing…”
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Gap sensing benefits in Conform extrusion machinery by KHAWAJA, K, ALTHOEFER, K, CLODE, M. P, SENEVIRATNE, L. D

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Effects of specimen geometry on temperature rise and flow behavior of aluminium alloys in hot torsion testing by Zhou, M., Clode, M.P.

“…Inappropriate design of the test specimen in hot torsion testing may lead to a high accumulation of heat in the central region of the specimen gauge length and…”
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Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders by Mokhtari, Omid, Roshanghias, Ali, Ashayer, Roya, Kotadia, Hiren R., Khomamizadeh, Farzad, Kokabi, Amir H., Clode, Michael P., Miodownik, Mark, Mannan, Samjid H.

“…The use of nanoparticles to control grain size and mechanical properties of solder alloys at high homologous temperature is explored. It is found that silica…”
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Edge effects in intermetallic compound crystal growth between Nb and molten 52 In - 48 Sn solder by Li, J. F., Mannan, S. H., Clode, M. P.

“…A solder/substrate couple consisting of a Nb substrate and eutectic 52 In - 48 Sn solder shows promise for high-temperature liquid solder interconnects. In…”
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Materials and processes for implementing high-temperature liquid interconnects by Mannan, S.H., Clode, M.P.

“…This paper describes the results of a study investigating liquid solder joints at elevated temperatures (up to 200/spl deg/C). The reactions of eutectic…”
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Benefits of wheel-tool gap sensing in Conform/spl trade/ extrusion machinery by Khawaja, K., Seneviratne, L., Clode, M.P.

“…This paper presents the results from the successful production trials of a gap sensing system for Conform/spl trade/ extrusion machinery and associated…”
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